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  z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com specification ssc - STW9Q14B rohs
z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B rev.0.3 rev.0.3 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com features applications description ? lead frame type led pkg size: 5.6*3.0 thickness 0.9mm ? white colored smt package ? pb - free reflow soldering application ? rohs compliant ? high cri (ra min90) ? interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting STW9Q14B STW9Q14B this surface - mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability.
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com [ contents ] 1. outline dimensions of STW9Q14B 2. characteristics of STW9Q14B 3. characteristic diagrams 4. color & binning 5. bin code description 6. labeling 7. packing 8. recommended solder pad 9. soldering 10. precaution for use 11. handling of silicone resin leds
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 1. outline dimensions of STW9Q14B notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.1mm top view side view bottom view esd protection device 2 1 anode cathode circuit diagram a c n.c n.c package marking slug
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com material structure parts no. name description materials lead frame metal copper alloy (silver plated) chip source blue led gan on sapphire wire metal gold wire encapsulation silicone +phosphor body thermo plastic heat - resistant polymer zener diode si -
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 2. characteristics of STW9Q14B 1) electro - optical characteristics at 100ma 2) absolute maximum ratings parameter symbol value unit forward current i f 160 ma power dissipation* [1] p d 560 mw junction temperature t j 125 o c operating temperature t opr - 40 ~ +85 o c storage temperature t stg - 40 ~ +100 o c esd (hbm) 5,000v hbm v - 100 - 90 ra color rendering index* parameter symbol value unit min typ max forward voltage v f 2.9 3.2 3.5 v reverse voltage v r - 0.9 1.2 v luminous intensity* [1] (2,600~4.500 k) i v - 9.5 (28.5) - cd (lm) correlated color temperature cct 2,600 - 4,500 k viewing angle [2] 2 1/2 - 120 - - thermal resistance [3] r th js - 18 - o c/w *notes : led s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. [1] care is to be taken that power dissipation does not exceed t he absolute maximum rating of the product. (ta=25 , rh30%) *notes : all measurements were made under the standardized environment o f ssc. [1] the luminous intensity iv was measured at the peak of the sp atial pattern which may not be aligned with the mechanical axis of the led package. [2] 2 1/2 is the off - axis where the luminous intensity is 1/2 of the peak intensity. [3] thermal resistance: rthjs (junction / solder) * tolerance : vf : 0.1v, iv : 7%, ra : 2, x,y : 0.01
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 1) spectrum data (if=100ma, ta=25 , rh30%) 3. characteristic diagrams 300 400 500 600 700 800 0.0 0.5 1.0 relative emission intensity wavelength [nm]
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 3) forward current vs. relative luminous flux, ta=25 2) forward voltage vs. forward current, ta=25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 50 100 150 200 forward current(ma) forward voltage [v] 0 20 40 60 80 100 120 140 160 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 relative luminous flux forward current [ma]
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 4) chromaticity coordinate vs. forward current, ta=25 (2600~3200k) 0.408 0.409 0.410 0.411 0.412 0.413 0.414 0.392 0.394 0.396 0.398 0.400 0.402 20ma 60ma 100ma 150ma 200ma y x
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 5) relative light output vs. junction temperature, if=100ma 25 50 75 100 125 0.0 0.2 0.4 0.6 0.8 1.0 1.2 relative luminousity flux junction temperature ta[ o c]
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 6) chromaticity coordinate vs. junction temperature (2600~3200k) 0.416 0.417 0.418 0.419 0.420 0.421 0.422 0.392 0.396 0.400 0.404 0.408 0.412 25 45 65 85 105 125 y x
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 8) ambient temperature vs. maximum forward current -4 0 -2 0 0 2 0 4 0 6 0 8 0 1 0 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 1 4 0 1 6 0 1 8 0 2 0 0 forward current i f [ma] a m b ie n t te m p e ra tu re t a ( o c ) r th j -a = 10 0 o c /w 7) forward voltage shift vs. junction temperature 20 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 1.2 forward voltage [v] junction temperature ta[ o c]
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 9) viewing angle, ta=25 -90 -60 -30 90 60 30 0
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 4. color & binning 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 4500k 2600k 2700k 2900k 3000k 3200k 3500k 3700k 4000k 4200k cie x cie y f0 f1 f2 f3 f4 f5 g0 g1 g2 g3 g4 g5 h0 h1 h2 h3 h4 h5 e0 e1 e2 e3 e4 e5 d1 d3 d5
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com color rank 4. color & binning * measurement uncertainty of the color coordinates : 0.01 0.3677 0.3692 0.3775 0.3714 0.3874 0.3736 0.3578 0.367 0.3677 0.3692 0.3775 0.3714 0.3521 0.359 0.3616 0.3608 0.3711 0.3625 0.3616 0.3608 0.3711 0.3625 0.3804 0.3641 cie y cie x cie y cie x cie y cie x d5 d3 d1 4200~4500k
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com color rank 4. color & binning * measurement uncertainty of the color coordinates : 0.01 0.3931 0.4198 0.4048 0.4248 0.4165 0.4299 0.3814 0.4147 0.3931 0.4198 0.4048 0.4248 0.3751 0.4017 0.3865 0.4062 0.3978 0.4104 0.3865 0.4062 0.3978 0.4104 0.4089 0.4146 cie y cie x cie y cie x cie y cie x f5 f3 f1 3200~3500k 0.3865 0.4062 0.3978 0.4104 0.4089 0.4146 0.3751 0.4017 0.3865 0.4062 0.3978 0.4104 0.369 0.3889 0.3798 0.3925 0.3907 0.396 0.3798 0.3925 0.3907 0.396 0.4015 0.3996 cie y cie x cie y cie x cie y cie x f4 f2 f0 3500~3700k 0.3825 0.3934 0.3935 0.397 0.4044 0.4006 0.3716 0.3898 0.3825 0.3934 0.3935 0.397 0.3646 0.3783 0.3751 0.3813 0.3855 0.3842 0.3751 0.3813 0.3855 0.3842 0.3958 0.3869 cie y cie x cie y cie x cie y cie x e5 e3 e1 3700~4000k 0.3751 0.3813 0.3855 0.3842 0.3958 0.3869 0.3646 0.3783 0.3751 0.3813 0.3855 0.3842 0.3578 0.367 0.3677 0.3692 0.3775 0.3714 0.3677 0.3692 0.3775 0.3714 0.3874 0.3736 cie y cie x cie y cie x cie y cie x e4 e2 e0 4000~4200k
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com color rank 4. color & binning * measurement uncertainty of the color coordinates : 0.01 0.4069 0.4666 0.4194 0.474 0.4319 0.481 0.3944 0.4593 0.4069 0.4666 0.4194 0.474 0.3919 0.4483 0.4042 0.4551 0.4166 0.462 0.4042 0.4551 0.4166 0.462 0.4289 0.4687 cie y cie x cie y cie x cie y cie x h5 h3 h1 2600~2700k 0.4042 0.4551 0.4166 0.462 0.4289 0.4687 0.3919 0.4483 0.4042 0.4551 0.4166 0.462 0.3893 0.4373 0.4015 0.4436 0.4138 0.4499 0.4015 0.4436 0.4138 0.4499 0.426 0.4562 cie y cie x cie y cie x cie y cie x h4 h2 h0 2700~2900k 0.4015 0.4436 0.4138 0.4499 0.426 0.4562 0.3893 0.4373 0.4015 0.4436 0.4138 0.4499 0.3853 0.4259 0.3973 0.4317 0.4093 0.4374 0.3973 0.4317 0.4093 0.4374 0.4212 0.443 cie y cie x cie y cie x cie y cie x g5 g3 g1 2900~3000k 0.3973 0.4317 0.4093 0.4374 0.4212 0.443 0.3853 0.4259 0.3973 0.4317 0.4093 0.4374 0.3814 0.4147 0.3931 0.4198 0.4048 0.4248 0.3931 0.4198 0.4048 0.4248 0.4165 0.4299 cie y cie x cie y cie x cie y cie x g4 g2 g0 3000~3200k
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 5. bin code description bin code luminous intensity [ mcd ] color rank forward voltage [v] t0 g3 z3 2,600k ~ 4,500k 2,600k ~ 4,500k color rank @ i f = 100ma d ~ h 3.1 3.0 z1 forward voltage [v] @ i f = 100ma rank min. max. y3 2.9 3.0 z2 3.1 3.2 z3 3.2 3.3 a1 3.3 3.4 a2 3.4 3.5 33.5 11700 11000 u0 35.6 12500 11700 u7 32.5 11000 10500 t5 31.0 10500 10000 t0 luminous intensity [ mcd ] * [1] @ i f = 100ma flux * [2] [lm] rank min. max. typ. r5 8500 9000 27.6 s0 9000 9500 28.9 s5 9500 10000 30.0 u7 u7 u7 u7 u7 u0 t5 t0 s5 s0 r5 e 3700~4200 k u0 u0 u0 u0 iv rank t5 t5 t5 t5 t0 s5 s0 r5 f 3200~3700 k h g d cie t0 s5 s0 r5 2600~2900 k t0 s5 s0 r5 4200~4500 k t0 s5 s0 r5 2900~3200 k cct *notes : all measurements were made under the standardized environment of ssc. [1] the leds are sorted based on luminous intensity measurements. [2] the typical lumen values are included for reference only. available ranks not yet available ranks
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 6. labeling # 1 # 2 # 3 - #1 : luminous intensity : iv [ cd ] - #2 : color coordinates : x, y - #3 : forward voltage : v f [v] rank x 1 x 2 - x 3 x 4 - x 5 - x 6 x 7 - x 8 full code form : - x 1 : company - x 2 : kind of led - x 3 x 4 : cri group - x 5 : package series - x 6 x 7 : characteristic code - x 8 : version
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 7. packing 1 side outer box structure material : paper(sw3b(b)) ? ? ? humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type size (mm) ? ? ? 7inch 245 220 102 245 220 142
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 180 2 13 22 60 15.4 1.0 13 0.3 ( tolerance: 0.2, unit: mm ) 1) quantity : 3500pcs/reel 2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm 3) adhesion strength of cover tape : adhesion strength to be 0.1 - 0.7n when the cover tape is turned off from the carrier tape at the angle of 10 ? to the carrier tape. 4) package : p/n, manufacturing data code no. and quantity to be in dicated on a damp proof package. 7. packing
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 8. recommended solder pad notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.1mm this drawing without tolerances are for reference only.
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 23 23 9. soldering * caution 1. reflow soldering is recommended not to be done more t han two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. 2. repairs should not be done after the leds have been soldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds during heating. 5. after soldering, do not warp the circuit board. ipc/jedec j - std - 020 profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate ( tsmax to tp ) 3 c/second max. 3 c/second max. preheat - temperature min ( tsmin ) - temperature max ( tsmax ) - time ( tsmin to tsmax ) ( ts ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (tl) - time ( tl ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak temperature ( tp ) 215 260 time within 5 c of actual peak temperature (tp)2 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 10. precaution for use (1) storage to avoid the moisture penetration, we recommend store in a dry box with a desiccant . the recommended storage temperature range is 5c to 30c and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smd techniques when the led is to be soldered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 4 week(msl_2a) or the c olor of the desiccant changes, components should be dried for 10 - 12hr at 60 5 (3) do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components sh ould not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products list ed here in. (7) gallium arsenide is used in some of the products listed in t his publication. these products are dangerous if they are burned or shredded in the process of d isposal. it is also dangerous to drink the liquid or inhale the gas generated by such products w hen chemically disposed of. (8) this device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (9) when the leds are in operation the maximum current should be decided after me asuring the package temperature. (10) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from ssc, a sealed container with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the product may be mod ified for improvement without notice. (12) long time exposure of sunlight or occasional uv exposure will ca use lens discoloration. (13) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a significant loss of light o utput from the fixture. knowledge of the properties of the materials selected to be use d in the construction of fixtures can help prevent these issues. (14)attaching leds , do not use adhesives that outgas organic vapor. (15)the driving circuit must be designed to allow forward voltag e only when it is on or off. if the reverse voltage is applied to led, migration can be gener ated resulting in led damage.
z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW9Q14B STW9Q14B september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com (1) during processing, mechanical stress on the surface should b e minimized as much as possible. sharp objects of all types should not be used to pierce the seal ing compound. (2) in general, leds should only be handled from the side. by the way, this also app lies to leds without a silicone sealant, since the surface can also become sc ratched. (3) when populating boards in smt production, there are basicall y no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on th e surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is la rger than the led s reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds . these conditions must be considered during the handling of such devices. compared to standard encapsulants , silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requ ires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components . (5) ssc suggests using isopropyl alcohol for cleaning. in case o ther solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another resin (epoxy, u rethane, etc) and do not handle this. product with acid or sulfur material in sealed space. 11. handling of silicone resin leds


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