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pc713vxnszx series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc713v ) 2. approved by t?v (vde0884) (as an option) file no. r-9151576 (as model no. pc713v ) 3. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. home appliances 2. programmable controllers 3. personal computer peripherals applications dip 6 pin includes base terminal connection photocoupler 1. 6 pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. with base terminal 4. high collector-emitter voltage (v ceo :80v ( * ) ) 5. high isolation voltage between input and output (v iso(rms) : 5.0kv) ( * ) up to date code "p7" (july 2002) v ceo : 35v. description pc713vxnszx series contains an ired optically coupled to a phototransistor. it is packaged in a 6 pin dip, available in smt gullw- ing lead-form option. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 80v ( * ) and ctr is 50% to 600% at input current of 5ma. 1 sheet no.: d2-a04301en date nov. 28. 2003 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc713vxnszx series
internal connection diagram anode cathode nc emitter 1 1 2 3 4 collector 5 base 6 2 6 5 3 4 2 sheet no.: d2-a04301en outline dimensions (unit : mm) 1. through-hole [ex. pc713vxnszx ] 2. through-hole (vde0884 option) [ex. pc713vxyszx ] 3. smt gullwing lead-form [ex. pc713vxnipx ] 4. smt gullwing lead-form (vde0884 option) [ex. pc713vxyipx ] 7.12 0.5 : 0 to 13? 7.62 0.3 epoxy resin 6.5 0.5 0.6 0.2 1.2 0.3 1 2 3 6 5 4 0.5 typ. 2.9 0.5 0.5 0.1 2.54 0.25 3.25 0.5 3.5 0.5 rank mark pc713v sharp mark "s" date code anode mark 7.12 0.3 : 0 to 13? 7.62 0.3 epoxy resin 6.5 0.5 0.6 0.2 1.2 0.3 1 2 3 6 5 4 0.5 typ. 2.9 0.5 0.5 0.1 2.54 0.25 3.25 0.5 3.5 0.5 rank mark 4 vde0884 identification mark anode mark pc713v sharp mark "s" date code 7.12 0.5 7.62 0.3 epoxy resin anode mark 6.5 0.5 0.6 0.2 1.2 0.3 2.54 0.25 3.5 0.5 0.35 0.25 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.26 0.1 1 2 3 6 5 4 rank mark pc713v sharp mark "s" date code 7.12 0.5 7.62 0.3 epoxy resin rank mark 6.5 0.5 0.6 0.2 1.2 0.3 2.54 0.25 3.5 0.5 0.35 0.25 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.26 0.1 4 vde0884 identification mark anode mark 1 2 3 6 5 4 pc713v sharp mark "s" date code pc713vxnszx series product mass : approx. 0.36g
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production 3 repeats in a 20 year cycle sheet no.: d2-a04301en rank mark refer to the model line-up pc713vxnszx series country of origin japan
sheet no.: d2-a04301en electro-optical characteristics parameter conditions forward voltage terminal capacitance collector dark current transfer charac- teristics collector-base breakdown voltage emitter-base breakdown voltage current transfer ratio collector-emitter breakdown voltage collector-emitter saturation voltage isolation resistance floating capacitance cut-off frequency min. ? ? ? 80 6 2.5 ? 5 10 10 ? ? ? ? typ. 1.2 30 ? ? ? ? ? 0.1 1 10 11 0.6 80 4 3 max. 1.4 250 100 ? ? ? 30 0.2 ? 1.0 ? 18 18 unit v v pf na v v ma v ? pf khz s s symbol v f c t i ceo bv ceo bv cbo bv ebo i c v ce (sat) f c t r t f r iso c f response time rise time fall time input output i f = 20ma v = 0, f = 1khz reverse current ?? 10 a i r v r = 4v peak forward voltage ?? 3.0 v v fm i fm = 0.5a v ce = 50v, i f = 0 i c = 0.1ma, i f = 0 i c = 0.1ma, i f = 0 i e = 10 a, i f = 0 i f = 5ma, v ce = 5v dc500v, 40 to 60%rh v = 0, f = 1mhz v ce = 2v, i c = 2ma, r l = 100 ? v ce = 5v, i c = 2ma, r l = 100 ? ? 3db i f = 20ma, i c = 1ma 80 (t a = 25?c) *5 *5 *5 up to date code "p7" (july 2002) bv ceo 35v and bv cbo 35v. absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 *4 *4 peak forward current a power dissipation reverse voltage mw v output collector-emitter voltage v emitter-collector voltage collector-base voltage emitter-base voltage v v v collector current ma collector power dissipation mw *2 isolation voltage operating temperature total power dissipation ?c mw storage temperature ?c *3 soldering temperature i f i fm p v r v ceo v eco v cbo v ebo i c p c v iso (rms) t opr p tot t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1minute, f=60hz *3 for 10s *4 up to date code "p7" (july 2002) v ceo : 35v, v cbo : 35v. rating 50 1 70 6 80 6 80 6 50 150 ? 25 to + 100 170 ? 40 to + 125 260 5kv 4 pc713vxnszx series
sheet no.: d2-a04301en model line-up rank mark with or with out a b c a or b b or c a, b or c pc713v0nszx pc713v1nszx pc713v2nszx PC713V3NSZX pc713v5nszx pc713v6nszx pc713v8nszx pc713v0yszx pc713v1yszx pc713v2yszx pc713v3yszx pc713v5yszx pc713v6yszx pc713v8yszx ?????? approved pc713v0nizx pc713v1nizx pc713v2nizx pc713v3nizx pc713v5nizx pc713v6nizx pc713v8nizx pc713v0yizx pc713v1yizx pc713v2yizx pc713v3yizx pc713v5yizx pc713v6yizx pc713v8yizx pc713v0nipx pc713v1nipx pc713v2nipx pc713v3nipx pc713v5nipx pc713v6nipx pc713v8nipx pc713v0yipx pc713v1yipx pc713v2yipx pc713v3yipx pc713v5yipx pc713v6yipx pc713v8yipx lead form package model no. vde0884 sleeve taping through-hole 50pcs / sleeve 1 000pcs / reel smt gullwing ?????? approved ?????? approved i c [ma] (i f = 5ma, v ce = 5v, t a = 25?c) 2.5 to 30.0 4.0 to 8.0 6.5 to 13.0 10.0 to 20.0 4.0 to 13.0 6.5 to 20.0 4.0 to 20.0 5 please contact a local sharp sales representative to inquire about production status and lead-free options. pc713vxnszx series
sheet no.: d2-a04301en 0 30 0 100 125 40 50 60 20 10 forward current i f (ma) -25 25 50 75 ambient temperature t a (?c) fig.1 forward current vs. ambient temperature fig.2 diode power dissipation vs. ambient temperature 0 0 125 100 200 50 150 25 50 75 100 collector power dissipation p c (mw) ambient temperature t a (?c) ? 25 fig.3 collector power dissipation vs. ambient temperature 50?c 25?c 0?c 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 10 100 1 forward voltage v f (v) forward current i f (ma) ? 25?c t a = 75?c fig.6 forward current vs. forward voltage duty ratio 0.01 0.1 1 10 1 peak forward current i fm (a) 10 ? 3 10 ? 2 10 ? 1 pulse width 100 s ta = 25?c fig.5 peak forward current vs. duty ratio fig.4 total power dissipation vs. ambient temperature 6 pc713vxnszx series total power dissipation p tot (mw) ambient temperature t a (?c) 50 0 025507 5 100 ? 25 100 150 170 200 250 diode power dissipation p (mw) 100 80 70 60 40 20 0 025 557 5 100 ? 25 ambient temperature t a (?c)
sheet no.: d2-a04301en 7 25 0 ? 25 50 75 10 ? 10 100 10 ? 9 10 ? 8 10 ? 7 10 ? 6 10 ? 5 10 ? 11 ambient temperature t a (?c) collector dark current i ceo (a) v ce = 50v r be = fig.11 collector dark current vs. ambient temperature fig.12 collector-base dark current vs. ambient temperature 100 0 50 150 0507 5 100 ? 25 25 ambient temperature t a (?c) relative current transfer ratio (%) i f = 5ma v ce = 5v r be = fig.9 relative current transfer ratio vs. ambient temperature 0.02 0.04 0.06 0.08 0.10 0.12 0.14 020406 080 100 ambient temperature t a (?c) collector-emitter saturation voltage v ce (sat) (v) ? 25 i f = 20ma i c = 1ma r be = fig.10 collector - emitter saturation voltage vs. ambient temperature 10 ? 9 10 ? 8 10 ? 10 10 ? 11 25 05075 100 125 ambient temperature t a (?c) collector dark current i cbo (a) v cb = 50v r be = pc713vxnszx series 0 200 1 40 80 120 160 180 140 100 60 20 10 forward current i f (ma) current transfer ratio ctr (%) r be = 500k ? 100k ? v ce = 5v t a = 25?c fig.7 current transfer ratio vs. forward current 0 0 5 30 123456789 10 15 20 25 20ma 10ma 5ma collector current i c (ma) collector-emitter voltage v ce (v) i f = 30ma r be = t a = 25?c p c (max.) fig.8 collector current vs. collector- emitter voltage
sheet no.: d2-a04301en 8 ? 20 0 1 ? 10 100 10 voltage gain a v (db) frequency f (khz) r l = 10k ? 1k ? 100 ? v ce = 5v i c = 2ma r be = t a =25?c fig.15 frequency response remarks : please be aware that all data in the graph are just for reference and not for guarantee. fig.16 test circuit for frequency response v cc r l output r d v ce please refer to the conditions in fig.15 pc713vxnszx series 0.1 1 0.1 1 10 10 100 load resistance r l (k ? ) response time ( s) t d t s t f t r v ce = 2v i c = 2ma r be = t a = 25?c fig.13 response time vs. load resistance fig.14 test circuit for response time 90% 10% output input r l input output v ce please refer to the conditions in fig.13 v cc r d t d t s t r t f
sheet no.: d2-a04301en while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 2.54 2.54 1.7 2.2 8.2 (unit : mm) design guide design considerations pc713vxnszx series
sheet no.: d2-a04301en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc713vxnszx series
sheet no.: d2-a04301en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this device. regulation substances:cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. presence of odc 11 pc713vxnszx series
sheet no.: d2-a04301en package specification 12 12.0 6.7 5.8 10.8 520 2 pc713vxnszx series sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 50 pcs. of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm)
sheet no.: d2-a04301en 13 tape and reel package package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j b h h a c g 5? max. dimensions list (unit:mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 12.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 7.8 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 1 000pcs/reel] reel structure and dimensions direction of product insertion pc713vxnszx series
pc713vxnszx series ?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 14 sheet no.: d2-a04301en important notices

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