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03.08.2010 eld85npt5.doc 1 of 11 multi-quantum well (mqw) laser diode specification model: eld85npt5
03.08.2010 eld85npt5.doc 2 of 11 catalog 1. scope ???????????????????????????????????????..3 2. outline dimensions and terminal connections ?????????????? ??????3 3. ratings and characteristics ????????????????????????????..4 4. reliability ????????????????????????????????????..5 5. incoming inspection ????????????????? ???????????????..6 6. supplements ????????????????????????????????????..7 7. operation note ?????????????????????????????????..8 8. quality assurance ?????????????????????????????????.. 8 9. security ?????????????????????????????????????.9 10. note ?? ????????????????????????????????????.9
03.08.2010 eld85npt5.doc 3 of 11 1. scope the specification covers t he appearance and characteristics of 850nm laser diode used as light source, it?s model is eld85npt5.this pr oduct is packaged with an algaas multiple quantum well invisible laser diode chip and a silicon photodiode for moni toring optical power output. oscillation transverse m ode of this model is te. 2. outline dimensions and terminal connections average single quality 0.31g
03.08.2010 eld85npt5.doc 4 of 11 general tolerance 0.2 unit mm no. component material finish a laser diode chip algaas b photodiode chip si c stem fe gold-plated d cap kovar nickel-plated e window glass glass n = 1.49 (typ. =650nm) f lead pins kovar gold-plated 3. ratings and characteristics 3 1 absolute maximum ratings (tc=25 ) parameter symbol value unit optical power output (cw) po 7 mw laser diode vrl 2 v reverse voltage photodiode vrd 30 v operating temperature case temperature tc -10 ~ +55 storage temperature case temperature tstg -40 ~ +85 3-2 electro-optical characteristics note 1 tc 25 ? parameter condition symbol min. typ. max unit threshold current cw ith - 20 35 ma operating current iop - 30 45 ma operating voltage vop - 1.8 2.5 v wavelength po=5mw p 840 850 860 nm
03.08.2010 eld85npt5.doc 5 of 11 lateral beam angle note 2 3 ? 8 10 20 degree vertical beam angle note 2 3 ? 20 35 40 degree monitor current im 200 250 500 a slope efficiency cw d 0.4 0.5 0.8 note 1 initial value ,continuous work. note 2 angle of 50% peak intensity full angle at half-maximum note 3 parallel to the junction plane x-z plane perpendicular to the junction plane y-z plane 4. reliability 4-1 the reliability of product satis fy all the items listed below. reliability 90 no. test test conditions reference standard sampler: n defective c ltpd (%) 1 solder ability soldering temperature 250 5 immersion time 5 0.5 second brand iron should be grounded gjb-128a 11 0 20 2 terminal strength tensile test load 5n duration 10 1s once for each terminal gb-4937 11 0 20 3 terminal strength bending test load 2.5n 0 ~ 90 ~ 0 ~ 90 ~0 once for each terminal gb-4937 11 0 20 4 mechanical shock acceleration 14,700m/s 2 pulse width 0.5ms direction: x,y,z five times for each direction gjb-548a 11 0 20 5 variable frequency vibration acceleration 196m/s 2 frequency 20 2000 20hz 4min reciprocation x,y and z four times for each direction gjb-548a 11 0 20 6 temperature cycling lower temperature 40 higher temperature 85 duration 5 times stay for 3h switch time:3min gb-2423.22 11 0 20
03.08.2010 eld85npt5.doc 6 of 11 7 sealing helium gas to detect fine leaks: 5 10 3 pa cm 2 /s in fluorocarbon liquid 125 5 no bubble gjb-128a 11 0 20 8 high temperature storage temperature 85 t 96 h gb-2423.2 11 0 20 9 low temperature storage temperature 40 t 96 h gb-2423.1 11 0 20 10 moisture resistance (temperature humidity cycle) duration: from normal temperature up to 55 in 3h,stay for 9h,down to 25 in 3h stay for 9h. repeat 6 times. humidity is 95% gb-2423.4 11 0 20 4-2 parameters to be measured and failure criteria * solder ability test: solder must co ver at least 95% of t he total immersed area. * terminal strength test( tension/bendi ng);terminal shall not be destroyed or loosened. 4-3 target lifetime the target mean time to failure(mttf)of this pr oduct is more than thr ee thousand hours. mttf is to be confirmed by performing the operating test under the followi ng conditions once in six months. samples tested should have a laser diode chip with the same structure of this model. note 1 defective samples caused by surge current is rejected . 5. incoming inspection 5-1 inspection standards : gb-2828-87 ,normal inspecti on,1 time sample scheme. 5-2 inspection level: ii 5-3 aql 5-3-1 definition of the lot the day shipping the product 5-3-2 characteristics aql(%) parameter failure judgment criteria no. parameters failure judgment criteria 1 operating current iop initial operating current 1.2 2 operating voltage vop initial operating voltage 1.1 3 monitor current im initial operating value 0.8 or im initial operating value 1.2
03.08.2010 eld85npt5.doc 7 of 11 1.0 ith, iop, vop, d, p, , im not conforming to the specification 5-3-3 appearance aql(%) failure judgment criteria 1.0 parameters of stem and cap are not conforming th e specification rust cracking dirt bend * inspection is performed afte r blowing the window glass. 6 supplements 6.1 ods materials this product shall not contain the following material s. also the following materials shall not be used in the production process for this product. materials for ods:cfcs halon carbon tetrachloride ,etc. 6.2 brominated flame retardants 6.3 packing 6.3.1 packing method 1 laser diodes are packaged in an anti-static-plastic box. 2 each anti-static-plastic box can a ccommodate 100 laser diodes maximum. 3 5 anti-static-plastic box is piled up together and enlaced with an elastic band. 4 the above bound boxes are stuffed into a clean anti-static-bag ,then this is vacuumized and sealed thermally. 5 each packing case can accommodate 500 laser diodes , which is the minimu m unit of packing. labels where the model number, quantity and lot number are printed are struck on both of the bag and on the case refer to 6.3.4 . 6.3.2 packing materials no. component parts material 1 laser tray conductive polystyrene resin 2 package bag anti-static plastic 3 package box cardboard 6.3.3 case appearance
03.08.2010 eld85npt5.doc 8 of 11 6.3.4 label 1 a label on the clean-bag 2 a label on the packing case to type g. w t qty n.wt lot no. l 38 cm m.date w 29 cm c/no. h 14.5 cm 7. operation note 7.1 absolute maximum ratings if an excessively large current flows in a laser diode, a large optical output will occur and the emitting facet may sustain damage. this optical dam age can occur even with momentary over-current. for this reason, absolute maximu m ratings which must not be e xceeded even momentarily have been established. exercise particular c aution with respect to the drive vo ltage supply and static electricity. model: lot no : po: mw chip lot qty(pcs) m . date: qty: pcs
03.08.2010 eld85npt5.doc 9 of 11 we guarantee use within the absolute maximum ra tings. these ratings are established for a case temperature of 25 . as the temperature of a laser diode in creases, its maximum output will decrease and the operating range will shrink. even when oper ated within the absolute maximum ratings, operation at high temperatur e will result in a shorter life than oper ation at low temperature. for this reason, the design should incl ude sufficient margin for heat radiation and light output. 7.2 heat radiation conditions like other semiconductors, prol onged operation of a laser diode w ill cause heat to build up at junctions and increased case temperature. for this reason, attach aluminum , copper (or other) heat sinks (at least 30 30 3mm) to the stem of the laser. 7.3 protection against damage due to elect rostatic discharge and other current surges electrostatic discharge and other current sur ges can cause deterioration and damage in laser diodes, resulting in reduced reliability ,we advis e taking the following protective measures : 7.3.1 ground the device and circuits. install surge fi lters, surge reduction transformers, or other electrostatic discharge protectors in the power supply inputs. 7.3.2 when working with laser diodes wear anti-static clothing, incl uding footwear and caps. materials should be selected carefully. grounded wrist should always be worn while working with laser diodes, and the strap should be grounded through a 1 m ? resistance. 7.3.3 use anti-static cont ainers for transport and storage. 7.3.4 laser deterioration and dam age can occur due to excessive current spikes when the power is turned on or off. design circuits to avoi d the generation of excessive current spikes. 7.3.5 inductive surges near equipm ent that emits high frequency em i can damage or destroy lasers. avoid using lasers near fluorescent la mps or other sources of emi emissions. 7.4 soldering use a grounded soldering iron to solder laser leads. solder at a temperature of no more than 250 for a maximum of 3 seconds, at a point at least 2 mm from the base of the leads . 7.5 handling laser diodes never touch the glass window of t he laser. a damaged or dirtied window will impair the performance of the laser. 7.6 handling packages due to the glass window in each device, packages must not be dropped or subjected to excessive pressure. 7.7 safety it is extremely dangerous to look, ei ther directly or through a lens, at the laser beam emitted from a laser diode. use a tv camera or other si milar device to adjust the optical axis. 8. quality assurance 8.1 laser diodes (semiconductor lasers) have a much longer lif e than other lasers such as gas or solid-state lasers. the components of our lasers hav e optimum characteristic ranges. to ensure these characteristics and product life , we manufacture our laser di odes based on comprehensive data
03.08.2010 eld85npt5.doc 10 of 11 control using our own custom manufactu ring, measuring, and inspection equipment. 8.2 quality assurance system 8.2.1 after the wafers have been manufactured, electr ical and optical charac teristics are measured to verify that characteristics can be achiev ed as the manufacturing process progresses. 8.2.2 in-process inspections are conducted at various manufacturing points to ensure the stability of our assembly operations. 8.2.3 all products are burned-in to minimize initial and random failures. 8.2.4 characteristics of a ll products are tested before shipping. 8.2.5 products are managed by wafer lot. 8.2.6 reliability tests are per formed on randomly selected samples. 8.3 quality assurance measures 8.3.1 materials, manufac turing conditions, and inspection ar e controlled and maintained based on company set standards. temperature, dust, humidit y and other environmental conditions are also controlled based on company standards. 8.3.2 measurement instrument s used during the manufacturing proc ess are regularly inspected and calibrated based on company m easurement control standards. 9. security the laser beam emitted from a laser diode is al most invisible to bot h the human eye and the animal eye, however, it will injure the eye and suffic ient caution must be exercised to avoid direct exposure or exposure through a fiber to the beam when a laser diode is in operation. to adjust the optical axis or per form other similar work, we reco mmend using an infrared-sensitive itv camera. we also recommend that protective glasses be worn 10. note no unauthorized transmission or repro duction of this specific ation, either in whole or in part, is permitted. the contents of these sheets ar e subject to change wit hout notice. always ve rify before use that the contents are the latest specifications. if, by any chance, a defect should arise in the equipment as a result of use without verifica tion of the specificat ions, manufacturer, c an bear no responsibility whatsoever. upon the sale of any such devices; other than fo r the buyer?s right to use such devices itself, resell or otherwise dispose of the same; no expre ss or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by us, is granted to any such buyer. the products listed in this specification are designed to be used with ordinary electronic equipment or devices (suc h as audio-visual equipment, office-a utomation equipment, communications devices, electrical appli ances, and electronic toys). should you intend to use these products with equipment or devices which require an extremely high level of reliability and the ma lfunction of which would directly endanger human life (such as m edical instruments, transportation equipment, aerospace machinery, nuclear-reacto r controllers, fuel controllers, or other safety devices) please be sure to consult with our sale s representatives in advance. 10.5 when exporting, please be sure to consult with our sales repr esentatives to ascertain whether
03.08.2010 eld85npt5.doc 11 of 11 any product is classified as a strategic material.

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