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| SOP-8 packaging information reference pattern layout dimension unit: mm packaging information / reference pattern layout dimensions
SOP-8 ` /reel ?`?? /taping specifications ?`?? / ta p in g s p ecifications unit: mm 1,000pcs/reel direction of feed r type :[device orientation : right] standard feed 15.41.0 20.2 130.5 (1.5) 130.2 SOP-8 power dissipation power dissipation data for the SOP-8 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condition (reference data) condition : mount on a board ambient : natural convection soldering : lead (pb) free board : dimensions 40mm40mm 1600mm 2 in one side copper (cu) traces occupy 50% of the board area in top and back faces material : glass epoxy fr-4 thickness : 1.6mm evaluation board (unit: mm) 2. power dissipation vs. ambient temperature board mount ( tjmax=125) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 650 85 260 153.85 rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??` ~? lead frame copper alloy ?I U?`?? lead plating lead(pb) free solder plating ? y?? die attach silver filled epoxy ???? au bonding wire ?? si si ?? `` marking laser marking SOP-8 SOP-8 perspective ver.09 |
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