sfh 4273 rote lumineszenzdiode red emitter lead (pb) free produc t - rohs compliant 2007-06-18 1 wesentliche merkmale ? schwarz eingef?rbtes topled-geh?use typische emissionswellenl?nge 660nm verbesserte abbildungseigenschaften durch absorption der seitenstrahlung gr??e der leuchtquelle 325 m x 325 mt feuchte-empfindlichkeitsstufe 2 nach jedec standard j-std-020c anwendungen miniaturlichtschranken und lichtschranken ber gro?e entfernungen industrieelektronik ?messen/steuern/regeln? sensorik alarm- und sicherungssysteme typ type bestellnummer ordering code strahlst?rkegruppierung 1) ( i f = 50 ma, t p = 20 ms) radiant intensity grouping 1) i e (mw/sr) 1) gemessen bei einem raumwinkel ? = 0.01 sr / measured at a solid angle of ? = 0.01 sr achtung: es wird empfohlen, das bauteil nicht bei extremer luftfeuchtigkeit zu betreiben. ist dies dennoch vorgesehen, setzen sie sich bitte mi t osram os in verbindung attention: it is recommended not to o perate the device under extreme humdity. if this is designated though, please contact osram os. sfh 4273 q65110a2523 > 0.63 (typ. 1.0) features black colored topled-package typical peak wavelength 660nm improved imaging characteristics due to absorption of side emission size of emitting area 325m x 325m moisture sensitivity leve l 2 according to jedec standard j-std-020c applications miniature and long distance photointerrupters industrial electronics for drive and control circuits sensor technology alarm and safety equipment
2007-06-18 2 sfh 4273 grenzwerte ( t a = 25 c) maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebs- und lagertemperatur operating and storage temperature range t op ; t stg ? 40 + 100 c sperrspannung reverse voltage v r 3 v durchlassstrom forward current i f 50 ma sto?strom, = 10 s, d = 0 surge current i fsm 1 a verlustleistung power dissipation p tot 125 mw w?rmewiderstand sperrschicht - umgebung bei montage auf fr4 platine, padgr??e je 16 mm 2 thermal resistance junction - ambient mounted on pc-board (fr4), padsize 16 mm 2 each w?rmewiderstand sperrschicht - l?tstelle bei montage auf metall-block thermal resistance junc tion - soldering point, mounted on metal block r thja r thjs 450 200 k/w k/w
sfh 4273 2007-06-18 3 kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl?nge der strahlung wavelength at peak emission i f = 50 ma, t p = 20 ms peak 660 nm spektrale bandbreite bei 50% von i max spectral bandwidth at 50% of i max i f = 50 ma ? 25 nm abstrahlwinkel half angle ? 60 grad deg. aktive chipfl?che active chip area a 0.106 mm 2 abmessungen der aktiven chipfl?che dimensions of the active chip area l b l w 0.325 0.325 mm2 schaltzeiten, i e von 10% auf 90% und von 90% auf 10%, bei i f = 50 ma, r l = 50 ? switching times, e from 10% to 90% and from 90% to 10%, i f = 50 ma, r l = 50 ? t r , t f 100 ns kapazit?t capacitance v r = 0 v, f = 1 mhz c o 30 pf durchlassspannung forward voltage i f = 50 ma, t p = 20 ms v f 2.1 ( 2.8) v sperrstrom, reverse curr50ma50 maent v r = 5 v i r 0.01 ( 1) a gesamtstrahlungsfluss total radiant flux i f = 50 ma, t p = 20 ms e 5 mw temperaturkoeffizient von i e bzw. e , i f = 50 ma temperature coefficient of i e or e , i f = 50 ma tc i ? 0.4 %/k temperaturkoeffizient von v f , i f = 50 ma temperature coefficient of v f , i f = 50 ma tc v ? 3 mv/k temperaturkoeffizient von , i f = 50 ma temperature coefficient of , i f = 50 ma tc + 0.16 nm/k
2007-06-18 4 sfh 4273 strahlst?rke i e in achsrichtung gemessen bei einem raumwinkel ? = 0.01 sr radiant intensity i e in axial direction at a solid angle of ? = 0.01 sr bezeichnung parameter symbol werte values einheit unit strahlst?rke radiant intensity i f = 50 ma, t p = 20 ms i e > 0.63 (typ. 1.0) mw/sr
sfh 4273 2007-06-18 5 relative spectral emission i rel = f ( ) forward current i f = f ( v f ) single pulse, t p = 20 s radiation characteristics i rel = f ( ?) ohr01869 0 rel 600 20 40 60 80 % 100 nm 650 700 750 v ohr01871 f f 0 3 10 2 10 1 10 10 0 ma v 1 2 3 4 5 6 7 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01660 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120? radiant intensity i e / i e(50ma) = f ( i f ) single pulse, t p = 20 s permissible pulse handling capability i f = f ( t p ), t a = 25 c duty cycle d = parameter ohr01870 10 0 f 1 10 2 10 10 3 ma -2 10 10 -1 10 0 10 1 10 2 e 50 ma e t ohr01872 p 10 -5 s f 10 -4 10 -3 10 -2 10 -1 10 1 10 t t p d = t p t f d = 0.005 0.01 0.02 0.05 ma 4 10 10 3 10 2 1 10 dc 0.5 0.2 0.1 max. permissible forward current i f = f ( t a ) t ohr01461 a 0 f 0 20 40 60 80 100 ?c 20 40 60 80 100 120 ma
2007-06-18 6 sfh 4273 ma?zeichnung package outlines ma?e in mm (inch) / dimensions in mm (inch). geh?use / package topled ? , klarer verguss / topled ? , clear resin anschlussbelegung pin configuration abgeschr?gte ecke: kathode beveled edge: cathode farbe color schwarz black brechungsindex verguss refractive index resin 1.53 1.53 gply6724 0.7 (0.028) 0.9 (0.035) 1.7 (0.067) 2.1 (0.083) 0.12 (0.005) 0.18 (0.007) 0.5 (0.020) 1.1 (0.043) 3.3 (0.130) 3.7 (0.146) 0.4 (0.016) 0.6 (0.024) 2.6 (0.102) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) cathode marking 3.0 (0.118) 3.4 (0.134) (2.4) (0.095) 0.1 (0.004) (typ.) 4?1 a c
sfh 4273 2007-06-18 7 empfohlenes l?tpaddesign reflow l?ten recommended solder pad reflow soldering ma?e in mm (inch) / dimensions in mm (inch) ohlpy970 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) cu-area > 16 mm cu-fl?che > 16 mm 2 2 solder resist l?tstopplack 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) padgeometrie fr improved heat dissipation verbesserte w?rmeableitung paddesign for
2007-06-18 8 sfh 4273 l?tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 reflow l?tprofil fr bleifreies l?ten (nach j-std-020c) reflow soldering profile for lead free soldering (acc. to j-std-020c ) wellenl?ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) ohla0687 0 0 t t ?c s 120 s max 50 100 150 200 250 300 ramp up 100 s max 50 100 150 200 250 300 ramp down 6 k/s (max) 3 k/s (max) 25 ?c 30 s max 260 ?c +0 ?c -5 ?c 245 ?c 5 ?c 240 ?c 255 ?c 217 ?c maximum solder profile recommended solder profile 235 ?c -0 ?c +5 ?c minimum solder profile 10 s min ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangskhlung forced cooling normalkurve standard curve grenzkurven limit curves
sfh 4273 2007-06-18 9 published by osram opto semico nductors gmbh wernerwerkstrasse 2, d-93049 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserv ed. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of tr ansport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support de vice or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered.
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