1. 2. 3. material content data sheet sales product name ipb180p04p4-03 issued 29. august 2013 ma# MA000892844 package pg-to263-7-3 weight* 1525.31 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 6.489 0.43 0.43 4254 4254 leadframe non noble metal iron 7439-89-6 0.803 0.05 526 inorganic material phosphorus 7723-14-0 0.241 0.02 158 non noble metal copper 7440-50-8 801.714 52.54 52.61 525607 526292 wire non noble metal aluminium 7429-90-5 12.895 0.85 0.85 8454 8454 encapsulation organic material carbon black 1333-86-4 8.694 0.57 5700 plastics epoxy resin - 95.636 6.27 62699 inorganic material silicondioxide 60676-86-0 475.280 31.16 38.00 311595 379994 leadfinish non noble metal tin 7440-31-5 12.317 0.81 0.81 8075 8075 plating non noble metal nickel 7440-02-0 0.269 0.02 177 inorganic material phosphorus 7723-14-0 0.001 0.00 0.02 1 177 solder noble metal silver 7440-22-4 0.116 0.01 76 non noble metal tin 7440-31-5 0.092 0.01 61 non noble metal lead 7439-92-1 4.414 0.29 0.31 2894 3031 heatspreader inorganic material phosphorus 7723-14-0 0.032 0.00 21 non noble metal iron 7439-89-6 0.106 0.01 70 non noble metal copper 7440-50-8 106.210 6.96 6.97 69632 69723 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
