? semiconductor components industries, llc, 2014 january, 2014 ? rev. 10 1 publication order number: mm3z2v4t1/d mm3zxxxt1g series, szmm3zxxxt1g series zener voltage regulators 300 mw sod ? 323 surface mount this series of zener diodes is packaged in a sod ? 323 surface mount package that has a power dissipation of 300 mw. they are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. they are well suited for applications such as cellular phones, hand held portables, and high density pc boards. specification features: ? standard zener breakdown voltage range ? 2.4 v to 75 v ? steady state power rating of 300 mw ? small body outline dimensions: 0.067? x 0.049? (1.7 mm x 1.25 mm) ? low body height: 0.035? (0.9 mm) ? package weight: 4.507 mg/unit ? esd rating of class 3 (> 16 kv) per human body model ? aec ? q101 qualified and ppap capable ? szmm3zxxxt1g ? sz prefix for automotive and other applications requiring unique site and control change requirements ? these are pb ? free devices* mechanical characteristics: case: void-free, transfer-molded plastic finish: all external surfaces are corrosion resistant maximum case temperature for soldering purposes: 260 c for 10 seconds leads: plated with pb ? sn or sn only (pb ? free) polarity: cathode indicated by polarity band flammability rating: ul 94 v ? 0 mounting position: any maximum ratings rating symbol max unit total device dissipation fr ? 4 board, (note 1) @ t a = 25 c derate above 25 c p d 300 2.4 mw mw/ c thermal resistance, junction ? to ? ambient r ja 416 c/w junction and storage temperature range t j , t stg ? 65 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. fr ? 4 printed circuit board, single ? sided copper, mounting pad 1 cm 2 . *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1 cathode 2 anode see specific marking information in the device marking column of the electrical characteristics table on page 2 of this data sheet. device marking information device package shipping ? ordering information marking diagram ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. mm3zxxxt1g sod ? 323 (pb ? free) 3,000 / tape & reel http://onsemi.com sod ? 323 case 477 style 1 (note: microdot may be in either location) xx m *date code orientat ion may vary depending upon manufacturing location. xx = specific device code m = date code* = pb ? free package szmm3zxxxt1g sod ? 323 (pb ? free) 3,000 / tape & reel
zener voltage regulator i f v i i r i zt v r v z v f mm3zxxxt1g series, szmm3zxxxt1g series http://onsemi.com 2 electrical characteristics symbol parameter v z reverse zener voltage @ i zt i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk i r reverse leakage current @ v r v r reverse voltage i f forward current v f forward voltage @ i f v z maximum temperature coefficient of v z c max. capacitance @v r = 0 and f = 1 mhz electrical characteristics (t a = 25 c unless otherwise noted, v f = 0.9 v max. @ i f = 10 ma for all types) device* device marking zener voltage (note 2) zener impedance leakage current v z (mv/k) @ i zt c @ v r = 0 f = 1 mhz v z (volts) @ i zt z zt @ i zt z zk @ i zk i r @ v r min nom max ma ma a volts min max pf mm3z2v4t1g 00 2.2 2.4 2.6 5 100 1000 0.5 50 1.0 ? 3.5 0 450 mm3z2v7t1g 01 2.5 2.7 2.9 5 100 1000 0.5 20 1.0 ? 3.5 0 450 mm3z3v0t1g 02 2.8 3.0 3.2 5 100 1000 0.5 10 1.0 ? 3.5 0 450 mm3z3v3t1g 05 3.1 3.3 3.5 5 95 1000 0.5 5 1.0 ? 3.5 0 450 mm3z3v6t1g 06 3.4 3.6 3.8 5 90 1000 0.5 5 1.0 ? 3.5 0 450 mm3z3v9t1g 07 3.7 3.9 4.1 5 90 1000 0.5 3 1.0 ? 3.5 ? 2.5 450 mm3z4v3t1g 08 4.0 4.3 4.6 5 90 1000 0.5 3 1.0 ? 3.5 0 450 mm3z4v7t1g 09 4.4 4.7 5.0 5 80 800 0.5 3 2.0 ? 3.5 0.2 260 mm3z5v1t1g 0a 4.8 5.1 5.4 5 60 500 0.5 2 2.0 ? 2.7 1.2 225 mm3z5v6t1g 0c 5.2 5.6 6.0 5 40 200 0.5 1 2.0 ? 2.0 2.5 200 mm3z6v2t1g 0e 5.8 6.2 6.6 5 10 100 0.5 3 4.0 0.4 3.7 185 mm3z6v8t1g 0f 6.4 6.8 7.2 5 15 160 0.5 2 4.0 1.2 4.5 155 mm3z7v5t1g 0g 7.0 7.5 7.9 5 15 160 0.5 1 5.0 2.5 5.3 140 mm3z8v2t1g 0h 7.7 8.2 8.7 5 15 160 0.5 0.7 5.0 3.2 6.2 135 mm3z9v1t1g 0k 8.5 9.1 9.6 5 15 160 0.5 0.2 7.0 3.8 7.0 130 mm3z10vt1g 0l 9.4 10 10.6 5 20 160 0.5 0.1 8.0 4.5 8.0 130 mm3z11vt1g 0m 10.4 11 11.6 5 20 160 0.5 0.1 8.0 5.4 9.0 130 mm3z12vt1g 0n 11.4 12 12.7 5 25 80 0.5 0.1 8.0 6.0 10 130 mm3z13vt1g 0p 12.4 13.25 14.1 5 30 80 0.5 0.1 8.0 7.0 11 120 mm3z15vt1g 0t 14.3 15 15.8 5 30 80 0.5 0.05 10.5 9.2 13 110 mm3z16vt1g 0u 15.3 16.2 17.1 5 40 80 0.5 0.05 11.2 10.4 14 105 mm3z18vt1g 0w 16.8 18 19.1 5 45 80 0.5 0.05 12.6 12.4 16 100 mm3z20vt1g 0z 18.8 20 21.2 5 55 100 0.5 0.05 14.0 14.4 18 85 mm3z22vt1g 10 20.8 22 23.3 5 55 100 0.5 0.05 15.4 16.4 20 85 mm3z24vt1g 11 22.8 24.2 25.6 5 70 120 0.5 0.05 16.8 18.4 22 80 mm3z27vt1g 12 25.1 27 28.9 2 80 300 0.5 0.05 18.9 21.4 25.3 70 mm3z30vt1g 14 28 30 32 2 80 300 0.5 0.05 21.0 24.4 29.4 70 mm3z33vt1g 18 31 33 35 2 80 300 0.5 0.05 23.2 27.4 33.4 70 mm3z36vt1g 19 34 36 38 2 90 500 0.5 0.05 25.2 30.4 37.4 70 mm3z39vt1g 20 37 39 41 2 130 500 0.5 0.05 27.3 33.4 41.2 45 mm3z43vt1g 21 40 43 46 2 150 500 0.5 0.05 30.1 37.6 46.6 40 mm3z47vt1g 1a 44 47 50 2 170 500 0.5 0.05 32.9 42.0 51.8 40 mm3z51vt1g 1c 48 51 54 2 180 500 0.5 0.05 35.7 46.6 57.2 40 mm3z56vt1g 1d 52 56 60 2 200 500 0.5 0.05 39.2 52.2 63.8 40 mm3z68vt1g 1f 64 68 72 2 240 500 0.5 0.05 47.6 65.6 79.8 35 mm3z75vt1g 1g 70 75 79 2 255 500 0.5 0.05 52.5 73.4 88.6 35 *include sz-prefix devices where applicable. 2. zener voltage is measured with a pulse test current i z at an ambient temperature of 25 c.
mm3zxxxt1g series, szmm3zxxxt1g series http://onsemi.com 3 typical characteristics 80 v z , nominal zener voltage figure 1. effect of zener voltage on zener impedance 10 3.0 z zt , dynamic impedance ( ) 1000 100 10 1.0 t j = 25 c i z(ac) = 0.1 i z(dc) f = 1 khz i z = 1 ma 5 ma v f , forward voltage (v) figure 2. typical forward voltage 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 i f , forward current (ma) 1000 100 10 1.0 150 c 75 c 25 c 0 c c, capacitance (pf) 70 v z , nominal zener voltage (v) figure 3. typical capacitance 1000 100 10 1.0 10 4.0 bias at 50% of v z nom t a = 25 c 0 v bias 1 v bias i r , leakage current ( a) v z , nominal zener voltage (v) figure 4. typical leakage current 1000 100 10 1.0 0.1 0.01 0.001 0.0001 0.00001 70 60 50 40 30 20 10 0 +150 c +25 c ? 55 c 12 v z , zener voltage (v) 100 10 1.0 0.1 0.01 10 8.0 6.0 4.0 2.0 0 t a = 25 c i z , zener current (ma) v z , zener voltage (v) figure 5. zener voltage versus zener current (v z up to 12 v) figure 6. zener voltage versus zener current (12 v to 75 v) 100 10 1 0.1 0.01 10 30 50 70 90 t a = 25 c i z , zener current (ma)
mm3zxxxt1g series, szmm3zxxxt1g series http://onsemi.com 4 typical characteristics temperature ( c) 25 0 100 40 20 0 power dissipation (%) 50 75 100 125 150 80 60 figure 7. steady state power derating
mm3zxxxt1g series, szmm3zxxxt1g series http://onsemi.com 5 package dimensions sod ? 323 case 477 ? 02 issue h 1.60 0.063 0.63 0.025 mm inches scale 10:1 0.83 0.033 2.85 0.112 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* style 1: pin 1. cathode 2. anode h e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. lead thickness specified per l/f drawing with solder plating. 4. dimensions a and b do not include mold flash, protrusions or gate burrs. 5. dimension l is measured from end of radius. note 3 d 1 2 b e a3 a1 a c note 5 l h e dim min nom max millimeters a 0.80 0.90 1.00 a1 0.00 0.05 0.10 a3 0.15 ref b 0.25 0.32 0.4 c 0.089 0.12 0.177 d 1.60 1.70 1.80 e 1.15 1.25 1.35 0.08 2.30 2.50 2.70 l 0.031 0.035 0.040 0.000 0.002 0.004 0.006 ref 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 min nom max inches on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mm3z2v4t1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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