? semiconductor components industries, llc, 2016 october, 2016 ? rev. 4 1 publication order number: murhs160/d murhs160t3g, NRVUHS160VT3G, surhs8160t3g power rectifier features and benefits ? ultrafast 35 nanosecond recovery times ? 175 c operating junction temperature ? high temperature glass passivated junction ? high voltage capability to 600 v ? nrvuhs and surhs8 prefixes for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free and are rohs compliant* applications ? power supplies ? inverters ? free wheeling diodes mechanical characteristics ? case: epoxy, molded ? epoxy meets ul 94 v?0 @ 0.125 in ? weight: 95 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead temperature for soldering purposes: 260 c max. for 10 seconds ? cathode polarity band maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 600 v average rectified forward current (rated v r , t l = 145 c) i f(av) 1.0 a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 15 a operating junction and storage temperature range t j , t stg ?65 to +175 c esd ratings: machine model = c human body model = 3b > 400 > 8000 v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information murhs160t3g smb (pb?free) smb case 403a plastic 2,500 / tape & reel ultrafast rectifier 1.0 amperes 600 volts 1 2 marking diagram www. onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. uh16 = specific device code al = assembly location y = year ww = work week = pb?free package (note: microdot may be in either location) alyww uh16 NRVUHS160VT3G smb (pb?free) 2,500 / tape & reel surhs8160t3g smb (pb?free) 2,500 / tape & reel
murhs160t3g, NRVUHS160VT3G, surhs8160t3g www. onsemi.com 2 thermal characteristics rating symbol value unit maximum thermal resistance, junction?to?lead (note 1) r jl 24 c/w maximum thermal resistance, junction?to?ambient (note 2) r ja 80 c/w 1. mounted with minimum recommended pad size, pc board fr4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on fr4 board. electrical characteristics rating symbol typ max unit maximum instantaneous forward voltage (note 3) (i f = 1.0 a, t c = 25 c) (i f = 1.0 a, t c = 125 c) v f 1.5 1.2 2.4 1.7 v maximum instantaneous reverse current (note 3) (rated dc voltage, t c = 25 c) (rated dc voltage, t c = 125 c) i r 0.18 5.0 20 200 a maximum reverse recovery time (i f = 1.0 a, di/dt = 50 a/ s) (i f = 0.5 a, i r = 1.0 a, i rec = 0.25 a) t rr 25 16 35 30 ns product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 3. pulse test: pulse width = 300 s, duty cycle 2.0%.
murhs160t3g, NRVUHS160VT3G, surhs8160t3g www. onsemi.com 3 typical characteristics 0.1 1 10 0 0.5 1 1.5 2 2.5 3 i f , instantaneous forward current (a) figure 1. typical forward voltage v f , instantaneous forward voltage (v) t j = 150 c t j = 25 c t j = 125 c 0.1 1 10 0 0.5 1 1.5 2 2.5 3 3.5 4 figure 2. maximum forward voltage i f , instantaneous forward current (a) v f , instantaneous forward voltage (v) t j = 25 c t j = 150 c t j = 125 c 1.0e?10 1.0e?09 1.0e?08 1.0e?07 1.0e?06 1.0e?05 1.0e?04 1.0e?03 0 100 200 300 400 500 600 i r , reverse current (a) figure 3. typical reverse current v r , reverse voltage (v) t j = 150 c t j = 125 c t j = 25 c 0 100 200 300 400 500 600 1.0e?10 1.0e?09 1.0e?08 1.0e?07 1.0e?06 1.0e?05 1.0e?04 1.0e?03 i r , maximum reverse current (a) figure 4. maximum reverse current v r , reverse voltage (v) t j = 150 c t j = 25 c t j = 125 c
murhs160t3g, NRVUHS160VT3G, surhs8160t3g www. onsemi.com 4 typical characteristics c, capacitance (pf) 1 10 100 0 20406080100 v r , reverse voltage (v) t j = 25 c 0 1 2 50 60 70 80 90 100 110 120 130 140 150 160 170 180 i f , average forward current (a) figure 5. current derating t c , case temperature ( c) square wave dc figure 6. capacitance 0 1 2 3 4 5 6 7 8 9 10 012345 p fo , average power dissipation (w) i o , average forward current (a) square figure 7. forward power dissipation dc r(t), transient thermal resistance figure 8. thermal response junction?to?ambient t 1 , time (sec) p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 d = 0.6 single pulse d = 0.2 d = 0.1 d = 0.05 d = 0.01 0.01 0.1 1 10 100 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 10 00
murhs160t3g, NRVUHS160VT3G, surhs8160t3g www. onsemi.com 5 package dimensions smb case 403a?03 issue j e b d c l1 l a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension b shall be measured within dimension l1. 2.261 0.089 2.743 0.108 2.159 0.085 mm inches scale 8:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 1.95 2.30 2.47 0.077 inches a1 0.05 0.10 0.20 0.002 b 1.96 2.03 2.20 0.077 c 0.15 0.23 0.31 0.006 d 3.30 3.56 3.95 0.130 e 4.06 4.32 4.60 0.160 l 0.76 1.02 1.60 0.030 0.091 0.097 0.004 0.008 0.080 0.087 0.009 0.012 0.140 0.156 0.170 0.181 0.040 0.063 nom max 5.21 5.44 5.60 0.205 0.214 0.220 h e 0.51 ref 0.020 ref d l1 h e polarity indicator optional as needed on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 murhs160/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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