100% material declaration data sheet PQG44 pk208 (v1.0) october 5, 2006 material declaration data sheet average weight: 0.50052 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.01411 2.81% silicon 7440-21-3 100.00 0.01411 die attach material 0.00352 0.70% siliver 7440-22-4 70.00 0.002467 epoxy (ep) trade secret 20.00 0.000705 anhydride trade secret 10.00 0.000352 mold compound 0.34915 69.67% epoxy resin (ep) trade secret 15.00 0.052373 silica 60676-86-0 85.00 0.296778 leadframe 0.12312 24.57% copper 7440-50-8 98.20 0.118444 nickel 7440-02-0 3.00 0.003694 silicon 7440-21-3 0.65 0.00800 magnesium 7440-95-4 0.15 0.000185 leadframe plating 0.001440 0.29% silver 7440-22-4 100.00 0.001440 bond wire 0.00101 0.20% gold 7440-57-5 100.00 0.00101 ext. plating 0.00817 1.76% tin 7440-31-5 100.00 0.00817 pk208 (v1.0) october 5, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? PQG44 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 10/5/06 1.0 initial release. pk208 (v1.0) october 5, 2006
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