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Amphenol Communications Solutions |
| Part No. |
L717HDC62PC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62POL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Official Product Page
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INTERFET[InterFET Corporation]
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| Part No. |
NJ30
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| Description |
Silicon Junction Field-Effect Transistor Low-Noise, High Gain Amplifier
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| File Size |
93.78K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L717HDC62PD1CO4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350in), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Without Boardlock
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| Tech specs |
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Official Product Page
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INTERFET[InterFET Corporation]
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| Part No. |
NJ30L
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| Description |
Silicon Junction Field-Effect Transistor Low-Noise, High Gain Amplifier
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| File Size |
123.98K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
L777HRC62P
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| Description |
Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 62 Pin, 3.05mm (0.120in) Clear Hole
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62PD1CH3F
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62PD1CH4F
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62P
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62PD1CH4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62PD1CH3FC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62POL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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