acpdqc3v3t -hf smd esd protection diode page 1 features - bi-directional esd protection. - surface mount package. - ultra small smd package:0402 - high component density . mechanical data - case: 0402c/sod-923 standard package, molded plastic. - t erminals: gold plated, solderable per mil-std-750,method 2026. - mounting position: any . - w eight: 0.001 grams(approx.). comchip t echnology co., l td. rev :a aqw -g7006 rohs device halogen free c o m c h i p s m d d i o d e s p e c i a l i s t electrical characteristics (at t a=25 c unless otherwise noted) c o m p a n y r e s e r v e s t h e r i g h t t o i m p r o v e p r o d u c t d e s i g n , f u n c t i o n s a n d r e l i a b i l i t y w i t h o u t n o t i c e . - iec 61000-4-2 30 kv(contact). - esd rating of class 3 per human body model. - esd rating of class 4 machine model. per symbol t yp parameter min max unit junction capacitance conditions leakage current i r ua c t pf v r =0v , f =1mhz 25 0.5 v r wm = 3.3v esd capability kv storage temperature junction temperature 125 c t stg t j c 150 -55 esd iec 61000-4-2(air) iec 61000-4-2(contact) 3 0 30 reverse stand-off voltage v r wm v 3.3 clamping voltage v v c 4.65 <0.02 reverse breakdown voltage v br v i r = 1ma 3.6 4.6 4.2 i pp =1a , tp=8/20us i pp =16a , tp=8/20us 9.8 20 clamping voltage v v cl 6 i pp =5a , tp=100ns i pp =18a , tp= 100ns 8.75 dynamic resistance rdyn ? 0.18 d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) 0 4 0 2 c / s o d - 9 2 3 f 0 . 0 4 1 ( 1 . 0 5 ) 0 . 0 3 7 ( 0 . 9 5 ) 0 . 0 2 6 ( 0 . 6 5 ) 0 . 0 2 2 ( 0 . 5 5 ) 0 . 0 2 2 ( 0 . 5 5 ) 0 . 0 2 2 ( 0 . 5 5 ) 0 . 0 1 8 ( 0 . 4 5 ) 0 . 0 1 2 ( 0 . 3 0 ) 0 . 0 0 8 ( 0 . 2 0 ) 0 . 0 1 8 ( 0 . 4 5 ) 0 . 0 0 1 ( 0 . 0 2 ) m a x . circuit diagram -comply with aec-q101
smd esd protection diode c o m c h i p s m d d i o d e s p e c i a l i s t page 1 comchip t echnology co., l td. rev :a aqw -g7006 c o m p a n y r e s e r v e s t h e r i g h t t o i m p r o v e p r o d u c t d e s i g n , f u n c t i o n s a n d r e l i a b i l i t y w i t h o u t n o t i c e . ra ting and characteristic cur ves (acpdqc3v3t -hf) 1 . 5 6 . 5 - 0 . 5 9 . 5 0 . 5 2 . 5 3 . 5 4 . 5 5 . 5 7 . 5 8 . 5 - 5 0 5 1 0 1 5 2 0 fig. 5 - pin1 t o pin2 v oltage, (v) c u r r e n t , ( a ) fig.6 - pin2 t o pin1 - 5 0 5 1 0 1 5 2 0 1 . 5 6 . 5 - 0 . 5 9 . 5 0 . 5 2 . 5 3 . 5 4 . 5 5 . 5 7 . 5 8 . 5 v oltage, (v) c u r r e n t , ( a ) p o w e r r a t i n g , ( % ) f ig .4 - p o w e r r a ti n g d e r a ti n g c u r v e ambient t emperature, ( c ) 2 0 4 0 6 0 8 0 1 0 0 mounting on glass epoxy pcbs fig.3 - clamping v oltage vs. peak pulse current c l a m p i n g v o l t a g e , ( v ) peak pulse current, (a) 0 4 0 0 2 5 5 0 1 0 0 1 5 0 7 5 1 2 5 1 1 2 0 6 8 1 2 4 7 1 0 1 3 1 6 w aveform parameters: tr=8us td=20us c a p a c i t a n c e b e t w e e n t e r m i n a l s , ( p f ) f i g . 2 - t y p i c a l c a p a c i t a n c e b e t w e e n t e r m i n a l s c h a r a c t e r i s t i c s reverse v oltage, (v) 10 12 14 16 25 0 1 2 3 4 18 t i m e , ( u s ) 0 % 2 0 % 4 0 % 6 0 % 8 0 % 1 0 0 % 0 5 1 5 2 5 3 0 1 0 2 0 1 2 0 % p e r c e n t a g e o f i p p e - t t d = t i p p / 2 t a = 2 5 c p e a k v a l u r i p p t e s t w a v e f o r m p a r a m e t e r s t f = 8 u s t d = 2 0 u s 20 f i g . 1 - 8 / 2 0 u s p e a k p u l s e c u r r e n t wa v e f o r m a c c . i e c 6 1 0 0 0 - 4 - 5 2 1 0
smd esd protection diode c o m c h i p s m d d i o d e s p e c i a l i s t page 3 comchip t echnology co., l td. rev :a aqw -g7006 c o m p a n y r e s e r v e s t h e r i g h t t o i m p r o v e p r o d u c t d e s i g n , f u n c t i o n s a n d r e l i a b i l i t y w i t h o u t n o t i c e . t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed reel t aping specification o 1 2 0 i n d e x h o l e d e f b w p p 0 p 1 a b c d d d 2 d 1 e f p p 0 p 1 t s y m b o l a w w 1 ( m m ) ( i n c h ) 0 . 0 3 0 0 . 0 0 4 s y m b o l ( m m ) ( i n c h ) 0 . 7 5 0 . 1 0 0 4 0 2 c / s o d - 9 2 3 f 0 4 0 2 c / s o d - 9 2 3 f 1 . 1 5 0 . 1 0 0 . 6 0 0 . 1 0 1 . 5 5 0 . 1 0 1 7 8 1 . 0 0 6 0 . 0 m i n . 1 3 . 0 0 . 2 0 0 . 0 4 5 0 . 0 0 4 0 . 0 2 4 0 . 0 0 4 0 . 0 6 1 0 . 0 0 4 7 . 0 0 8 0 . 0 4 2 . 3 6 2 m i n . 0 . 5 1 2 0 . 0 0 8 0 . 0 6 9 0 . 0 0 4 0 . 1 3 8 0 . 0 0 2 0 . 1 5 7 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 4 0 . 0 0 9 0 . 0 0 2 0 . 3 1 5 0 . 0 0 8 0 . 5 3 1 m a x . 1 . 7 5 0 . 1 0 3 . 5 0 0 . 0 5 4 . 0 0 0 . 1 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 1 0 0 . 2 2 0 . 0 5 8 . 0 0 0 . 2 0 1 3 . 5 0 m a x .
page 4 comchip t echnology co., l td. rev :a aqw -g7006 c o m p a n y r e s e r v e s t h e r i g h t t o i m p r o v e p r o d u c t d e s i g n , f u n c t i o n s a n d r e l i a b i l i t y w i t h o u t n o t i c e . smd esd protection diode c o m c h i p s m d d i o d e s p e c i a l i s t suggested p ad layout size (inch) 0.028 (mm) 0.70 0.40 0.70 0.016 0.028 0402c/sod-923f 1.10 0.043 e 0.30 0.012 a b c d a c b e d marking code e3 p a r t n u m b e r a c p d q c 3 v 3 t- h f m a r k i n g c o d e e 3 standard packaging c a s e t y p e 5 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k 0 4 0 2 c / s o d - 9 2 3 f
|
