www.centralsemi.com r3 (4-march 2010) package details hd dip case mechanical drawing mounting pad geometry (dimensions in mm) part marking: 4-5 character alpha/numeric code
www.centralsemi.com r3 (4-march 2010) package details hd dip case tape dimensions and orientation (dimensions in mm) tape width: 12mm devices are taped in accordance with electronic industries association standard eia-481-1-a direction of unreeling reel labeling information each reel is labeled with the following information: central part number, customer part number, purchase order number, quantity, lot number, date code, ship date and marking code. reel packing information ordering information ? for devices taped and reeled on 13 reels, add tr13 suffix to part number. ? all smds are available in small quantities for prototype and manual placement applications. reel size reels per box (maximum) parts per box (maximum) box dimensions shipping weight (max.) inch cm lb kg 13 5 14 26 15,000 42,000 78,000 15x4x15 15x15x9 15x15x18 38x10x38 38x38x23 38x38x46 9 25 46 4 12 21 packaging base 13 reel = 3,000 pcs.
material composition specification hd dip case device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126.8 mg fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% www.centralsemi.com r3 (3-june 2011) component material material substance cas no. substance (%wt) (mg) (%wt) (mg) (ppm) active device doped si 3.38% 4.28 si 7440-21-3 3.38% 4.28 33,754 leadframe cu alloy 33.5% 42.49 cu 7440-50-8 33.44% 42.405 334,424 fe 7439-89-6 0.05% 0.064 505 p 7723-14-0 0.01% 0.018 142 die attach high temperature solder paste 7.16% 9.08 pb 7439-92-1 6.624% 8.399 66,238 sn 7440-31-5 0.358% 0.454 3,580 ag 7440-22-4 0.179% 0.227 1,790 encapsulation* emc 55.48% 70.34 sio 2 14808-60-7 37.72% 47.834 377,240 epoxy resin 29690-82-2 10.54% 13.365 105,402 phenol resin 9003-35-4 5.55% 7.034 55,473 sb 2 o 3 1309-64-4 0.55% 0.703 5,544 br 7726-95-6 1.11% 1.407 11,096 emc green 55.48% 70.34 silica (fused) 60676-86-0 42.72% 54.165 427,169 epoxy resin 29690-82-2 5.55% 7.034 55,473 phenol resin 9003-35-4 5.38% 6.823 53,809 carbon black 1333-86-4 0.17% 0.211 1,664 metal hydroxide 1309-42-8 1.66% 2.11 16,640 plating** tin/lead process 0.48% 0.61 sn 7440-31-5 0.38% 0.488 3,849 pb 7439-92-1 0.10% 0.122 962 matte tin 0.48% 0.61 sn 7440-31-5 0.48% 0.61 4,811 *emc green molding compound is halogen-free. **for lead free plating, add suffix ?lead free? to part number. for tin/lead plating, add suffix ?tin/lead? to part number. no suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. disclaimer the information provided in this material composition data sheet is, to the best of our knowledge, correct. however, there is n o guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
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