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  K66X-C62P-N30 Datasheet PDF File

For K66X-C62P-N30 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    MICROSEMI CORP
Part No. 2N3055
Description 15 A, 60 V, NPN, Si, POWER TRANSISTOR, TO-204AA

File Size 29.18K  /  2 Page

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Amphenol Communications Solutions

Part No. L717HDC62PC309
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    AN3003

M/A-COM Technology Solutions, Inc.
Part No. AN3003
Description Integrating SMT Synthesizer Solutions into Wireless Designs

File Size 45.85K  /  3 Page

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Amphenol Communications Solutions

Part No. L717HDC62POL2C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    2N3053

SEME-LAB[Seme LAB]
Part No. 2N3053
Description MEDIUM POWER SILICON NPN PLANAR TRANSISTOR

File Size 17.56K  /  2 Page

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Amphenol Communications Solutions

Part No. L717HDC62PD1CO4R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350in), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Without Boardlock
Tech specs    

Official Product Page

    New Jersey Semi-Conduct...
Part No. 2N3017
Description 20 STERN AVE SPRINGFIELD,NEW JERSEY 07081 U.S.A

File Size 75.88K  /  1 Page

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Amphenol Communications Solutions

Part No. L777HRC62P
Description Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 62 Pin, 3.05mm (0.120in) Clear Hole
Tech specs    

Official Product Page

    POWEREX INC
Part No. 2N3055
Description 15 A, 60 V, NPN, Si, POWER TRANSISTOR, TO-3

File Size 98.06K  /  1 Page

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Amphenol Communications Solutions

Part No. L777HDC62PD1CH3F
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs    

Official Product Page

    Boca Semiconductor Corp...
Part No. 2N3053
Description GENERAL PURPOSE TRANSISTOR(NPN SILICON)

File Size 40.28K  /  1 Page

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Amphenol Communications Solutions

Part No. L717HDC62PD1CH4F
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
Tech specs    

Official Product Page

    AN3014

M/A-COM Technology Solutions, Inc.
Part No. AN3014
Description Electrical Characterization of the MAAMSS0031 16 dB Gain Application Circuit

File Size 133.81K  /  3 Page

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Amphenol Communications Solutions

Part No. L777HDC62P
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    AN3010

M/A-COM Technology Solutions, Inc.
Part No. AN3010
Description An Examination of Recovery Time of an Integrated Limiter/LNA

File Size 1,004.81K  /  3 Page

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Amphenol Communications Solutions

Part No. L717HDC62PD1CH4R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs    

Official Product Page

    AN3028

M/A-COM Technology Solutions, Inc.
Part No. AN3028
Description ESD Protection of Broadband GaAs CATV & FTTx Amplifiers

File Size 189.99K  /  2 Page

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Amphenol Communications Solutions

Part No. L717HDC62PD1CH3FC309
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs    

Official Product Page

    2N3019

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 2N3019
Description NPN medium power transistor

File Size 47.75K  /  8 Page

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Amphenol Communications Solutions

Part No. L777HDC62POL2
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

For K66X-C62P-N30 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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