1. 2. 3. material content data sheet sales product name bso613spv g issued 29. august 2013 ma# MA000982364 package pg-dso-8-6 weight* 80.96 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.472 3.05 3.05 30529 30529 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 115 non noble metal zinc 7440-66-6 0.037 0.05 458 non noble metal iron 7439-89-6 0.742 0.92 9160 non noble metal copper 7440-50-8 30.114 37.20 38.18 371954 381687 wire noble metal gold 7440-57-5 0.222 0.27 0.27 2745 2745 encapsulation organic material carbon black 1333-86-4 0.227 0.28 2806 inorganic material antimonytrioxide 1309-64-4 0.909 1.12 11223 plastics brominated resin - 0.909 1.12 11223 plastics epoxy resin - 5.225 6.45 64534 inorganic material silicondioxide 60676-86-0 38.164 47.14 56.11 471382 561168 leadfinish non noble metal tin 7440-31-5 0.814 1.01 1.01 10052 10052 plating noble metal silver 7440-22-4 0.541 0.67 0.67 6687 6687 glue plastics epoxy resin - 0.101 0.12 1248 noble metal silver 7440-22-4 0.476 0.59 0.71 5884 7132 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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