clamp0511z final datasheet rev 5.0 revision date 8/30/2016 1 of 8 semtech features ? high esd withstand voltage: +/-15kv (air) and +/-8kv (contact) per iec 61000-4-2 ? able to withstand over 1000 esd strikes per iec61000- 4-2 level 4 ? ultra-small 0201 package ? protects one data line or power line ? low leakage current: <10na (v r =5v) ? working voltage: +/-5v ? low dynamic resistance: 0.64 (typ) ? solid-state silicon-avalanche technology mechanical characteristics ? slp0603p2x3 package ? pb-free, halogen free, rohs/weee compliant ? nominal dimensions: 0.6 x 0.3 x 0.25 mm ? lead finish: niau ? marking: marking code + dot matrix date code ? packaging: tape and reel applications ? cellular handsets & accessories ? keypads, side keys, audio ports ? portable instrumentation ? digital lines ? mp3 players clamp0511z ultra small clamp? 1 line, 5v esd protection description clamp? tvs diodes are designed to protect sensitive electronics from damage or latch-up due to esd. they features large cross-sectional area junctions for conducting high transient currents. these devices ofer desirable characteristics for board level protection including fast response time, low operating and clamping voltage,and no device degradation. the clamp?0511z is in a 2-pin slp0603p2x3 package. it measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. the leads are fnished with lead-free niau. each device will protect one line operating at 5 volts. it gives the designer the fexibility to protect single lines in applications where arrays are not practical. the combination of small size and high esd surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and tablet pcs. 1 2 package dimension schematic & pin confguration slp0603p2x3 (bottom view) protection products nominal dimensions (mm) 0.320 0 . 620 0.250 0.160 0.355 bsc 0.220 www.semtech.com
clamp0511z final datasheet rev 5.0 revision date 8/30/2016 2 of 8 semtech absolute maximum rating rating symbol value units esd per iec 61000-4-2 (air) (2) esd per iec 61000-4-2 (contact) (2) v esd 15 8 kv operating temperature t j -55 to +125 o c storage temperature t stg -55 to +150 o c electrical characteristics (t=25 o c unless otherwise specifed) parameter symbol conditions min. typ. max. units reverse stand-of voltage v rwm pin1 to 2 or 2 to 1 5 v reverse breakdown voltage v br i t = 1ma, pin 1 to 2 or 2 to 1 6 8.2 9.5 v reverse leakage current i r v rwm = 5v, pin 1 to 2 or 2 to 1 3 50 na clamping voltage v c i pp =1a, tp = 8/20s, pin1 to 2 or 2 to 1 15 v esd clamping voltage 2 v c t p = 0.2/100ns i pp = 4a 11.2 v i pp = 16a 19.4 dynamic resistance 2,3 r dyn t p = 0.2/100ns 0.64 junction capacitance c j v r = 0v, f = 1mhz t = 25 o c 4 7 pf notes 1) measured with a 20db attenuator, 50 ohm scope input impedance, 2ghz bandwidth. esd gun return path connected to esd ground plane. 2) transmission line pulse test (tlp) settings: tp = 100ns, tr = 0.2ns, i tlp and v tlp averaging window: t1 = 70ns to t2 = 90ns. 3) dynamic resistance calculated from i tlp = 4a to i tlp = 16a www.semtech.com
clamp0511z final datasheet rev 5.0 revision date 8/30/2016 3 of 8 semtech typical characteristics insertion loss-s21 clamping voltage vs. peak pulse current (tp=8/20 s) normalized junction capacitance vs. reverse voltage esd clamping (8kv contact per iec 61000-4-2) 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 c j (v r ) / c j (v r =0v) reverse voltage - v r (v) = 0 5 10 15 20 25 30 35 40 45 -10 10 30 50 70 clamping voltage (v) time (ns) t a = c aveorm ic000 -- kv ontat isarge easure it an orrete or 0 scope input impedance, 2ghz esd gun return connected to esd ground plane. -2 0 2 4 6 8 10 12 14 16 18 0 5 10 15 20 25 tlp current (a) tlp voltage (v) -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 -10 10 30 50 70 clamping voltage (v) time (ns) t a = c aveorm ic000 -- - kv ontat isarge easure it an orrete or 0 scope input impedance, 2ghz esd gun return connected to esd ground plane. insertion loss (db) frequency (hz) uc05011z_il 8 8.5 9 9.5 10 10.5 11 11.5 12 0.4 0.6 0.8 1 1.2 clamping voltage - v c (v) peak pulse current - i pp (a) t a = 25 o c waveform 8x20us tlp characteristic (positive pulse) esd clamping (-8kv contact per iec 61000-4-2) www.semtech.com
clamp0511z final datasheet rev 5.0 revision date 8/30/2016 4 of 8 semtech application information assembly guidelines the small size of this device means that some care must be taken during the mounting process to insure reliable - solder joints. the fgure at the right details semtechs recommended mounting pattern. recommended assembly guidelines are shown in table 1. note that these are only recommendations and should serve only as a starting point for design since there are many factors that afect the assembly process. exact manufacturing - parameters will require some experimentation to get the desired solder application. semtechs recommend - edmounting pattern is based on the following design guidelines: land pattern the recommended land pattern follows ipc standards and is designed for maximum solder coverage. detailed dimensions are shown elsewhere in this document. solder stencil stencil design is one of the key factors which will deter - mine the volume of solder paste which is deposited onto the land pad. the area ratio of the stencil aperture will determine how well the stencil will print. the area ratio takes into account the aperture shape, aperture size, and stencil thickness. an area ratio of 0.70 C 0.75 is preferred for the subject package. the area ratio of a rectangular aperture is given as: area ratio = (l * w )/ (2 * (l + w) * t) where: l = aperture length w = aperture width t = stencil thickness semtech recommends a stencil thickness of 0.100mm for this device. the stencil should be laser cut with electrop - olishedfnish. the stencil should have a positive taper of approximately 5 degrees. electro polishing and tapering the walls results in reduced surface friction and better paste release. for small pitch components, semtech recommends a square aperture with rounded corners for consistent solder release. due to the small aperture size, a solder paste with type 4 or smaller particles are recom - mended. assembly parameter recommendation solder stencil design laser cut, electro-polished aperture shape rectangular with rounded corners solder stencil thickness 0.100 mm (0.004") solder paste type type 4 size sphere or smaller solder reflow profile per jedec j-std-020 pcb solder pad design non-solder mask defined pcb pad finish osp or niau 0.20 0.20 0.2 0.22 0.1 stencil aperture mounting pad package recommended mounting pattern www.semtech.com
clamp0511z final datasheet rev 5.0 revision date 8/30/2016 5 of 8 semtech outline drawing - slp0603p2x3 land pattern - slp0603p2x3 controlling dimensions are in millimeters (angles in degrees). notes: 1. aaa n e l e dim a 0.180 0.355 0.140 0.285 0.08 2 0.160 0.32 0.355 bsc millimeters max 0.24 0.265 dimensions min 0.20 nom 0.235 0.22 0 . 250 bottom view b d 0.585 0.655 0.62 bbb 0.10 d e a b aaa c c a seating plane e bbb c a b top view a 1 0.000 0.02 0.025 bxn a1 e/2 2 x l r0 .025 typ this land pattern is for reference purposes only. consult your manufacturing group to ensure your notes: 2. company's manufacturing guidelines are met. 1 . controlling dimensions are in millimeters (angles in degrees). dim y g c millimeters (0.425) 0.675 0.250 0.175 dimensions z x 0.270 y z x g (c) www.semtech.com
clamp0511z final datasheet rev 5.0 revision date 8/30/2016 6 of 8 semtech marking code a tape and reel specifcation - paper tape a date code location (away from sprocket holes) a a note: dots represent date code matrix www.semtech.com
clamp0511z final datasheet rev 5.0 revision date 8/30/2016 7 of 8 semtech tape and reel specifcation-plastic tape ordering information part number qty per reel carrier tape reel size clamp0511z.tft 15,000 paper 7 clamp0511z.tnt 10,000 plastic 7 a date code location (away from sprocke t hole s) a a www.semtech.com
clamp0511z final datasheet 5.0 revision date 8/30/2016 8 of 8 semtech contactfinformation semtechfcorporation 200fflynnfroad,fcamarillo,fcaf93012 phone:f(805)f498-2111,ffax:f(805)f498-3804 www.semtech.com importantfnotice informationfrelatingftofthisfproductfandfthefapplicationforfdesignfdescribedfhereinfisfbelievedftofbefreliable,fhoweverfsuchfinformationfisfprovidedfasfaf guidefonlyfandfsemtechfassumesfnofliabilityfforfanyferrorsfinfthisfdocument,forfforfthefapplicationforfdesignfdescribedfherein.fsemtechfreservesfthefrightf tofmakefchangesftofthefproductforfthisfdocumentfatfanyftimefwithoutfnotice.fbuyersfshouldfobtainftheflatestfrelevantfinformationfbeforefplacingfordersf andfshouldfverifyfthatfsuchfinformationfisfcurrentfandfcomplete.fsemtechfwarrantsfperformancefoffitsfproductsftofthefspecifcationsfapplicablefatftheftimef offsale,fandfallfsalesfarefmadefinfaccordancefwithfsemtechsfstandardftermsfandfconditionsfoffsale.f semtechfproductsfarefnotfdesigned,fintended,fauthorizedforfwarrantedftofbefsuitablefforfusefinflife-supportfapplications,fdevicesf orfsystems,forfinfnuclearfapplicationsfinfwhichftheffailurefcouldfbefreasonablyfexpectedftofresultfinfpersonalfinjury,flossfofflifef orfseverefpropertyforfenvironmentalfdamage.ffinclusionfoffsemtechfproductsfinfsuchfapplicationsfisfunderstoodftofbefundertakenf solelyfatfthefcustomersfownfrisk.fshouldfafcustomerfpurchaseforfusefsemtechfproductsfforfanyfsuchfunauthorizedfapplication,fthefcustomerfshallf indemnifyfandfholdfsemtechfandfitsfofcers,femployees,fsubsidiaries,fafliates,fandfdistributorsfharmlessfagainstfallfclaims,fcostsfdamagesfandfattorneyf feesfwhichfcouldfarise. thefsemtechfnamefandflogofarefregisteredftrademarksfoffthefsemtechfcorporation.fallfotherftrademarksfandftradefnamesfmentionedfmayfbefmarksfandf namesfoffsemtechforftheirfrespectivefcompanies.fsemtechfreservesfthefrightftofmakefchangesfto,forfdiscontinuefanyfproductsfdescribedfinfthisfdocumentf withoutffurtherfnotice.fsemtechfmakesfnofwarranty,frepresentationforfguarantee,fexpressforfimplied,fregardingfthefsuitabilityfoffitsfproductsfforfanyf particularfpurpose.fallfrightsfreserved. ?fsemtechf2015
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