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s pe - 13 - 8 - 031/ g /ss page 1 of 14 sggp.25.4.a.02 specification model no. : sggp.25.4.a.02 product name : gps/glonass /galileo smt patch antenna features : 25 m m* 25 mm* 4 .5 mm single feed smt mount gps /galileo : 1575mhz glonass: 1602mhz patent pending rohs compliant
s pe - 13 - 8 - 031/ g /ss page 2 of 14 sggp.25.4.a.02 1. introduction this ceramic 25mm gp s/glonass /galileo patch antenna is mounted via smt process and has been pre - tuned for a 50 *5 0 mm ground plane. custom part no's tuned for different ground - plane or layout positions and tak ing into account the specific conditions in your device can be created and supplied by taoglas. 2. specification original patch specification tested on 50 * 50 mm ground plane no parameter specification notes 1 range of receiving frequency gps /galileo : 157 5.42 mhz 1.023 mhz glonass: 1602 5 mhz 2 center frequency 1592 3mhz with 50*50 mm ground plane 3 bandwidth 8mhz min return loss < - 10 db 4 vswr 1.5 max center frequency 5 gain at zenith gps /galileo : - 0.14dbic typ. glonass: 1.75dbic typ. 8 polariza tion rhcp 9 impedance 50 ohms 10 frequency temperature coefficient f 0 20ppm / oc - 40oc to +85oc 11 operating temperature - 40 ? c to + 85 ? c **changes in user groundplane and environment will offset centre frequency
s pe - 13 - 8 - 031/ g /ss page 3 of 14 sggp.25.4.a.02 3. electrical specifications 3.1. return loss, swr, impedance, measured on the test fixture
s pe - 13 - 8 - 031/ g /ss page 4 of 14 sggp.25.4.a.02 4. radiation patterns 4.1. 1575mhz
s pe - 13 - 8 - 031/ g /ss page 5 of 14 sggp.25.4.a.02 4.2. 1602 mhz
s pe - 13 - 8 - 031/ g /ss page 6 of 14 sggp.25.4.a.02 5. mechanical specifications 5.1. antenna dimensions and drawing
s pe - 13 - 8 - 031/ g /ss page 7 of 14 sggp.25.4.a.02 5.2. footprint copper keepout area
s pe - 13 - 8 - 031/ g /ss page 8 of 14 sggp.25.4.a.02 5.3. paste area
s pe - 13 - 8 - 031/ g /ss page 9 of 14 sggp.25.4.a.02 5.4. soder mask (negative)
s pe - 13 - 8 - 031/ g /ss page 10 of 14 sggp.25.4.a.02 5.5. footprint composite
s pe - 13 - 8 - 031/ g /ss page 11 of 14 sggp.25.4.a.02 5.6. test jig and dimension sggpd.25a
s pe - 13 - 8 - 031/ g /ss page 12 of 14 sggp.25.4.a.02 5.7. sggpd.25a
s pe - 13 - 8 - 031/ g /ss page 13 of 14 sggp.25.4.a.02 6. recommended reflow soldering profile sggp.25 a can be assembled following pb - free assembly. according to the standard ipc/jedec j - std - 020c, the temperature profile suggested is as follow: phase profile features pb - free assembly (snagcu) preheat temperature min(tsmin) temperature max(tsmax) time(ts) from (tsmin to tsmax) 150c 200c 60 - 120 seconds ramp - up avg. ramp - up rate (tsmax to tp) 3c/second(max) reflow temperature(tl) total time above tl (tl) 2 17c 30 - 100 seconds peak temperature(tp) time(tp) 260c 2 - 5 seconds ramp - down rate 3c/second(max) time from 25c to peak temperature 8 minutes max. composition of solder paste 96.5sn/3ag/0.5cu solder paste model shenmao pf606 - p26 soldering iron condition: soldering iron temperature 270c10c. apply preheating at 120c for 2 - 3 minutes. finish soldering for each terminal within 3 seconds, if soldering iron temperature over270c10c or 3 seconds, it will make cause component surfac e peeling or damage.
s pe - 13 - 8 - 031/ g /ss page 14 of 14 sggp.25.4.a.02 7. packaging taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. taoglas reserves all rights to this document an d the information contained herein. reproduction, use or disclosure to third parties without express permission is strictly prohibited. copyright ? taoglas ltd.

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