K66X-C62P-N30 pdf Datasheet P13 Part Num --- IC-ON-LINE


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K66X-C62P-N30 Datasheet PDF File

For K66X-C62P-N30 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

					API Technologies Corp
Part No.	PN3035
Description	RF AMPLIFIER MODEL
File Size	32.42K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717HDC62PC309
Description	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Continental Device India Limited
Part No.	2N3053
Description	NPN SILICON PLANAR TRANSISTOR
File Size	66.93K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717HDC62POL2C309
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs				Official Product Page

					Central Semiconductor
Part No.	2N3010
Description	NPN MEtal CAN - Saturated Switch
File Size	478.79K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717HDC62PD1CO4R
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350in), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Without Boardlock
Tech specs				Official Product Page

					M/A-COM Technology Solutions, Inc.
Part No.	AN3022
Description	Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch
File Size	212.71K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L777HRC62P
Description	Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 62 Pin, 3.05mm (0.120in) Clear Hole
Tech specs				Official Product Page

					M/A-COM Technology Solutions, Inc.
Part No.	AN3025
Description	Transistor Mounting and Soldering
File Size	25.48K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L777HDC62PD1CH3F
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs				Official Product Page

					American Microsemiconductor Inc.
Part No.	1N3082
Description	1N3082
File Size	1,002.09K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717HDC62PD1CH4F
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
Tech specs				Official Product Page

					Comset Semiconductor
Part No.	2N3055
Description	POWER LINEAR AND SWITCHING APPLICATIONS
File Size	135.91K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L777HDC62P
Description	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs				Official Product Page

					M/A-COM Technology Solutions, Inc.
Part No.	AN3007
Description	ESD / EOS Protection for GaAs MMIC Switches
File Size	42.32K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717HDC62PD1CH4R
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs				Official Product Page

					Panasonic Semiconductor
Part No.	MN3008
Description	2048-Stage Low Noise BBD
File Size	166.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717HDC62PD1CH3FC309
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs				Official Product Page

					Seme LAB
Part No.	2N3056
Description	(2N3055 / 2N3056) Bipolar NPN Device
File Size	39.25K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L777HDC62POL2
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs				Official Product Page

For K66X-C62P-N30 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

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