1 ?2012 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com for current information. tvs diode arrays (spa ? family of products) revision: august 14, 2012 tvs diode arrays (spa ? family of products) revision: august 14, 2012 lightning surge protection - SP3304N series SP3304N SP3304N description applications the SP3304N integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive i/o pins against lightning induced surge events and esd. this robust device can safely absorb up to 20a per iec61000-4-5 (t p =8/20s) without performance degradation and a minimum 30kv esd per iec61000-4-2 international standard. the low loading capacitance makes the sp4062 ideal for protecting high-speed signal pins. features ? esd, iec61 000-4-2, 30kv contact, 30kv air ? eft, iec61 000-4-4, 40a (t p =5/50ns) ? lightning, iec61 000-4-5, 20a (t p =8/20s) ? lo w capacitance of 3.5pf (typ) per i/o ? lo w leakage current of 1a (max) at 3.3v ? 10/100/1000 ethernet interfaces ? customer premise equipment (cpe) ? voip phones ? set top boxes ? pbx systems functional block diagram gnd 13 97 5 pinout 13 5 79 gnd life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. application example j1 j8 rj-45 connector *package is shown as transparent ethernet phy tx+ tx- rx- rx+ SP3304N phy SP3304N series 3.3v 20a diode array rohs pb green
?2012 littelfuse, inc. specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. tvs diode arrays (spa ? family of products) revision: august 14, 2012 2 tvs diode arrays (spa ? family of products) revision: august 14, 2012 lightning surge protection - SP3304N series SP3304N series sp4062 caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 20.0 a p pk peak pulse power (t p =8/20s) 300 w t op operating temperature -40 to 85 oc t stor storage temperature -50 to 150 c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm 3.3 v snap back voltage v sb i sb =50ma 2.8 v reverse leakage current i leak v r =2.5v, i/o to gnd 0.5 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 6.0 v i pp =5a, t p =8/20s, fwd 7. 0 v i pp =10a, t p =8/20s, fwd 8.0 v i pp =20a, t p =8/20s, fwd 11. 5 v dynamic resistance r dyn (v c2 -v c1 )/(i pp2 -i pp1 ) 0.25 ? esd withstand voltage 1 v esd iec61000-4-2 (contact) 30 kv iec61000-4-2 (air) 30 kv diode capacitance 1 c i/o-gnd reverse bias=0v 3.5 5.0 pf diode capacitance 1 c i/o-i/o reverse bias=0v 2.0 pf note: 1. parameter is guaranteed by design and/or device characterization. thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 20-40s) 260 c clamping voltage vs. i pp pulse waveform 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp 0 5 10 15 20 peak pulse current-i pp (a) 0.0 2.0 4.0 6.0 10.0 12.0 clamp voltage (v c ) 8.0
3 ?2012 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com for current information. tvs diode arrays (spa ? family of products) revision: august 14, 2012 tvs diode arrays (spa ? family of products) revision: august 14, 2012 lightning surge protection - SP3304N series SP3304N SP3304N capacitance vs. bias bi as vo lt age (v) capacitance (pf) 0.0 1.0 2.0 3.0 4.0 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 ti me temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters ordering information part number package marking min. order qty. SP3304Nutg dfn-10 uh4 3000 part numbering system part marking system sp 3304n u t g series package u= dfn-10 t= tape & reel g= green silicon protection array (spa tm ) family of tvs diode arrays u * 4 product series u = SP3304N assembly site number o f channels product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) substitute material silicon body material molded epoxy flammability ul 94 v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. package surface matte fnish vdi 11-13.
?2012 littelfuse, inc. specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. tvs diode arrays (spa ? family of products) revision: august 14, 2012 4 tvs diode arrays (spa ? family of products) revision: august 14, 2012 lightning surge protection - SP3304N series SP3304N series package dimensions dfn-1 0 package dfn-10 (2.6x2.6mm) jedec mo-229 symbol millimeters inches min nom max min nom max a 0.45 0.50 0.55 0.018 0.020 0.022 a3 0.130 ref 0.005 ref b 0.17 0.22 0.27 0.006 0.008 0.010 d 2.50 2.60 2.70 0.097 0.101 0.105 d2 2.10 2.15 2.20 0.081 0.083 0.085 e 2.50 2.60 2.70 0.097 0.101 0.105 e2 1.21 1.26 1.31 0.046 0.049 0.051 e 0.50 bsc 0.020 bsc l 0.35 0.40 0.45 0.014 0.016 0.018 d e b top view a a bottom view 0.10 c b a3 c seating plane side view 0.10 c b m a 0.05 c e d2 e2 2x c embossed carrier tape & reel specifcation dfn-10 (2.6x2.6mm) t b0 k0 p2 d0 e f p0 p1 d1 w 5o max a0 5o max user f eeding direc tion pin 1 location symbol millimeters a0 2.82 +/- 0.05 b0 2.82 +/- 0.05 d0 ?1.50 + 0.10 d1 ? 0.50 + 0.05 e 1.75 +/- 0.10 f 3.50 +/- 0.05 k0 0.76 +/- 0.05 p0 4.00 +/- 0.10 p1 4.00 +/- 0.10 p2 2.00 +/- 0.05 t 0.25 +/- 0.02 w 8.00 + 0.30 /- 0.10 recommended solder pads dfn-10l 2.6x2.6mm b cf x p gz y dimension symbol millimeters inches b 2.30 0.091 c 2.20 0.087 f 1.41 0.056 g 1.65 0.065 p 0.50 0.020 x 0.37 0.015 y 0.55 0.022 z 2.75 0.108
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