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Amphenol Communications Solutions |
| Part No. |
L77HDC62SD1CH3RC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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INTERFET[InterFET Corporation]
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| Part No. |
NJ30
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| Description |
Silicon Junction Field-Effect Transistor Low-Noise, High Gain Amplifier
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| File Size |
93.78K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L77HDC62SVFC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Socket, 0.76m (30 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDC62SD1CH3F
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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Official Product Page
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INTERFET[InterFET Corporation]
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| Part No. |
NJ30L
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| Description |
Silicon Junction Field-Effect Transistor Low-Noise, High Gain Amplifier
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| File Size |
123.98K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
L177HDC62SD1CO4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 62 Socket, 0.38um (15u\\) Gold, 4-40 Rear Threaded Insert, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HRC62SVFM
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| Description |
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell, 62 Socket, M3 Fixed Front Screwlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HRC62SVF
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| Description |
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell, 62 Socket, 4-40 Fixed Front Screwlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDC62SOL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDC62SD1CH4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Ironwood Electronics
HIROSE ELECTRIC Co., Ltd.
TE Connectivity, Ltd.
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| Part No. |
K42X-A15P/A15S-C15 K42X-A15P/A15S-A4NJ30 K42X-B25P/B25P-BJ30 K42X-C37P/C37P-C30 K42X-C37P/C37P-A4NR30 K42X-A15P/A15S-CR30
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| Description |
15 CONTACT(S), MALE-FEMALE, D SUBMINIATURE CONNECTOR, SOLDER, PLUG-RECEPTACLE ROHS COMPLIANT
25 CONTACT(S), MALE-MALE, D SUBMINIATURE CONNECTOR, SOLDER, PLUG ROHS COMPLIANT
37 CONTACT(S), MALE-MALE, D SUBMINIATURE CONNECTOR, SOLDER, PLUG ROHS COMPLIANT
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| File Size |
1,706.51K /
1 Page |
View
it Online |
Download Datasheet |
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|
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Amphenol Communications Solutions |
| Part No. |
L77HDC62SD1CH3FC309
|
| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDC62SVFM
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Socket, 0.38um (15u\\) Gold, Fixed M3 Front Screwlock, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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