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product structure silicon monolithic integrated circuit this product is not designed for protection against radioactive rays . 1/25 tsz02201-0g1g0an00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 5.jun.2015 rev.004 tsz22111 ? 14 ? 001 datashee t www.rohm.com ldo regulators with voltage detector 200ma / 300ma output ldo regulator with 2ch reset bd4269fj-c bd4269efj-c general description bd4269fj-c bd4269efj-c are a low quiescent voltage regulator with 45v absolute maximum voltage allowing usage in battery direct-connected systems. ic integrates power on and under-voltage reset and input voltage reset for vcc or other voltages. quiescent current is minimized to opt imize the system current consumption. offers select ion of the output current between 200 ma or 300 ma depending on the application. power on and under-voltage reset and input voltage reset threshold voltage can be adjusted by external resistance. power on and under-voltage reset delay time can programmed set by external capacitor. features ? aec-q100 qualifies (note 1) ? low esr ceramic capacitors applicable for output. ? low drop voltage: pdmos output transistor ? power on and under-voltage reset ? sense input comparator for vcc or other voltage ? adjustable power on and under-voltage reset and sense input comparator by external resistance ? programmable reset delay time by external capacitor. (note 1: grade 1) applications ? onboard vehicle device (body-control, car stereos, satellite navigation system, etc.) key specifications ? qualified for automotive applications ? input voltage range: -0.3 to +45 v ? low quiescent current: 70 a (typ) ? output load (bd4269fj-c): 200 ma (bd4269efj-c) 300 ma ? output voltage: 5.0 v 2 % ? power on and under-voltage reset detect voltage: 4.62 v 2.6 % (adjusting detect voltage accuracy:3 %) ? over current protection (ocp) ? thermal shut down (tsd) packages w (typ) x d (typ) x h (max) ? fj: sop-j8 4.90 mm x 6.00 mm x 1.65 mm ? efj htsop-j8 4.90 mm x 6.00 mm x 1.00 mm typical application circuits ? vcc and vo pin capacitors: 0.1 f c in (typ), 6 f c o (min) please refer to the "selection of co mponents external ly connected". < using si and radj > < not using si and radj > vcc si v in ct so ro vo gnd sen se ou tput reset output 5v output radj c in c o vcc si v in ct so ro vo gnd sen se ou tput reset output 5v output radj c in c o downloaded from: http:///
2/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 pin configurations pin description block diagram pin no. symbol function 1 vcc supply voltage input 2 si sense input ; if not needed, connect to vo. 3 radj power on and under-voltage reset threshold adjust ; if not needed, connect to gnd. 4 ct power on and under-voltage reset delay; connect capacitor to gnd for setting delay time. 5 gnd ground 6 ro power on and under-voltage reset output ; the open-collector output is internally linked to vo via a 24 k ? pull-up resistor. keep open, if not needed. 7 so input voltage reset output ; the open-collector output is internally linked to vo via a 24 k ? pull-up resistor. keep open, if not needed. 8 vo 5 v output sop-j8 (top view) 8 7 6 5 1 2 3 4 htsop-j8 (top view) 8765 12 3 4 vcc reference vo error amplifier reference ct uvlo radj ro si so vo gnd downloaded from: http:///
3/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 description of blocks block name function description of blocks reference reference voltage the reference generates the reference voltage error amplifier error amplifier the error amplifier amplifies the difference between the feedback voltage of the output voltage and the reference voltage tsd thermal shutdown protection the tsd protect the devic e from overheating. if the chip temperature (tj) reaches ca. 175 c (typ), the output is turned off. ocp over current protection the ocp protect the device from damage caused by over current. uvlo under voltage lock out the uvlo prevents malfunction of the reset block in case of very low output voltage. downloaded from: http:///
4/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol ratings unit vcc input voltage (note 1) v cc -0.3 to + 45.0 v radj input voltage v radj -0.3 to +7.0 ( v o +0.3) v ro input voltage r o -0.3 to +7.0 ( v o +0.3) v vo input voltage v o -0.3 to +7.0 ( v o +0.3) v so input voltage s o -0.3 to +7.0 ( v o +0.3) v si input voltage v si -0.3 to +45.0 ( v cc +0.3) v power dissipation (sop-j8) (note 2) pd 0.80 w (htsop-j8) (note 3) 0.96 w junction temperature range tj -40 to + 150 c storage temperature range tstg -55 to + 150 c (note 1) not to exceed pd. (note 2) reduced by 6.45 mw / c over ta = 25 c, when mounted on glass epoxy board: 114.3 mm x 76.2 mm x 1.6 mm. (note 3) reduced by 7.69 mw / c over ta = 25 c, when mounted on glass epoxy board: 114.3 mm x 76.2 mm x 1.6 mm. caution: exceeding the absolute maximum rating for supply volt age, operating temperature or other parameters can result in dam ages to or destruction of the chip. in this event it also becomes impossible to de termine the cause of the damage (e .g. short circuit, open circuit, etc.). therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety mea sures, such as adding fuses, should be considered. recommended operating conditions (-40 c tj +150 c) parameter symbol min max unit supply voltage (i o 100ma) (note 1) v cc 5.5 45.0 v supply voltage (i o 200ma) (note 1) v cc 6.0 45.0 v start up voltage v cc 3.0 - v vo operating voltage for ro v opr 1.0 - v vo operating voltage for so v ops 3.5 - v power on and unde r -voltage reset switching threshold adjustable range v rtadj 3.5 4.5 v si input voltage v si 0 v cc v radj input voltage v radj 0 v o v output current (sop-j8) i o 0 200 ma (htsop-j8) 0 300 ma operating temperature range ta -40 +125 c (note 1) not to exceed pd. downloaded from: http:///
5/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 thermal characteristics (note 1) parameter symbol typ. unit conditions sop-j8 junction to ambient ja 155 c / w 1s (note 2) 87 c / w 2s2p (note 3) junction to top center of case (note 4) jt 15 c / w 1s (note 2) 13 c / w 2s2p (note 3) htsop-j8 junction to ambient ja 130 c / w 1s (note 2) 34 c / w 2s2p (note 3) junction to top center of case (note 4) jt 15 c / w 1s (note 2) 7 c / w 2s2p (note 3) (note 1) the thermal impedance is based on jesd51 - 2a (still - air) standard. (note 2) jesd51 - 3 standard fr4 114.3 mm x 76.2 mm x 1.57 mm 1 - layer (1s) (top copper foil: rohm recommended foot print + wiring to measure, 2 oz. copper.) (note 3) jesd51 - 5 / - 7 standard fr4 114. 3 mm x 76.2 mm x 1.60 mm 4 - layer (2s2p) (top copper foil: rohm recommended footprint + wiring to measure / 2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm x 74.2 mm, copper (top & reverse side / inner layers) 2oz. / 1oz.) (note 4) t t : top center of cases (mold) temperature downloaded from: http:///
6/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified, tj = -40 c to +150 c, v cc = 13.5 v) parameter symbol limits unit conditions min typ max circuit current i cc - 70 150 a i o = 0 ma to 200 ma output voltage v q 4.90 5.00 5.10 v 1 ma i o 100 ma 6 v v cc 16 v dropout voltage ? vd - 0.25 0.50 v v cc = 4.75 v, i o = 100 ma load regulation reg.l - 10 30 mv i o = 10 ma to 100 ma line regulation reg.i - 10 30 mv v cc = 8 v to 16 v, i o = 1 ma current limit bd4269fj-c i ocp 200 - - ma - bd4269efj-c 300 - - ma - thermal shut down temperature t tsd - 175 - c - electrical characteristics (power on and under-voltage reset) (unless otherwise specified, tj = -40 c to +150 c, v cc = 13.5 v) parameter symbol limits unit conditions min typ max power on and under-voltage reset switching threshold v rt 4.50 4.62 4.74 v - power on and under-voltage reset switching hysteresis v rhy 20 60 100 mv - radj switching threshold v radj,th 0.776 0.800 0.824 v 3.5 v vo 4.5 v radj input current i radj -1 0 +1 a v radj = 2 v ro pull-up resistance r ro 10 24 40 k ? - ct threshold high v cth - 1.20 - v - ct threshold low v ctl - 0.25 - v - ct charge current i ct 5 12 20 a v ct = 0.5 v delay time l h (power on reset time) t dlh 17 22 28 ms c ct = 0.22 f (note 1) (note 1) t dlh can be varied by changing the ct capacitance value. ( 0.001f to 10 f available ) t dlh (ms) t dlh0 (delay time l h at c ct = 0.22 f ) c ct ( f) / 0.22 c ct : 0.1f c ct 10 f example: when c ct = 2.2f, 170ms t por 280 ms t dlh (ms) t dlh0 ( delay time l h at c ct = 0.22 f ) c ct ( f) / 0.22 0.1 c ct : 0.001f c ct < 0.1 f example: when c ct = 0.022f, 1.6ms t dlh 2.9 ms electrical characteristics (input voltage reset) (unless otherwise specified, tj = -40 c to 150 c, v cc = 13.5 v) parameter symbol limits unit conditions min typ max si threshold high v sih 0.80 0.87 0.94 v - si threshold low v sil 0.75 0.80 0.85 v - so pull-up resistance r so 10 24 40 k ? - si input current i si -1 0 +1 a v si = 2 v downloaded from: http:///
7/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves (unless otherwise specified, tj = 25 c, v cc = 13.5 v) 4.90 4.95 5.00 5.05 5.10 -40 0 40 80 120 output voltage: v o [v] junction temperature : tj [ ] 150 figure 1. output voltage vs. supply voltage (r l = open) figure 2. output voltage vs. supply voltage (at low supply voltage: r l = open) figure 3. output voltage vs. junction temperature (r l = 1 k ? ) figure 4. circuit current vs. supply voltage 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 50 output voltage: v o [v] supply voltage: v cc [v] 0 1 2 3 4 5 6 024681 0 output voltage: v o [v] supply voltage: v cc [v] tj = -40 c tj = 25 c tj = 125 c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 25 30 35 40 45 50 circuit current: i cc [m a] supply voltage: v cc [v] downloaded from: http:///
8/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 0 20 40 60 80 100 0 50 100 150 200 250 300 circuit current: i cc [ a] output current : i o [ma] typical performance curves (unless otherwise specified, tj = 25 c, v cc = 13.5 v) -continued 0 30 60 90 120 150 -40 0 40 80 120 circuit current: i cc [ a] junction temperature : tj [ ] 150 figure 7. output voltage vs. output current (over current protection) bd4269efj-c 300 ma bd4269fj-c 200 ma figure 5. circuit current vs. output current figure 6. circuit current vs. junction temperature figure 8. output current vs. junction temperature 0 1 2 3 4 5 6 0 100 200 300 400 500 600 output voltage: v o [v] output current: i o [m a] tj = -40 c tj = 25 c tj = 125 c 0 100 200 300 400 500 600 -40 0 40 80 120 output current: i o [m a] junction temperature : tj [ ] 150 downloaded from: http:///
9/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 0 100 200 300 400 500 600 700 800 0 50 100 150 200 250 300 dropout voltage: ? vd [mv] output current: i o [ma] tj = -40 c tj = 25 c tj = 125 c typical performance curves (unless otherwise specified, tj = 25 c, v cc = 13.5 v) -continued 4.3 4.4 4.5 4.6 4.7 4.8 -40 0 40 80 120 power on and under-voltage reset switing threshold and hysteresis: v rt , v rhy [v] junction temperature : tj [ ] t+y t 150 bd4269efj-c 300 ma bd4269fj 200 ma figure 9. dropout voltage vs. output current (v cc = 4.75 v) () figure 10. output voltage vs. junction temperature (thermal shut down) figure 11. ro voltage vs. vo voltage figure 12. power on and under-voltage reset switing threshold and hysteresis vs. junction temperature 0 1 2 3 4 5 6 100 125 150 175 200 output voltage: v o [v] junction temperature: tj [c] 0 1 2 3 4 5 6 0123456 ro voltage : v ro [v] vo voltage : v o [v] tj = -40 c tj = 25 c tj = 125 c downloaded from: http:///
10/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves (unless otherwise specified, tj = -40 c to 150 c, v cc = 13.5 v) -continued 0.01 0.1 1 10 100 1000 10000 0.001 0.01 0.1 1 10 delay time l h: t dlh [ms] ct capacitance : c ct [ f] 17 19 21 23 25 27 -40 0 40 80 120 delay time l h: t dlh [m s] junction temperature : tj [ ] 150 28 0.60 0.65 0.70 0.75 0.80 0.85 0.90 -40 0 40 80 120 radj switcting threshold : v radj,th [v] junction temperature : tj [ ] 150 figure 13. delay time l h vs. junction temperature (c ct = 0.22 f) figure 14. delay time l h vs. ct capacitance figure 15. ro voltage vs. radj voltage figure 16. radj switching threshold vs. junction temperature 0 1 2 3 4 5 6 0.0 0.2 0.4 0.6 0.8 1.0 ro voltage : v ro [v] radj voltage : v radj [v] tj = -40 c tj = 25 c tj = 125 c downloaded from: http:///
11/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves (unless otherwise specified, tj = -40 c to 150 c, v cc = 13.5 v) -continued 0.60 0.65 0.70 0.75 0.80 0.85 0.90 -40 0 40 80 120 si threshold : v sih , v sil [v] junction temperature : tj [ ] l 150 0 1 2 3 4 5 6 0 . 00 . 20 . 40 . 60 . 81 . 0 so voltage : v so [v] si voltage : v si [v] tj = -40 c tj = 25 c tj = 125 c figure 17. so voltage vs. si voltage figure 18. si threshold vs. junction temperature downloaded from: http:///
12/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 measurement circuit for typical performance curves measurement circuit for figure 1, 2, 3, 4, 6, 10 measurement circuit for figure 7, 8 measurement circuit for figure 5 measurement circuit for figure 15, 16 measurement circuit for figure 17, 18 measurement circuit for figure 9 measurement circuit for figure 11, 12 measurement circuit for figure 13, 14 downloaded from: http:///
13/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 timing chart 1. power on and under-voltage reset (radj is connected to gnd) 2. input voltage reset . t tl t v cc v o v ct v ro (1) v rec = v rt + v rhy (2) v ru = 2 to 3.5 v (3) when radj is used, v rt = v rtadj , v rec = v rtadj + v rhy v o v so v si v sih v sil 0 v 0 v 5 vv o 0 v v ru downloaded from: http:///
14/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 selection of components externally connected ? vcc pin capacitor insert capacitors with a capacitance of 0.1 f or higher between the vcc and gnd pin. we recommend using ceramic capacitor generally featuring good high frequency char acteristic. when selecting a ceramic capacitor, please be consider about temperature and dc - biasing characterist ics. place capacitors closest possible to vcc - gnd pin. when input impedance is high, e.g. in ca se there is distance from battery, line voltage drop needs to be prevented by large capacitor. choose the capacitance according to t he line impedance between the power smoothing circuit and the vcc pin. selection of the capacitance also depends on the applications. verify the application and allow sufficient margins in the design. we recommend using a capacitor with excellent voltage and temperature characteristics. ? output pin capacitor in order to prevent oscillation, a c apacitor needs to be placed between the output pin and gnd pin. we recommend using a ceramic capacitor with a capacitance of 6 f or higher. in selecting the capacitor, ensure that the capacitance of 6 f or higher is maintained at the intended applied voltage and temperature rang e. due to changes in temperature the capacitor's c apacitance can fluctuate possibly resulting in oscillation. in actual applications the stable op erating range is influenced by the pcb impedance, input supply impedance and load impedance. therefore verifica tion of the final operating environment is needed. when selecting a ceramic capacitor, we recommend using x7r or better components with excellent temperature and dc - biasing characteristics and high voltage tolerance. in case of the transient input voltage and the load current fluctuation, output voltage ma y fluctuate. in case this fluctuation can be problematic for the applicati on, connect low esr capacitor (capacitance > 6 f, esr < 1 ? ) in paralleled to large capacitor with a capacitance of 13 f or higher and esr of 5 ? or lower. electrolytic and tantalum capacitors can be used as large capacitor . when selecting an electrolytic capacitor, please consider about increasing esr and decreasing capacitance at cold temperature. place the capacitor closest possible to output pin. ? radj pin power on and under-voltage reset threshold is changed by connecting external resister r1 and r2 in figure 19.the available resister range is from , (r1 and r2 recommended resistance values are 100 k ? or lower.) power on and under-voltage reset is adjusted in from 3.5v to 4.5v. in case that it is needless to radj pin, it must be short gnd. if it is open, the reset function can be unstable. ? si pin input voltage reset threshold is changed by connecting external resister r3 and r4 in figure 20. the adjusted reset threshold v siadjl and v siadjh can be calculated by following equation. (r3 and r4 recommended resistance values are 100 k ? or lower.) this ic incorporates uvlo circuit to prevent malfunction of the reset block in case of very low output voltage. when uvlo is activated, so is l regardless of si voltage. when si is used, set v o 3.5 v. in case that it is needless to si pin, it must be short vo. if it is open, the reset function can be unstable. figure 19. radj pin configuration method figure 20. si pin configuration method vo r2r1 vref radj vo ro vcc r4r3 vref si vo so downloaded from: http:///
15/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 power dissipation sop-j8 ic mounted on rohm standard board based on jedec. : 1 - layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) board material: fr4 board size: 114.3 mm x 76.2 mm x 1.57 mmt mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended footprint + wiring to measure, 2 oz. copper. : 4 - layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm x 74.2 mm) board material: fr4 board size: 114.3 mm x 76.2 mm x 1.60 mmt mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of pcb : 74.2 mm x 74.2 mm, 1 oz. copper. copper foil area on the reverse side of pcb : 74.2 mm x 74.2 mm, 2 oz. copper. condition : ja = 155 c / w, jt (top center) = 15 c / w condition : ja = 87 c / w, jt (top center) = 13 c / w htsop-j8 ic mounted on rohm standard board based on jedec. : 1 - layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) board material: fr4 board size: 114.3 mm x 76.2 mm x 1.57 mmt mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended footprint + wiring to measure, 2 oz. copper. : 4 - layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm x 74.2 mm) board material: fr4 board size: 114.3 mm x 76.2 mm x 1.60 mmt mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of pcb : 74.2 mm x 74.2 mm, 1 oz. copper. copper foil area on the reverse side of pcb : 74.2 mm x 74.2 mm, 2 oz. copper. condition : ja = 130 c / w, jt (top center) = 15 c / w condition : ja = 34 c / w, jt (top center) = 7 c / w 0.96 w 3.67 w 0 1 2 3 4 5 0 25 50 75 100 125 150 power dissipation: pd[w] ambient temperature: ta [c] figure 21. sop-j8 package data (reference data) 1.43w 0.80 w 0.0 0.5 1.0 1.5 2.0 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd [w] ambient temperature: ta [c] figure 22. htsop-j8 package data (reference data) downloaded from: http:///
16/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 thermal design within this product, the power consumption is decided by the dropout voltage condition, the load current and the circuit current. refer to package data illustrated in figure 21, 22 when using the ic in an environment of ta 25 c. even if the ambient temperature ta is at 25 c, depending on the input vo ltage and the load current, chip junction temperature can be very high. consider the design to be tj tjmax = 150 c in all possible operating temperature range. on the reverse side of the package bd4269efj-c has an exposed heat pad for improving the heat dissipation. should by any condition the maximum junction temperature tjmax = 150 c rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. the therma l impedance in this specification is based on recommended pcb and measurement condition by jedec standard. verify the application and allow sufficient margins in the thermal design by the following method is used to calculate the junction temperature tj. tj can be calculated by either of the two following methods. 1. the following method is used to calculate the junction temperature tj. tj ta p c ja where: tj : junction temperature ta : ambient temperature p c : power consumption ja : thermal impedance (junction to ambient) 2. the following method is also used to calculate the junction temperature tj. tj t t p c jt where: tj : junction temperature t t : top center of cases (mold) temperature p c : power consumption jt : thermal impedance (junction to top center of case) the following method is used to calculate the power consumption pc (w). pc v cc \ v o i o v cc i cc where: p c : power consumption v cc : input voltage v o : output voltage i o : load current i cc : circuit current downloaded from: http:///
17/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ? calculation example (sop-j8) if v cc = 13.5 v, v o = 5.0 v, i o = 50 ma, i cc = 70 a, the power consumption pc can be calculated as follows: p c v cc \ v o i o v cc i cc . v C . v ma . v a . w at the ambient temperature tamax = 85c, the thermal impedance (junction to ambient) ja = 87 c / w ( 4-layer pcb ), tj tamax p c ja c . w c / w . c when operating the ic, the top center of cases (mold) temperature t t = 100 c jt = 15 c / w (1-layer pcb), tj t t p c jt c . w c / w . c for optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad. ? calculation example (htsop-j8) if v cc = 13.5 v, v o = 5.0 v, i o = 50 ma, i cc = 70 a, the power consumption pc can be calculated as follows: p c v cc \ v o i o v cc i cc . v C . v ma . v a . w at the ambient temperature tamax = 85c, the thermal impedance (junction to ambient) ja = 34 c / w (4-layer pcb), tj tamax p c ja c . w c / w . c when operating the ic, the top cent er of cases (mold) temperature t t = 100 c, jt = 15 c / w (1-layer pcb), tj t t p c jt c . w c / w . c for optimum thermal performance, it is recommended to expand the copper foil area of the boar d, increasing the layer and thermal via between thermal land pad. downloaded from: http:///
18/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 i/o equivalence circuits 1 vcc 2 si 3 radj si vcc k ? typ k ? typ pf typ 4 ct 6 ro 7 so ct vo vo k ? typ k ? typ ro ? typ k ? typ vo so ? typ k ? typ vo 8 vo downloaded from: http:///
19/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 application examples ? applying positive surge to the vcc if the possibility exists that surges higher than 45 v will be applied to the vcc, a zener diode should be placed between the vcc and gnd as shown in the figure below. ? applying negative surge to the vcc if the possibility exists that negative su rges lower than the gnd are applied to t he vcc, a shottky diode should be place between the vcc and gnd as shown in the figure below. ? implementing a protection diode if the possibility exists that a large inductive load is connec ted to the output pin resulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. ? reverse polarity diode in some applications, the vcc and the vo potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, t he accumulated charge in the output pin ca pacitor flowing backward from the vo to the vcc when the vcc shorts to the gnd. in order to minimize the damage in such case, use a capacitor with a capacitance less than 1000 f. also by inserting a reverse polarity diode in series to the vcc, it can prevent reverse current from reverse battery connection or the case. when the point a is short-circuited gnd, if there may be any possible case point b is short-circuited to gnd, we also recommend using a bypass diode between the vcc and the vo. vcc vo gnd vcc vo gnd v aiy i ypa i downloaded from: http:///
20/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prev ent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration the power dissipation under actual op erating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. on the re verse side of the package bd4269efj-c has an exposed heat pad for improving the heat dissi pation. use both the front and reverse side of the pcb to increase the heat dissipation pattern as far as possible. the amo unt of heat generated depends on the vo ltage difference across the input and output, load current, and bias current. therefore, when actually using the chip, ensure that the generated heat does not exceed the pd rating. should by any condition the maximum junction temperatur e tjmax = 150 c rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. the thermal impedance in this specification is based on recommended pcb and measurement condition by jede c standard. verify the application and allow sufficient margins in the thermal design. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, powe r wiring, width of ground wiring, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage fr om static discharge, ground the ic during a ssembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. unused input terminals input terminals of an ic are often con nected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left uncon nected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. downloaded from: http:///
21/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes C continued 11. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lowe r than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. thermal shutdown circuit (tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit. downloaded from: http:///
22/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
23/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimension, tape and reel information -continued package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
24/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ordering information b d 4 2 6 9 f j - c e 2 part numbe r package fj: sop-j8 efj: htsop-j8 product rank c:for automotive packaging and forming specification e2: embossed tape and reel marking diagram sop-j8 (top view) d4269 part number marking lot number 1pin mark htsop-j8 (top view) d4269 part number marking lot number 1pin mark downloaded from: http:///
25/25 bd4269fj-c bd4269efj-c datasheet tsz02201-0g1g0an00380-1-2 5.jun.2015 rev.004 www.rohm.com ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 revision history date revision changes 31.jul.2014 001 new release 27.feb.2015 002 bd4269efj-c was added. p1 revised expression on the tittle p1 aec-q100 grade was added. p4, p5, p15, p16 and p17 revised expression on the information of thermal characteristics of sop-j8. p14 revised expression on the information of vcc pin and output pin capacitors. p19 added description on reverse polarity diode. p20 revised expression on the information of thermal consideration. 20.mar.2015 003 p5 a writing error of paragraph of t hermal characteristics was corrected. p15 a writing error of paragraph of power dissipation was corrected. 5.jun.2015 004 p1 the figure of not using si and radj was corrected. p16 description of thermal design was corrected. downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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