- patented trench schottky technology - excellent high temperature stability - low forward voltage - low power loss/ high efficiency - high forward surge capability molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test symbol unit v rrm v dv/dt v/ s v br v i f = 15a t j = 25c i f = 15a t j = 125c t j = 25c a t j = 125c ma r jc c/w t j c t stg c document number: ds_d1412008 version: f14 v 0.45 instantaneous forward voltage per diode ( note1 ) - 0.450 breakdown voltage ( i r =1.0ma ) - tsf30u45c maximum repetitive peak reverse voltage 15 trench schottky rectifier tsf30u45c taiwan semiconductor weight: 1.7g (approximately) features maximum ratings and electrical characteristics (t a = 25c unless otherwise noted) ito-220ab 150 500 10000 - i fsm - 250 v f typical applications trench schottky barrier rectifier are designed for high frequency miniature switched mode power supplies such as adapters, lighting and on-board dc/dc converters. a param eter i f(av) typical thermal resistance per diode 4 i r instantaneous reverse current per diode at rated reverse voltage 100 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec per device case: ito-220ab maximum average forward rectified current polarity: as marked - note 1: pulse test with pulse width = 300 s, 1% duty cycle operating junction temperature range storage temperature range - 55 to +150 isolation voltage from terminal to heatsink t = 1 min v ac 0.50 0.415 - 55 to +150 - halogen-free according to iec 61249-2-21 definition min. -50 mechanical data mounting torque: 0.56 nm max. 45 1500 v a 45 30 per diode voltage rate of change (rated vr) peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode typ. max.
document number: ds_d1412008 version: f14 part no. part no. packing code packing code suffix tsf30u45c c0g packing code tsf30u45c c0 tsf30u45c taiwan semiconductor tsf30u45c c0 g (t a = 25c unless otherwise noted) ordering information example ratings and characteristics curves preferred part no. 50 / tube packing ito-220ab package green compound description packing code suffix g 0.001 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 t j =25 c t j =100 c t j =125 c instantaneous reverse current (ma) percent of rated peak reverse voltage (%) t j =150 c 100 1000 10000 0.1 1 10 100 f=1.0mhz vslg=50mvp-p capacitance (pf) reverse voltage (v) fig. 4 typical junction capacitance 0.01 0.1 1 10 100 0 0.2 0.4 0.6 t j =25 c t j =125 c t j =150 c t j =100 c fig. 2 typical forward characteristics instantaneous forward current (a) forward voltage (v) 0 5 10 15 20 0 255075100125150 with heatsink 3in x 5in x 0.25in al-plate fig.1 forward current derating curve average forward current (a) case temperature ( o c) fig. 3 typical reverse characteristics
package outline dimensions min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.16 0.098 0.124 c 2.30 2.96 0.091 0.117 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.95 1.45 0.037 0.057 i 0.50 0.90 0.020 0.035 j 2.40 3.20 0.094 0.126 k 14.80 15.50 0.583 0.610 l - 4.10 - 0.161 m 12.60 13.80 0.496 0.543 n - 1.45 - 0.057 o 2.41 2.67 0.095 0.105 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1412008 version: f14 tsf30u45c taiwan semiconductor marking diagram dim. unit (mm) unit (inch) ito-220ab
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1412008 version: f14 tsf30u45c taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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