FDMS7570S n-channel powertrench ? syncfet ?2009 fairchild semiconductor corporation FDMS7570S rev.c www.fairchildsemi.com 1 december 2009 FDMS7570S n-channel powertrench ? syncfet tm 25 v, 49 a, 1.95 m ? features ? max r ds(on) = 1.95 m ? at v gs = 10 v, i d = 28 a ? max r ds(on) = 2.85 m ? at v gs = 4.5 v, i d = 22 a ? advanced package and silic on combination for low r ds(on) and high efficiency ? syncfet schottky body diode ? msl1 robust package design ? 100% uil tested ? rohs compliant general description the FDMS7570S has been designed to minimize losses in power conversion application. advancements in both silicon and package technologies have been combined to offer the lowest r ds(on) while maintaining excellent switching performance. this device has the added benefit of an efficient monolithic schottky body diode. applications ? synchronous rectifier for synchronous buck converters ? notebook ? server ? telecom ? high efficiency dc-dc switch mode power supplies 4 3 2 1 5 6 7 8 d d d d s s s g d d d d g s s s pin 1 bottom top power 56 mosfet maximum ratings t c = 25 c unless otherwise noted thermal characteristics package marking and ordering information symbol parameter ratings units v ds drain to source voltage 25 v v gs gate to source voltage (note 4) 20 v i d drain current -continuous (package limited) t c = 25 c 49 a -continuous (silicon limited) t c = 25 c 156 -continuous t a = 25 c (note 1a) 28 -pulsed 180 e as single pulse avalanche energy (note 3) 144 mj p d power dissipation t c = 25 c 83 w power dissipation t a = 25 c (note 1a) 2.5 t j , t stg operating and storage junction temperature range -55 to +150 c r jc thermal resistance, junction to case 1.5 c/w r ja thermal resistance, junction to ambient (note 1a) 50 device marking device package reel size tape width quantity FDMS7570S FDMS7570S power 56 13 ?? 12 mm 3000 units
FDMS7570S n-channel powertrench ? syncfet FDMS7570S rev.c www.fairchildsemi.com 2 electrical characteristics t a = 25 c unless otherwise noted off characteristics on characteristics (note 2) dynamic characteristics switching characteristics drain-source diode characteristics symbol parameter test conditions min typ max units bv dss drain to source breakdown voltage i d = 1 ma, v gs = 0 v 25 v ' bv dss ' t j breakdown voltage temperature coefficient i d = 10 ma, referenced to 25 c 22 mv / c i dss zero gate voltage drain current v ds = 20 v, v gs = 0 v 500 p a i gss gate to source leakage current, forward v gs = 20 v, v ds = 0 v 100 na v gs(th) gate to source threshold voltage v gs = v ds , i d = 1 ma 1.2 1.7 3.0 v ' v gs(th) ' t j gate to source threshold voltage temperature coefficient i d = 10 ma, referenced to 25 c -5 mv/c r ds(on) static drain to source on resistance v gs = 10 v, i d = 28 a 1.6 1.95 m : v gs = 4.5 v, i d = 22 a 2.3 2.85 v gs = 10 v, i d = 28 a, t j = 125 c 2.4 3.0 g fs forward transconductance v ds = 5 v, i d = 28 a 170 s c iss input capacitance v ds = 13 v, v gs = 0 v, f = 1 mhz 3392 4515 pf c oss output capacitance 912 1215 pf c rss reverse transfer capacitance 172 260 pf r g gate resistance 1.2 2. 1 : t d(on) turn-on delay time v dd = 13 v, i d = 28 a, v gs = 10 v, r gen = 6 : 14 25 ns t r rise time 5.9 12 ns t d(off) turn-off delay time 34 55 ns t f fall time 410ns q g total gate charge v gs = 0 v to 10 v v dd = 13 v, i d = 28 a 49 69 nc q g total gate charge v gs = 0 v to 4.5 v 22 32 nc q gs gate to source gate charge 9.9 nc q gd gate to drain ?miller? charge 5.3 nc v sd source to drain diode forward voltage v gs = 0 v, i s = 2 a (note 2) 0.43 0.8 v v gs = 0 v, i s = 28 a (note 2) 0.78 1.2 t rr reverse recovery time i f = 28 a, di/dt = 300 a/ p s 28 45 ns q rr reverse recovery charge 27 43 nc notes : 1. r t ja is determined with the device mounted on a 1in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of fr-4 material. r t jc is guaranteed by design while r t ca is determined by the user's board design. 2. pulse test: pulse width < 30 0 p s, duty cycle < 2.0%. 3. e as of 144 mj is based on starting t j = 25 c, l = 1 mh, i as = 17 a, v dd = 23 v, v gs = 10 v. 100% test at l = 0.3 mh, i as = 25 a. 4. as an n-ch device, the negative vgs rating is for low dut y cycle pulse occurrence only. no continuous rating is implied. a. 50 c/w when mounted on a 1 in 2 pad of 2 oz copper. b. 125 c/w when mounted on a minimum pad of 2 oz copper.
FDMS7570S n-channel powertrench ? syncfet FDMS7570S rev.c www.fairchildsemi.com 3 typical characteristics t j = 25 c unless otherwise noted figure 1. 012345 0 45 90 135 180 v gs = 3.5 v v gs = 3 v v gs = 2.7 v v gs = 4.5 v pulse duration = 80 p s duty cycle = 0.5% max v gs = 10 v i d , drain current (a) v ds , drain to source voltage (v) on region characteristics figure 2. 04590135180 0 2 4 6 8 v gs = 2.7 v v gs = 3.5 v pulse duration = 80 p s duty cycle = 0.5% max normalized drain to source on-resistance i d , drain current (a) v gs = 4.5 v v gs = 3 v v gs = 10 v n o r m a l i z e d o n - r e s i s t a n c e vs drain current and gate voltage f i g u r e 3 . n o r m a l i z e d o n r e s i s t a n c e -75 -50 -25 0 25 50 75 100 125 150 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 i d = 28 a v gs = 10 v normalized drain to source on-resistance t j , junction temperature ( o c ) vs junction temperature figure 4. 246810 0 2 4 6 8 t j = 125 o c i d = 28 a t j = 25 o c v gs , gate to source voltage (v) r ds(on) , drain to source on-resistance ( m : ) pulse duration = 80 p s duty cycle = 0.5% max o n - r e s i s t a n c e v s g a t e t o source voltage figure 5. transfer characteristics 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 45 90 135 180 t j = 125 o c v ds = 5 v pulse duration = 80 p s duty cycle = 0.5% max t j = -55 o c t j = 25 o c i d , drain current (a) v gs , gate to source voltage (v) figure 6. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.01 0.1 1 10 100 200 t j = -55 o c t j = 25 o c t j = 125 o c v gs = 0 v i s , reverse drain current (a) v sd , body diode forward voltage (v) s o u r c e t o d r a i n d i o d e forward voltage vs source current
FDMS7570S n-channel powertrench ? syncfet FDMS7570S rev.c www.fairchildsemi.com 4 figure 7. 0 1020304050 0 2 4 6 8 10 i d = 28a v dd = 16 v v dd = 10 v v gs , gate to source voltage (v) q g , gate charge (nc) v dd = 13 v gate charge characteristics figure 8. 0.1 1 10 30 100 1000 5000 f = 1 mhz v gs = 0 v capacitance (pf) v ds , drain to source voltage (v) c rss c oss c iss c a p a c i t a n c e v s d r a i n to source voltage figure 9. 0.01 0.1 1 10 100 1000 1 10 50 t j = 100 o c t j = 25 o c t j = 125 o c t av , time in avalanche (ms) i as , avalanche current (a) unclamped inductive switching capability figure 10. maximum continuous drain 25 50 75 100 125 150 0 40 80 120 160 r t jc = 1.5 o c/w v gs = 4.5 v limited by package v gs = 10 v i d , drain current (a) t c , case temperature ( o c ) current vs case temperature figure 11. 0.01 0.1 1 10 100 0.01 0.1 1 10 100 500 100 us dc 100 ms 10 ms 1 ms 1s i d , drain current (a) v ds , drain to source voltage (v) this area is limited by r ds ( on ) single pulse t j = max rated r t ja = 125 o c/w t a = 25 o c 10s f o r w a r d b i a s s a f e operating area figure 12. 10 -4 10 -3 10 -2 10 -1 110 100 1000 0.5 1 10 100 1000 5000 single pulse r t ja = 125 o c/w t a = 25 o c p ( pk ) , peak transient power (w) t, pulse width (sec) s i n g l e p u l s e m a x i m u m p o w e r d i s s i p a t i o n typical characteristics t j = 25 c unless otherwise noted
FDMS7570S n-channel powertrench ? syncfet FDMS7570S rev.c www.fairchildsemi.com 5 figure 13. junction-to-ambient transient thermal response curve 10 -4 10 -3 10 -2 10 -1 110 100 1000 0.0001 0.001 0.01 0.1 1 single pulse r t ja = 125 o c/w duty cycle-descending order normalized thermal impedance, z t ja t, rectangular pulse duration (sec) d = 0.5 0.2 0.1 0.05 0.02 0.01 2 p dm t 1 t 2 notes: duty factor: d = t 1 /t 2 peak t j = p dm x z t ja x r t ja + t a typical characteristics t j = 25 c unless otherwise noted
FDMS7570S n-channel powertrench ? syncfet FDMS7570S rev.c www.fairchildsemi.com 6 syncfet schottky body diode characteristics fairchild?s syncfet process emb eds a schottky diode in parallel with powertrench mosfet. th is diode exhibits similar characteristics to a discrete exte rnal schottky diode in parallel with a mosfet. figure 14 shows the reverses recovery characteristic of the FDMS7570S. schottky barrier diodes exhibit significant leakage at high tem- perature and high reverse voltage. this will increase the power in the device. typical char acteristics (continued) figure 14. FDMS7570S syncfet body diode reverse recovery characteristic figure 15. syncfet body diode reverses leakage versus drain-source voltage 0 50 100 150 200 -5 0 5 10 15 20 25 30 di/dt = 300 a/ s current (a) time (ns) 0 5 10 15 20 25 10 -6 10 -5 10 -4 10 -3 10 -2 t j = 125 o c t j = 100 o c t j = 25 o c i dss , reverse leakage current (a) v ds , reverse voltage (v)
FDMS7570S n-channel powertrench ? syncfet FDMS7570S rev.c www.fairchildsemi.com 7 dimensional outlin e and pad layout
FDMS7570S n-channel powertrench ? syncfet FDMS7570S rev.c www.fairchildsemi.com 8 trademarks the following includes registered and unregistered trademarks and service marks, owned by fairchild semiconductor and/or its gl obal subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *trademarks of system general corporation, us ed under license by fairchild semiconductor. disclaimer fairchild semiconductor reserves the right to make changes with out further notice to any products herein to improve reliability, function, or design. fairchild does not assume an y liability arising out of the application or use of any product or circuit described herein; neither does it convey an y license under its patent rights, nor the rights of others. these specifications do not expand the terms of fairchild?s wo rldwide terms and conditions, specifically the warranty therein, which covers these products. life support policy fairchild?s products are not authorized for use as critical co mponents in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or systems ar e devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a signi ficant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms accupower? auto-spm? build it now? coreplus? corepower? crossvolt ? ctl? current transfer logic? deuxpeed ? dual cool? ecospark ? efficentmax? ezswitch?* ?* fairchild ? fairchild semiconductor ? fact quiet series? fact ? fast ? fastvcore? fetbench? flashwriter ? * fps? f-pfs? frfet ? global power resource sm green fps? green fps? e-series? g max ? gto? intellimax? isoplanar? megabuck? microcoupler? microfet? micropak? millerdrive? motionmax? motion-spm? optologic ? optoplanar ? ? pdp spm? power-spm? powertrench ? powerxs? programmable active droop? qfet ? qs? quiet series? rapidconfigure? ? saving our world, 1mw/w/kw at a time? signalwise? smartmax? smart start? spm ? stealth? superfet? supersot?-3 supersot?-6 supersot?-8 supremos? syncfet? sync-lock? ?* the power franchise ? ? tinyboost? tinybuck? tinycalc? tinylogic ? tinyopto? tinypower? tinypwm? tinywire? trifault detect? truecurrent?* serdes? uhc ? ultra frfet? unifet? vcx? visualmax? xs? tm ? tm tm datasheet identification product status definition advance information formative / in design datasheet contains the design specifications for product development. specifications may change in any manner without notice. preliminary first production datasheet contains preliminary data; supp lementary data will be published at a later date. fairchild semiconductor reserves the ri ght to make changes at any time without notice to improve design. no identification needed full production datasheet contains final specifications. fair child semiconductor reserves the right to make changes at any time without notice to improve the design. obsolete not in production datasheet contains specifications on a product t hat is discontinued by fairchild semiconductor. the datasheet is for reference information only. anti-counterfeiting policy fairchild semiconductor corporation?s anti-counterfeiting policy. fairchild?s anti-counterfeiting policy is also stated on our external website, www.fairchildsemi.com, under sales support . counterfeiting of semiconductor parts is a growing problem in the industry. all manufactures of semiconductor products are expe riencing counterfeiting of their parts. customers who inadvertently purchase counterfeit parts experi ence many problems such as loss of brand reputation, substa ndard performance, failed application, and increased cost of production and manufacturing del ays. fairchild is taking strong measures to protect ourselve s and our customers from the proliferation of counterfeit parts. fairchild strongly encourage s customers to purchase fairchild parts either directly from fa irchild or from authorized fairchild distributors who are listed by country on our web page cited above. products customers buy either from fairchild directly or fr om authorized fairchild distributors are genuine parts, have full traceability, meet fairchild?s quality standards for handing and storage and provide access to fairchild?s full range of up-to-date technical and product information. fairchild and our authorized distributors will stand behind all warranties and wi ll appropriately address and warranty issues that may arise. fairchild will not provide any wa rranty coverage or other assistance for parts bought from unau thorized sources. fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. rev. i45
|
