SSM6P36TU 2014-03-01 1 toshiba field effect transistor silicon p channel mos type SSM6P36TU power management switches ? 1.5-v drive ? low on-resistance: r on = 3.60 (max) (@v gs = -1.5 v) : r on = 2.70 (max) (@v gs = -1.8 v) : r on = 1.60 (max) (@v gs = -2.8 v) : r on = 1.31 (max) (@v gs = -4.5 v) absolute maximum ratings (ta = 25 c) characteristics symbol rating unit drain-source voltage v dss -20 v gate-source voltage v gss 8 v dc i d -330 drain current pulse i dp -660 ma drain power dissipation p d (note1) 500 mw channel temperature t ch 150 c storage temperature range t stg ?55 to 150 c note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/vol tage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note1: total rating mounted on an fr4 board (25.4 mm 25.4 mm 1.6 mm, cu pad: 645 mm 2 ) marking equivalent circuit (top view) handling precaution when handling individual devices (which are not yet mount ed on a circuit board), ensure that the environment is protected against static electricity. o perators should wear anti-static clothing, and containers and other objects that come into direct contact with devices s hould be made of anti-static materials. usage considerations let v th be the voltage applied between gate and sour ce that causes the drain current (i d ) to below ? 1 ma for the SSM6P36TU). then, for normal switching operation, v gs(on) must be higher than v th, and v gs(off) must be lower than v th. this relationship can be expressed as: v gs(off) < v th < v gs(on). take this into consideration when using the device. unit: mm 0.3-0.05 6 1.70.1 2.10.1 1.30.1 1 2 0.65 0.65 3 2.00.1 5 4 0.70.05 +0.1 0.1660.05 jedec D jeita D toshiba 2-2t1b weight: 7.0 mg (typ.) px 6 5 4 1 2 3 q1 q2 654 123 uf6 1.source1 2.gate1 3.drain2 4.source2 5.gate2 6.drain1 start of commercial production 2008-06
SSM6P36TU 2014-03-01 2 electrical characteristics (ta = 25c) (q1, q2 common) characteristics symbol test conditions min typ. max unit v (br) dss i d = -1 ma, v gs = 0 v -20 ? ? drain-source breakdown voltage v (br) dsx i d = -1 ma, v gs = 8 v -12 ? ? v drain cutoff current i dss v ds = -16 v, v gs = 0 v ? ? -10 a gate leakage current i gss v gs = 8 v, v ds = 0 v ? ? 1 a gate threshold voltage v th v ds = -3 v, i d = -1 ma -0.3 ? -1.0 v forward transfer admittance |y fs | v ds = -3 v, i d = -100ma (note2) 190 ? ? ms i d = -100ma, v gs = -4.5 v (note2) ? 0.95 1.31 i d = -80ma, v gs = -2.8 v (note2) ? 1.22 1.60 i d = -40ma, v gs = -1.8 v (note2) ? 1.80 2.70 drain-source on-resistance r ds (on) i d = -30ma, v gs = -1.5 v (note2) ? 2.23 3.60 input capacitance c iss ? 43 ? output capacitance c oss ? 10.3 ? reverse transfer capacitance c rss v ds = -10 v, v gs = 0 v, f = 1 mhz ? 6.1 ? pf total gate charge q g ? 1.2 ? gate? source charge q gs ? 0.85 ? gate? drain charge q gd v ds = -10 v, i ds = -330ma v gs = -4 v ? 0.35 ? nc turn-on time t on ? 90 ? switching time turn-off time t off v dd = -10 v, i d = -100ma v gs = 0 to -2.5 v, r g = 50 ? 200 ? ns drain-source forward voltage v dsf i d =330ma, v gs = 0 v (note2) ? 0.88 1.2 v note2: pulse test switching time test circuit (c) v out t on 90% 10% ?2.5 v 0 v 90% 10% t off t r t f v ds ( on ) v dd (b) v in v dd = ?10 v duty 1% v in : t r , t f < 5 ns (z out = 50 ) common source ta = 25c in 0 ? 2.5v 10 s v dd out r g r l (a) test circuit
SSM6P36TU 2014-03-01 3 ambient temperature ta (c) v th ? ta gate threshold voltage v th (v) -1.0 0 ? 50 0 150 -0.5 50 100 common source v ds = -3 v i d = -1 ma drain-source on-resistance r ds (on) ( ) gate-source voltage v gs (v) r ds (on) ? v gs ambient temperature ta (c) drain-source voltage v ds (v) i d ? v ds drain current i d (ma) 0 -200 0 -0.5 -1.0 -1.5 -100 -500 -8v common source ta = 25 c -2.8v -4.5v -1.5 v -1.8 v vgs=-1.2 v -2.5v -300 -400 -600 -700 gate-source voltage v gs (v) i d ? v gs drain current i d (ma) -1000 0 -10 -100 -0.1 -1 -0.01 -1.0 -2.0 ? 25 c ta = 100 c 25 c common source v ds = -3 v r ds (on) ? i d drain current i d (ma) drain-source on-resistance r ds (on) ( ) 0 -100 -200 0 5 4 3 2 1 vgs = -4.5 v -2.8 v common source ta = 25c -1.8 v -300 -400 -500 -600 -700 -1.5 v r ds (on) ? ta drain-source on-resistance r ds (on) ( ) 0 ? 50 0 50 150 5 100 4 3 2 1 common source i d = -100ma / v gs = -4.5 v -40ma / -1.8 v -80ma / -2.8 v -30ma / -1.5v 0 -2 -4 -6 0 5 4 -8 3 2 1 ? 25 c ta = 100 c 25 c i d = -100ma common source ta = 25c
SSM6P36TU 2014-03-01 4 total gate charge qg (nc) dynamic input characteristic gate-source voltage v gs (v) 0 0 2 -4 -8 -6 -2 3 1 common source i d = -0.33 a ta = 25c v dd = - 16 v drain current i d (ma) forward transfer admittance ? y fs ? (ms) |y fs | ? i d 10 -1000 100 1000 -10 -100 300 30 -1 common source v ds = -3 v ta = 25c drain-source voltage v ds (v) c ? v ds capacitance c (pf) 1 -0.1 -1 -10 -100 10 100 30 50 3 5 common source ta = 25c f = 1 mhz v gs = 0 v c iss c rss c oss drain reverse current i dr (ma) drain-source voltage v ds (v) i dr ? v ds 1000 0 10 100 0.1 1 0.2 0.6 0.4 1.0 0.8 1.2 ? 25 c ta =100 c 25 c common source v gs = 0 v g d s i dr drain current i d (ma) switching time t (ns) t ? i d 10 -1 1000 -10 10000 -100 -1000 100 t f t on t r common source v dd = -10 v v gs = 0 to -2.5 v ta = 25 c r g = 50 t off v dd =-10v ambient temperature ta (c) p d * ? ta drain power dissipation p d * (mw) 800 0 200 120 100 140 400 600 160 1000 80 60 40 20 0 -20 -40 mounted on fr4 board. (25.4mm 25.4mm 1.6mm , cu pad : 645 mm 2 ) *:total rating dc t=10s
SSM6P36TU 2014-03-01 5 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? 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