 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| process CPD66X low leakage diode low leakage diode chip geometry gross die per 5 inch wafer 54,848 principal device types cmod3003 cmld3003dog cmpd3003a cmpd3003c cmpd3003s process details die size 17.5 x 17.5 mils die thickness 5.9 mils anode bonding pad area 7.9 mils diameter top side metalization al - 30,000? back side metalization au-as - 13,000? www.centralsemi.com r1 (19-july 2010)
process CPD66X typical electrical characteristics www.centralsemi.com r1 (19-july 2010) |
Price & Availability of CPD66X
 |
|||||||||||
|
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |
