i ntegrated c ircuits d ivision FDA217 dual mosfet driver www.ixysic.com ds-FDA217-r01 1 rohs 2002/95/ec e 3 pb part # description FDA217 8-lead dip (50/tube) FDA217s 8-lead surface mount (50/tube) FDA217str 8-lead surface mount (1000/reel) parameter rating units open circuit voltage 12 v short circuit current 4.5 ? a input control current 5 ma applications features description ordering information pin configuration ? mosfet driver ? programmable control ? process control ? instrumentation ? telecommunications ? solid state relays ? isolated switching ? floating power supplies ? dual independent, floating outputs for parallel, series, or isolated configuration ? replacement of discrete components ? 5ma control current ? no emi/rfi generation ? solid state reliability ? high input to output isolation: 3750v rms ? machine insertable, wave solderable ? surface mount and tape & reel version available the FDA217 is a dual photovoltaic mosfet driver. each independent driver consists of an led that is optically coupled to a photodiode array. the driver output is controlled by means of the highly effective gaalas infrared led at the input. when the input current is applied to the led, the light emitted activates the photodiode array, and generates the voltage at the output. the photodiode array is capable of generating a floating power source with voltage and current sufficient to drive high-power mosfet transistors. each photodiode array contains an integrated turn-off circuit that discharges the external mosfet gate when led current is removed. this eliminates the need to use external components to facilitate the discharge. the optically coupled technology provides 3750v rms of input to output isolation. the FDA217 is well suited for use in discrete solid state relay designs and in other isolated switching applications. 1 input output input output + C C + C + + C 2 3 4 8 7 6 5 pv pv approvals ? ul 1577 pending ? en/iec 60950 certified component: tuv certificate: b 09 07 49410 004
i ntegrated c ircuits d ivision www.ixysic.com 2 r01 FDA217 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter ratings units reverse input voltage 5 v input control current peak (10ms) 50 ma 1a input power dissipation 1 140 mw total power dissipation 2 500 mw esd rating, human body model 8 kv isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / oc 2 derate linearly 6.67 mw / oc parameter conditions symbol min typ max units output characteristics open circuit voltage i f =5ma v oc 10.5 11.75 15.3 v short circuit current i f =5ma i sc 2.5 4.5 - ? a i f =10ma 5 9 i f =15ma 7.5 13.5 i f =20ma 10 18.5 i f =30ma 15 27 switching speeds turn-on i f =5ma, v load =5v, c load =200pf t on --2 ms turn-off t off - - 0.5 offstate resistance v l =1v r 100 770 3300 ? input characteristics led current to activate i sc =2.5 ? ai f - 3.8 5 ma input voltage drop i f =5ma v f 0.9 1.26 1.4 v reverse input current v r =5v i r - - 10 a common characteristics capacitance, input to output - - - 3 - pf electrical characteristics @ 25oc
i ntegrated c ircuits d ivision FDA217 www.ixysic.com 3 r01 performance data (@ 25 o c unless otherwise noted) * *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. led forward voltage (v) 1.250 1.255 1.260 1.265 1.270 1.275 device count (n) 0 5 10 15 20 25 typical led forward voltage (n=50, i f =5ma) open-circuit voltage (v) 11.35 11.45 11.55 11.65 11.75 11.85 11.95 device count (n) 0 5 10 15 20 typical open-circuit voltage (n=50, i f =5ma) short circuit current ( p a) 3.7 4.0 4.3 4.6 4.9 5.2 5.5 device count (n) 0 5 10 15 20 typical short-circuit current (n=50, i f =5ma) forward voltage (v) 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 forward current (ma) 0 10 20 30 40 50 led forward voltage vs. forward current load capacitance (pf) 0 2000 4000 6000 8000 10000 12000 turn-on time (ms) 0 2 4 6 8 10 12 turn-on time vs. load capacitance (v out =5v) i f =5ma i f =10ma i f =20ma i f =50ma load capacitance (pf) 0 2000 4000 6000 8000 10000 12000 turn-off time (ms) 0.10 0.12 0.14 0.16 0.18 0.20 0.22 turn-off time vs. load capacitance (v out =5v) i f =50ma i f =20ma i f =10ma i f =5ma temperature (oc) -40 -20 0 20 40 60 80 100 led forward voltage (v) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 led forward voltage vs. temperature i f =5ma i f =2ma i f =1ma i f =50ma i f =20ma i f =10ma temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time ( p s) 0 100 200 300 400 500 600 700 turn-on time vs. temperature (v out =5v, c l =200pf) i f =5ma i f =10ma i f =20ma i f =50ma temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time ( p s) 70 80 90 100 110 120 130 140 turn-off time vs. temperature (v out =5v, c l =200pf) i f =50ma i f =20ma i f =10ma i f =5ma temperature (oc) -40 -20 0 20 40 60 80 100 open-circuit voltage (v) 6 8 10 12 14 16 18 20 open-circuit voltage vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma temperature (oc) -40 -20 0 20 40 60 80 100 short-circuit current ( p a) 0 10 20 30 40 50 short-circuit current vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma temperature (oc) -40 -20 0 20 40 60 80 100 output resistance ( : ) 600 650 700 750 800 850 900 offstate output resistance vs. temperature (v l =1v, internal to photovoltaic driver)
i ntegrated c ircuits d ivision www.ixysic.com 4 r01 FDA217 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating FDA217 / FDA217s msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time FDA217 / FDA217s 250oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. rohs 2002/95/ec e 3 pb
i ntegrated c ircuits d ivision ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. for additional information please visit our website at: www.ixysic.com FDA217 5 specification: ds-FDA217-r01 ?copyright 2012, ixys integrated circuits division optomos? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 5/9/2012 mechanical dimensions dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.889 0.102 (0.035 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) 0.254 typ (0.01) pin 1 FDA217 dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.120 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1 FDA217s dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) FDA217s tape & reel
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