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  absolute maximum ratings parameter units i d @ v gs = 10v, t c = 25c continuous drain current 22* i d @ v gs = 10v, t c = 100c continuous drain current 22* i dm pulsed drain current ? 88 p d @ t c = 25c max. power dissipation 50 w linear derating factor 0.4 w/c v gs gate-to-source voltage 20 v e as single pulse avalanche energy ? 66 mj i ar avalanche current ? 22 a e ar repetitive avalanche energy ? 5.0 mj dv/dt p eak diode recovery dv/dt ? 2.2 v/ns t j operating junction -55 to 150 t stg storage temperature range package mounting surface temp. 300 (for 5s) weight 1.0 (typical) g o c a 04/24/02 www.irf.com 1 product summary part number bv dss r ds(on) i d IRF7NJZ44V 60v 0.0165 ? 22a* for footnotes refer to the last page hexfet ? power mosfet IRF7NJZ44V surface mount (smd-0.5) 60v, n-channel seventh generation hexfet ? power mosfets from international rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon unit area. this benefit, combined with the fast switching speed and ruggedized device design that hexfet power mosfets are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. these devices are well-suited for applications such as switching power supplies, motor controls, invert- ers, choppers, audio amplifiers and high-energy pulse circuits. features:  low r ds(on)  avalanche energy ratings  dynamic dv/dt rating  simple drive requirements  ease of paralleling  hermetically sealed  surface mount  light weight smd-0.5 * current is limited by package and internal wires pd - 94433
IRF7NJZ44V 2 www.irf.com electrical characteristics @ tj = 25c (unless otherwise specified) parameter min typ max units test conditions bv dss drain-to-source breakdown voltage 60 ? ? v v gs = 0v, i d = 250 a ? bv dss / ? t j temperature coefficient of breakdown ? 0.056 ? v/c reference to 25c, i d = 1.0ma voltage r ds(on) static drain-to-source on-state ? ? 0.0165 ? v gs = 10v, i d = 22a resistance v gs(th) gate threshold voltage 2.0 ? 4.0 v v ds = v gs , i d = 250 a g fs forward transconductance 24 ? ? s ( )v ds =15v, i ds = 22a ? i dss zero gate voltage drain current ? ? 25 v ds = 60v ,v gs =0v ? ? 250 v ds = 48v, v gs = 0v, t j =125c i gss gate-to-source leakage forward ? ? 100 v gs =-20v i gss gate-to-source leakage reverse ? ? -100 v gs = -20v q g total gate charge ? ? 67 v gs =10v, i d = 22a q gs gate-to-source charge ? ? 18 nc v ds = 48v q gd gate-to-drain (?miller?) charge ? ? 25 t d (on) turn-on delay time ? ? 20 v dd = 30v, i d = 22a, t r rise time ? ? 120 v gs = 10v, r g = 7.5 ? t d (off) turn-off delay time ? ? 60 t f fall time ? ? 90 l s + l d total inductance ? 4.0 ? measured from the center of drain l pad to the center of source pad c iss input capacitance ? 1723 ? v gs = 0v, v ds = 25v c oss output capacitance ? 370 ? p f f = 1.0mhz c rss reverse transfer capacitance ? 70 ? na ? ? nh ns a thermal resistance parameter min typ max units test conditions r thjc junction-to-case ? ? 2.5 c/w note: corresponding spice and saber models are available on the g&s website. for footnotes refer to the last page source-drain diode ratings and characteristics parameter min typ max units test conditions i s continuous source current (body diode) ? ? 22* i sm pulse source current (body diode) ? ?? 88 v sd diode forward voltage ? ? 1.5 v t j = 25c, i s = 22a, v gs = 0v ? t rr reverse recovery time ? ? 105 ns t j = 25c, i f = 22a, di/dt 100a/ s q rr reverse recovery charge ? ? 250 nc v dd 25v ? t on forward turn-on time intrinsic turn-on time is negligible. turn-on speed is substantially controlled by l s + l d . a * current is limited by package and internal wires
www.irf.com 3 IRF7NJZ44V fig 4. normalized on-resistance vs. temperature fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics 15 0.1 1 10 100 1000 0.1 1 10 100  20s pulse width t = 25 c j  top bottom vgs 15v 10v 8.0v 7.0v 6.0v 5.5v 5.0v 4.5v v , drain-to-source voltage (v) i , drain-to-source current (a) ds d 4.5v 1 10 100 1000 0.1 1 10 100  20s pulse width t = 150 c j  top bottom vgs 15v 10v 8.0v 7.0v 6.0v 5.5v 5.0v 4.5v v , drain-to-source voltage (v) i , drain-to-source current (a) ds d 4.5v -60 -40 -20 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 t , junction temperature ( c) r , drain-to-source on resistance (normalized) j ds(on)   v = i = gs d 10v 22a 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 v gs , gate-to-source voltage (v) 1 10 100 i d , drain-to-source current ( ) t j = 25c t j = 150c v ds = 25v 20s pulse width
IRF7NJZ44V 4 www.irf.com fig 8. maximum safe operating area fig 6. typical gate charge vs. gate-to-source voltage fig 5. typical capacitance vs. drain-to-source voltage fig 7. typical source-drain diode forward voltage 0 20 40 60 80 0 4 8 12 16 20 q , total gate charge (nc) v , gate-to-source voltage (v) g gs   for test circuit see figure i = d 13 22a  v = 12v ds v = 30v ds v = 48v ds 0.1 1 10 100 0.4 0.6 0.8 1.0 1.2 1.4 v ,source-to-drain voltage (v) i , reverse drain current (a) sd sd  v = 0 v gs  t = 25 c j  t = 150 c j 1 10 100 1000 v ds , drain-tosource voltage (v) 0.1 1 10 100 1000 i d , drain-to-source current (a) tc = 25c tj = 150c single pulse 1ms 1 0ms operation in this area limited by r ds (on) 100s 1 10 100 0 500 1000 1500 2000 2500 3000 v , drain-to-source voltage (v) c, capacitance (pf) ds  v c c c = = = = 0v, c c c f = 1mhz + c + c c shorted gs iss gs gd , ds rss gd oss ds gd
www.irf.com 5 IRF7NJZ44V fig 10b. switching time waveforms fig 11. maximum effective transient thermal impedance, junction-to-case fig 9. maximum drain current vs. case temperature fig 10a. switching time test circuit v ds pulse width 1 s duty factor 0.1 % r d v gs r g d.u.t. + - v dd v gs v ds 90% 10% v gs t d(on) t r t d(off) t f 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1  notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thjc c  p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thjc 0.01 0.02 0.05 0.10 0.20 d = 0.50  single pulse (thermal response) 25 50 75 100 125 150 0 10 20 30 40 t , case temperature ( c) i , drain current (a) c d  limited by package
IRF7NJZ44V 6 www.irf.com fig 12c. maximum avalanche energy vs. drain current fig 12b. unclamped inductive waveforms fig 12a. unclamped inductive test circuit fig 13b. gate charge test circuit fig 13a. basic gate charge waveform q g q gs q gd v g charge 10v r g i as 0.01 ? t p d.u.t l v ds + - v dd driver a 15v 20v . v gs t p v (br)dss i as d.u.t. v ds i d i g 3ma v gs .3 f 50k ? .2 f 12v current regulator same type as d.u.t. current sampling resistors + - 25 50 75 100 125 150 0 20 40 60 80 100 120 starting t , junction temperature ( c) e , single pulse avalanche energy (mj) j as  i d top bottom 10a 14a 22a
www.irf.com 7 IRF7NJZ44V ir world headquarters: 233 kansas st., el segundo, california 90245, usa tel: (310) 252-7105 tac fax: (310) 252-7903 visit us at www.irf.com for sales contact information . data and specifications subject to change without notice. 04/02  repetitive rating; pulse width limited by maximum junction temperature.  i sd 22a, di/dt 278a/ s, v dd 22v, t j 150c  pulse width 300 s; duty cycle 2%  v dd = 25 v, starting t j = 25c, l= 0.27mh peak i as = 22a, v gs = 10v, r g = 25 ? footnotes: case outline and dimensions ? smd-0.5 pad assignments


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