publication order number: bat54slt1/d ? semiconductor components industries, llc, 2004 september, 2004 ? rev. 2 1 bat54clt1 preferred device dual series schottky barrier diodes these schottky barrier diodes are designed for high speed switching applications, circuit protection, and voltage clamping. extremely low forward voltage reduces conduction loss. miniature surface mount package is excellent for hand?held and portable applications where space is limited. features ? pb?free package is available ? extremely fast switching speed ? low forward voltage ? 0.35 volts (typ) @ i f = 10 madc maximum ratings (t j = 125 c unless otherwise noted) rating symbol value unit reverse voltage v r 30 v forward power dissipation @ t a = 25 c derate above 25 c p f 225 1.8 mw mw/ c thermal resistance, junction-to-ambient r ja 508 (note 1) 311 (note 2) c/w forward current (dc) i f 200 max ma junction temperature t j 125 max c storage temperature range t stg ?55 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. fr?4 @ minimum pad. 2. fr?4 @ 1.0 x 1.0 inch pad. 30 volt dual common cathode schottky barrier diodes 3 cathode 1 anode 2 anode device package shipping 2 ordering information bat54clt1 sot?23 3000/tape & reel preferred devices are recommended choices for future use and best overall value. marking diagram 3 12 5c m 1 2 3 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. sot?23 case 318 style 9 bat54clt1g sot?23 (pb?free) 3000/tape & reel http://onsemi.com 5c = device code m = date code
bat54clt1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) (each diode) characteristic symbol min typ max unit reverse breakdown voltage (i r = 10 a) v (br)r 30 ? ? v total capacitance (v r = 1.0 v, f = 1.0 mhz) c t ? 7.6 10 pf reverse leakage (v r = 25 v) i r ? 0.5 2.0 adc forward voltage (i f = 0.1 madc) v f ? 0.22 0.24 vdc forward voltage (i f = 30 madc) v f ? 0.41 0.5 vdc forward voltage (i f = 100 madc) v f ? 0.52 0.8 vdc reverse recovery time (i f = i r = 10 madc, i r(rec) = 1.0 madc, figure 1) t rr ? ? 5.0 ns forward voltage (i f = 1.0 madc) v f ? 0.29 0.32 vdc forward voltage (i f = 10 madc) v f ? 0.35 0.40 vdc forward current (dc) i f ? ? 200 madc repetitive peak forward current i frm ? ? 300 madc non?repetitive peak forward current (t < 1.0 s) i fsm ? ? 600 madc
bat54clt1 http://onsemi.com 3 c t , total capacitance (pf) notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 10 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 10 ma. notes: 3. t p ? t rr +10 v 2 k 820 0.1 f dut v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 1 ma output pulse (i f = i r = 10 ma; measured at i r(rec) = 1 ma) i f input signal figure 1. recovery time equivalent test circuit 100 0.0 0.1 v f , forward voltage (volts) 0.2 0.3 0.4 0.5 10 1.0 0.1 85 c 10 0 v r , reverse voltage (volts) 1.0 0.1 0.01 0.001 510 15 20 25 14 0 v r , reverse voltage (volts) 12 4 2 0 51015 30 figure 2. forward voltage figure 3. leakage current figure 4. total capacitance ?40 c 25 c t a = 150 c t a = 125 c t a = 85 c t a = 25 c 0.6 ?55 c 150 c 125 c 100 1000 30 25 20 6 8 10 i r , reverse current ( a) i f , forward current (ma)
bat54clt1 http://onsemi.com 4 package dimensions style 9: pin 1. anode 2. anode 3. cathode sot?23 (to?236) plastic package case 318?08 issue aj mm inches 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* d j k l a c b s h g v 3 1 2 dim a min max min max millimeters 0.1102 0.1197 2.80 3.04 inches b 0.0472 0.0551 1.20 1.40 c 0.0350 0.0440 0.89 1.11 d 0.0150 0.0200 0.37 0.50 g 0.0701 0.0807 1.78 2.04 h 0.0005 0.0040 0.013 0.100 j 0.0034 0.0070 0.085 0.177 k 0.0140 0.0285 0.35 0.69 l 0.0350 0.0401 0.89 1.02 s 0.0830 0.1039 2.10 2.64 v 0.0177 0.0236 0.45 0.60 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318?03 and ?07 obsolete, new standard 318?08. on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 bat54clt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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