1. product pro?le 1.1 general description planar low capacitance schottky barrier diodes with an integrated guard ring for stress protection, encapsulated in very small smd plastic packages. 1.2 features n very low diode capacitance n low forward voltage n very small smd plastic packages. 1.3 applications n digital applications: u ultra high-speed switching u clamping circuits. n rf applications: u diode ring mixer u rf detector u rf voltage doubler. 1.4 quick reference data 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes rev. 03 24 november 2004 product data sheet table 1: product overview type number package con?guration philips jeita 1PS66SB62 sot666 - triple isolated diode 1ps76sb62 sod323 sc-76 single diode table 2: quick reference data symbol parameter conditions min typ max unit i f forward current - - 20 ma v r reverse voltage - - 40 v c d diode capacitance v r = 0 v; f = 1 mhz - - 0.6 pf
9397 750 13845 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 24 november 2004 2 of 10 philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information 4. marking table 3: pinning pin description simpli?ed outline symbol 1PS66SB62 (sot666) 1 anode (diode 1) 2 anode (diode 2) 3 anode (diode 3) 4 cathode (diode 3) 5 cathode (diode 2) 6 cathode (diode 1) 1ps76sb62 (sod323) 1 cathode [1] 2 anode sot666 123 4 5 6 6 1 5 2 4 3 sym046 2 1 sym001 12 table 4: ordering information type number package name description version 1PS66SB62 - plastic surface mounted package; 6 leads sot666 1ps76sb62 sc-76 plastic surface mounted package; 2 leads sod323 table 5: marking codes type number marking code 1PS66SB62 n3 1ps76sb62 s6
9397 750 13845 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 24 november 2004 3 of 10 philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes 5. limiting values 6. thermal characteristics [1] for schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses p r are a signi?cant part of the total power losses. nomograms for determining the reverse power losses p r and i f(av) rating will be available on request. [2] refer to sot666 standard mounting conditions. [3] re?ow soldering is the only recommended soldering method. [4] refer to sod323 (sc-76) standard mounting conditions. 7. characteristics [1] pulse test: t p 300 m s; d 0.02. table 6: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage - 40 v i f forward current - 20 ma t j junction temperature - 125 c t amb ambient temperature - 65 +125 c t stg storage temperature - 65 +150 c table 7: thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] sot666 [2] [3] - - 700 k/w sod323 [4] - - 450 k/w table 8: characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit v f forward voltage i f = 2 ma; see figure 1 [1] - - 800 mv i r reverse current v r = 40 v; see figure 2 [1] --1 m a c d diode capacitance v r = 0 v; f = 1 mhz; see figure 3 - - 0.6 pf
9397 750 13845 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 24 november 2004 4 of 10 philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes (1) t amb = 125 c. (2) t amb =85 c. (3) t amb =25 c. (1) t amb = 125 c. (2) t amb =85 c. (3) t amb =25 c. fig 1. forward current as a function of forward voltage; typical values fig 2. reverse current as a function of reverse voltage; typical values t amb =25 c; f = 1 mhz. fig 3. diode capacitance as a function of reverse voltage; typical values 2 0 (1) (2) v f (v) i f (ma) 0.4 0.8 1.2 1.6 10 1 10 - 1 10 - 2 mld553 (3) 40 20 10 0 (1) (2) (3) v r (v) i r (na) 30 mld554 10 4 10 3 10 2 10 1 10 - 1 0 v r (v) c d (pf) 10 20 40 0.40 0.20 0.36 30 0.32 0.28 0.24 mld555
9397 750 13845 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 24 november 2004 5 of 10 philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes 8. package outline fig 4. package outline sot666 unit b p cd e e 1 h e l p w references outline version european projection issue date 01-08-27 04-11-08 iec jedec jeita mm 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 0.5 e 1.0 1.7 1.5 0.1 y 0.1 dimensions (mm are the original dimensions) 0.3 0.1 sot666 b p pin 1 index d e 1 e a l p detail x h e e a s 0 1 2 mm scale a 0.6 0.5 c x 123 4 5 6 plastic surface mounted package; 6 leads sot666 ys w m a
9397 750 13845 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 24 november 2004 6 of 10 philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes fig 5. package outline sod323 (sc-76) references outline version european projection issue date iec jedec jeita sod323 sc-76 sod323 99-09-13 03-12-17 note 1. the marking bar indicates the cathode unit a mm 0.05 1.1 0.8 0.40 0.25 0.25 0.10 1.8 1.6 1.35 1.15 2.7 2.3 0.45 0.15 a 1 max dimensions (mm are the original dimensions) plastic surface mounted package; 2 leads 01 (1) 2 1 2 mm scale b p c d e h d q 0.25 0.15 l p v 0.2 a d a e l p b p detail x a 1 c q h d va m x
9397 750 13845 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 24 november 2004 7 of 10 philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes 9. packing information [1] for further information and the availability of packing methods see section 14 . table 9: packing methods the -xxx numbers are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 4000 10000 1PS66SB62 sot666 4 mm pitch, 8 mm tape and reel - -115 - 1ps76sb62 sod323 4 mm pitch, 8 mm tape and reel -115 - -135
9397 750 13845 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 24 november 2004 8 of 10 philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes 10. revision history table 10: revision history document id release date data sheet status change notice doc. number supersedes 1PS66SB62_ 1ps76sb62_3 20041124 product data sheet - 9397 750 13845 1ps76sb62_2 modi?cations: ? the format of this data sheet has been redesigned to comply with the new presentation and information standard of philips semiconductors. ? type number 1PS66SB62 added ? section 1.1 : text rede?ned ? section 1.2 : text rede?ned ? section 1.3 : rf applications added ? t ab le 2 : table added ? t ab le 9 : table added. 1ps76sb62_2 20040126 product speci?cation - 9397 750 12622 1ps76sb62_1 1ps76sb62_1 20010216 product speci?cation - 9397 750 08024 -
philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes 9397 750 13845 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 24 november 2004 9 of 10 11. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 12. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 13. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 14. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 24 november 2004 document number: 9397 750 13845 published in the netherlands philips semiconductors 1PS66SB62; 1ps76sb62 40 v, 20 ma low c d schottky barrier diodes 15. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 packing information. . . . . . . . . . . . . . . . . . . . . . 7 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 9 12 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 contact information . . . . . . . . . . . . . . . . . . . . . 9
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