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| Part No. |
AN-9037
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| OCR Text |
...realize that vias often create voiding, and should carefully study the process design with x-ray inspection of voiding to assure the design is yielding th e expected performance. there are several types of via. blind vias are not rec... |
| Description |
8x8 MLP DriverMOS Packaging
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| File Size |
749.51K /
7 Page |
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it Online |
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| Part No. |
AN-9040
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| OCR Text |
... realize that vias often create voiding, and should carefully study the process design with x- ray inspection of voiding to assure the design is yielding the expected pe rformance. there are several types of via. blind vias are not re... |
| Description |
Power33 Packaging
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| File Size |
299.73K /
7 Page |
View
it Online |
Download Datasheet |
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http://
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| Part No. |
AN-9048
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| OCR Text |
... realize that vias often create voiding, and carefully study the process design with x-ray inspection of voiding to assure the design is yielding the expected pe rformance. there are several types of via. blind vias are not recommend... |
| Description |
6x6 DriverMOS Packaging
|
| File Size |
746.79K /
9 Page |
View
it Online |
Download Datasheet |
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http://
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| Part No. |
AN-9046
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| OCR Text |
... realize that vias often create voiding, and is advised to carefully characterize the pwb and process designs with x-ray inspection to ensure there is not a voiding problem. there are several types of vias that can be used in pwb desig... |
| Description |
Dual Power56 Packaging
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| File Size |
850.15K /
10 Page |
View
it Online |
Download Datasheet |
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