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  K66X-C62P-N30 Datasheet PDF File

For K66X-C62P-N30 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    List of Unclassifed Man...
Part No. K66X-A26S-N30 K66X-B44S-N30 K66X-A26P-N K66X-A26P-NJ K66X-A26S-NJ K66X-B44P-NJ K66X-B44S-NJ30 K66X-C62P-NJ30 K66X-E15P-N30 K66X-E15P-NJ30 K66XA26P-NJ30 K66X-E15S-NJ30 K66X-C62S-NJ30 K66X-C62P-N30 K66X-B44P-NJ30 K66X-B44P-N30 K66X-A26S-NJ30 K66X-A26P-N30
Description D-SUBMINIATURE CONNECTORS

File Size 399.94K  /  2 Page

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Amphenol Communications Solutions

Part No. L717HDC62PC309
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Mitsubishi Electric Corporation
Part No. M16C62P M16C62A
Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

File Size 5,362.11K  /  349 Page

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Amphenol Communications Solutions

Part No. L717HDC62POL2C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    M16C_62P M16C62A M16C62P M16C M62P

MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. M16C_62P M16C62A M16C62P M16C M62P
Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

File Size 5,358.07K  /  349 Page

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Amphenol Communications Solutions

Part No. L717HDC62PD1CO4R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350in), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Without Boardlock
Tech specs    

Official Product Page

    M16C62P M16C62PT M16C62P06

Renesas Electronics Corporation
Part No. M16C62P M16C62PT M16C62P06
Description 16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / M16C/60 SERIES

File Size 4,727.11K  /  421 Page

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Amphenol Communications Solutions

Part No. L777HRC62P
Description Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 62 Pin, 3.05mm (0.120in) Clear Hole
Tech specs    

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    VISHAY SEMICONDUCTORS
Part No. BZD27-C30P BZD27-C150P/G1 BZD27-C62P BZD27-C16P BZD27-C6V2P
Description 100 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-219AB
DIODE 150 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-219AB, PLASTIC, SMF, 2 PIN, Transient Suppressor
DIODE 6.2 V, 0.8 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-219AB, PLASTIC, SMF, 2 PIN, Voltage Regulator Diode

File Size 113.58K  /  5 Page

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Amphenol Communications Solutions

Part No. L777HDC62PD1CH3F
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs    

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    N30

EPCOS
Part No. N30
Description Ferrites and accessories

File Size 191.44K  /  6 Page

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Amphenol Communications Solutions

Part No. L717HDC62PD1CH4F
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
Tech specs    

Official Product Page

    4N30

QT Optoelectronics
Part No. 4N30
Description GENERAL PURPOSE 6-PIN PHOTODARLINGTON OPTOCOUPLERS

File Size 140.26K  /  7 Page

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Amphenol Communications Solutions

Part No. L777HDC62P
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

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    Motorola
Part No. 4N30
Description STANDARD THRU HOLE CASE 730A-04

File Size 293.30K  /  7 Page

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Amphenol Communications Solutions

Part No. L717HDC62PD1CH4R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs    

Official Product Page

    4N30

Fairchild Semiconductor
Part No. 4N30
Description GENERAL PURPOSE 6-PIN PHOTODARLINGTON OPTOCOUPLERS

File Size 159.29K  /  8 Page

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Amphenol Communications Solutions

Part No. L717HDC62PD1CH3FC309
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs    

Official Product Page

    Inchange Semiconductor ...
Part No. 5N30
Description Fast Switching Speed

File Size 61.80K  /  2 Page

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Amphenol Communications Solutions

Part No. L777HDC62POL2
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

For K66X-C62P-N30 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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