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  71764-0028 Datasheet PDF File

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    71764-0028 0717640028

Molex Electronics Ltd.
Part No. 71764-0028 0717640028
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, Tin (Sn) Plating

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Renesas Electronics Corporation

Part No. R7S910028CBG#AC0
Description Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MSC60028 MSC60028_IG_DP1S MSC60028_IG_DP2S MSC60028_IG_NP1S MSC60028/IG/DP1S MSC60028/IG/NP1S MSC60028/IG/DP2S

MITEL
Zarlink Semiconductor Inc.
Part No. MSC60028 MSC60028_IG_DP1S MSC60028_IG_DP2S MSC60028_IG_NP1S MSC60028/IG/DP1S MSC60028/IG/NP1S MSC60028/IG/DP2S
Description Power Factor Controller

File Size 530.70K  /  12 Page

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Renesas Electronics Corporation

Part No. 8N3QV01EG-0028CDI
Description Quad-Frequency Programmable VCXO
Tech specs    

Official Product Page

    71764-0008

Molex Electronics Ltd.
Part No. 71764-0008
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Renesas Electronics Corporation

Part No. 8N3QV01EG-0028CDI8
Description Quad-Frequency Programmable VCXO
Tech specs    

Official Product Page

    71764-0114

Molex Electronics Ltd.
Part No. 71764-0114
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.23K  /  5 Page

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Renesas Electronics Corporation

Part No. HA4-5002/883
Description Monolithic, Wideband, High Slew Rate, High Output Current Buffer
Tech specs    

Official Product Page

    71764-0020

Molex Electronics Ltd.
Part No. 71764-0020
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating

File Size 121.14K  /  5 Page

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Renesas Electronics Corporation

Part No. HA2-5002/883
Description Monolithic, Wideband, High Slew Rate, High Output Current Buffer
Tech specs    

Official Product Page

    71764-0108

Molex Electronics Ltd.
Part No. 71764-0108
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.01K  /  5 Page

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Amphenol Communications Solutions

Part No. 10028916-4455P00LF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
Tech specs    

Official Product Page

    71764-0116

Molex Electronics Ltd.
Part No. 71764-0116
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.10K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021121-00028D4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    71764-0118

Molex Electronics Ltd.
Part No. 71764-0118
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 120.86K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021323-00028T8LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 28 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    71764-0120

Molex Electronics Ltd.
Part No. 71764-0120
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 10028916-4444P00LF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
Tech specs    

Official Product Page

    71764-0018

Molex Electronics Ltd.
Part No. 71764-0018
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10028916-4554P00LF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
Tech specs    

Official Product Page

For 71764-0028 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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