1 / 4 www.asb.co.kr july 2017 p lerow tm ALN2500 internally matched lna module t he plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satell ite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its uncondition ally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board i n mass production level. parameter unit specifications min typ max frequency range mhz 2480 2520 gain db 27 28 gain flatness db ? 0.3 ? 0.5 noise figure db 1.0 1.05 output ip3 (1) dbm 28 29 s11 / s22 (2) db - 17 / - 12 output p1db dbm 12 1 3 switching time (3) ? sec - supply current ma 30 40 supply voltage v 3.3 impedance ? 50 package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 3 rf in 8 rf out 10 +vcc other s ground ou t line drawing (unit: mm) s 21 = 28.3 db @ 2480 mhz = 27.7 db @ 2520 mhz nf o f 1.0 db over frequency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. ALN2500 asb inc. (top view) (bottom view) solder stenc il area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 2500 mhz, z o.sys = 50 ohm feature s description
2 / 4 www.asb.co.kr july 2017 p lerow tm ALN2500 internally matched lna module s - param e ters noise figure oip3 p1db 2480~2520 mhz +3.3 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr july 2017 p lerow tm ALN2500 internally matched lna module item vol t age s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) cur rent (ma) 3.1 - 14.58 - 9.49 26.33 0.20 1.014 10.04 16.14 20 3.2 - 18.40 - 13.18 27.41 0.35 0.995 11.27 28.69 27 3.3 - 20.84 - 15.85 27.81 0.42 0.971 14.21 30.32 35 3.4 - 21.91 - 17.63 28.25 0.45 0.944 16.19 32.24 43 3.5 - 22.64 - 19.30 28.46 0.46 0.955 17.45 3 3.65 53 3.6 - 22.80 - 20.87 28.62 0.46 0.958 18.35 34.74 63 3.7 - 22.66 - 22.51 28.75 0.46 0.967 18.87 36.02 72 3.8 - 22.19 - 23.88 28.82 0.46 0.960 19.32 36.51 82 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma ) - 40 ? c - 14.56 - 11.67 28.22 0.14 0.613 6.17 13.57 20 - 20 ? c - 16.11 - 13.84 28.77 0.25 0.704 8.15 20.77 24 0 ? c - 17.24 - 15.11 28.79 0.31 0.811 10.74 28.10 28 25 ? c - 19.10 - 16.20 28.63 0.32 0.989 14.02 29.88 34 40 ? c - 19.55 - 16.30 28.46 0.35 1.111 15.05 30 .80 38 60 ? c - 20.07 - 16.70 28.34 0.39 1.202 16.28 31.83 42 80 ? c - 20.66 - 16.83 28.04 0.42 1.307 17.18 32.51 46 100 ? c - 21.18 - 17.01 27.78 0.46 1.447 17.62 32.85 49 rf performance with voltage change rf performance with operating temperature
4 / 4 www.asb.co.kr july 2017 p lerow tm ALN2500 internally matched lna module 1) the tantal capacitor is optional and for bypassi ng the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and b locking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by consider ing the application fr e quency. copyright ? 2007 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assumes no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~18 0 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln series C 13x13mm)
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