cystech electronics corp. spec. no. : c229s3 issued date : 2011.10.05 revised date : page no. : 1/6 BTN2369S3 cystek product specification high frequency npn switching transistor BTN2369S3 description ? high transition frequency, f t =500mhz(min) ? high current, i c(max) =200ma ? low saturation voltage, v ce(sat) =0.3v(max) ? pb-free lead plating package symbol outline BTN2369S3 sot-323 b base c collector e emitter absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 40 v collector-emitter voltage v ceo 15 v emitter-base voltage v ebo 4.5 v collector current (dc) i c 200 ma power dissipation pd 300 mw junction temperature tj 150 c storage temperature tstg -55~+150 c note: when mounted on fr-4 pcb with area measuring 50501.6 mm
cystech electronics corp. spec. no. : c229s3 issued date : 2011.10.05 revised date : page no. : 2/6 BTN2369S3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo 40 - - v i c =50a bv ceo 15 - - v i c =1ma bv ebo 4.5 - - v i e =50a i cbo - - 100 na v cb =40v i ebo - - 100 na v eb =4.5v *v ce(sat) 1 - - 250 mv i c =10ma, i b =1ma *v ce(sat) 2 - - 300 mv i c =20ma, i b =1ma *v be(sat) 1 700 - 850 mv i c =10ma, i b =1ma *v be(sat) 2 - - 1 v i c =20ma, i b =1ma *h fe 1 70 - 140 - v ce =6v, i c =1ma *h fe 2 70 - 140 - v ce =1v, i c =10ma *h fe 3 20 - - - v ce =2v, i c =100ma f t 500 - - mhz v ce =10v, i c =10ma, f=100mhz cob - - 4 pf v cb =5v, f=1mhz *pulse test: pulse width 380s, duty cycle 2% ordering information device package shipping marking BTN2369S3 sot-323 (pb-free lead plating package) 3000 pcs / tape & reel 1j
cystech electronics corp. spec. no. : c229s3 issued date : 2011.10.05 revised date : page no. : 3/6 BTN2369S3 cystek product specification typical characteristics current gain vs collector current 10 100 1000 0.1 1 10 100 1000 collector current --- ic(ma) current gain--- hfe hfe vce=6v vce=1 v vce=2v saturation voltage vs collector current 10 100 1000 0.1 1 10 100 1000 collector current --- ic(ma) saturation voltage---(mv) vce(sat) ic=5ib ic=10ib ic=20ib saturation voltage vs collector current 100 1000 0.1 1 10 100 1000 collector current --- ic(ma) saturation voltage---(mv) vbe(sat) ic=10ib ic=20ib capacitance characteristics 1 10 0.1 1 10 100 reverse-biased voltage---(v) capacitance---(pf) ft=1mhz cob power derating curve 0 50 100 150 200 250 300 350 0 50 100 150 200 ambient temperature ---ta( ) power dissipation---pd(mw) see note on page 1
cystech electronics corp. spec. no. : c229s3 issued date : 2011.10.05 revised date : page no. : 4/6 BTN2369S3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c229s3 issued date : 2011.10.05 revised date : page no. : 5/6 BTN2369S3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds 183 c 60-150 seconds time maintained above: ? temperature (t l ) 217 c ? time (t l ) 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c229s3 issued date : 2011.10.05 revised date : page no. : 6/6 BTN2369S3 cystek product specification sot-323 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. marking: te 1j 3-lead sot-323 plastic surface mounted package cystek package code: s3 style: pin 1.base 2.emitter 3.collector he e a a1 q lp e1 e bp 12 3 d w b v a z detail z a c 0 12 scale mm dim min. max. min. max. a 0.0315 0.0433 0.80 1.10 e1 0.0256 - 0.65 - a1 0.0000 0.0039 0.00 0.10 he 0.0787 0.0886 2.00 2.25 bp 0.0118 0.0157 0.30 0.40 lp 0.0059 0.0177 0.15 0.45 c 0.0039 0.0098 0.10 0.25 q 0.0051 0.0091 0.13 0.23 d 0.0709 0.0866 1.80 2.20 v 0.0079 - 0.2 - e 0.0453 0.0531 1.15 1.35 w 0.0079 - 0.2 - e 0.0512 - 1.3 - - - 10 0 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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