multilayer ceramic chip capacitors 1 of 3 creation date : june 26, 2017 (gmt) cga3e2x7r1h103m080aa tdk item description cga3e2x7r1h103mt**** applications automotive grade feature general general (up to 50v) aec-q200 aec-q200 series cga3(1608) [eia 0603] status production size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 10nf 20% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 3% insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 yes packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : june 26, 2017 (gmt) cga3e2x7r1h103m080aa characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga3e2x7r1h103m080aa esr cga3e2x7r1h103m080aa capacitance cga3e2x7r1h103m080aa dc bias characteristic cga3e2x7r1h103m080aa temperature characteristic cga3e2x7r1h103m080aa(no bias) cga3e2x7r1h103m080aa(dc bias = 25v ) ripple temperature rising cga3e2x7r1h103m080aa(100khz) cga3e2x7r1h103m080aa(500khz) cga3e2x7r1h103m080aa(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : june 26, 2017 (gmt) cga3e2x7r1h103m080aa associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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