doc. no : qw0905-L9SEFG5162-PF rev. : a date : 31 - oct. - 2007 pb data sheet L9SEFG5162-PF lead-free parts bipolar type led lamps ligitek electronics co.,ltd. property of ligitek only
25.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.0min 2.54typ directivity radiation 1.5 max 1 0.5 typ 2 7.0 5.0 package dimensions part no. L9SEFG5162-PF 2.8 0.7 g 1 2 9sef 2.0 page 1/6 ligitek electronics co.,ltd. property of ligitek only 60 30 0 100% 50% 0 25%75% -30 -60 50% 100%75%25%
electrostatic discharge operating temperature typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. L9SEFG5162-PF part no algainp material storage temperature reverse current @5v dominant wave length dnm luminous intensity @20ma(mcd) viewing angle 2 1/2 (deg) spectral halfwidth nm forward voltage @20ma(v) color orange emitted lens 60517 2.6 max. 1.7 min. 90 min. 144 160 typ. 2000 -40 ~ +100 -40 ~ +85 tstg esd t opr ir 10 v a absolute maximum ratings at ta=25 forward current power dissipation peak forward current duty 1/10@10khz parameter 9sef ratings ligitek electronics co.,ltd. property of ligitek only i fp pd i f symbol 60 75 30 ma mw ma unit page 2/6 g 30 120 100 10 ---- * * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. part no. L9SEFG5162-PF gap green white diffused 565301.72.6915144 peak wave length pnm ---- ----
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 typical electro-optical characteristics curve 9sef chip page3/6 part no. L9SEFG5162-PF
-40 1.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve fig.4 relative intensity vs. temperature fig.3 forward voltage vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 0.0 500550650 600 0.5 0.0 0.8 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.5 relative intensity vs. wavelength 1.0 20 ambient temperature( ) 0 -20 -4080 60 40100 2.0 1.1 0.9 1.0 1.0 0.5 1.5 1.2 3.0 2.5 2.5 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) 0.0 forward voltage(v) 0.1 2.0 1.04.0 3.05.0 1.0 10 0.5 1.0 1.5 2.0 fig.1 forward current vs. forward voltage 1000 100 3.5 3.0 g chip 100 ambient temperature( ) 020 -20 6080 40 1000 forward current(ma) 10100 page 4/6 part no. L9SEFG5162-PF
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 120 0 0 25 260 temp( c) 150 time(sec) preheat 50 2 /sec max 100 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) page 5/6 ligitek electronics co.,ltd. property of ligitek only part no. L9SEFG5162-PF
1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) solderability test solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. thermal shock test high temperature high humidity test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs low temperature storage test high temperature storage test operating life test test itemtest condition reliability test: mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard page 6/6 ligitek electronics co.,ltd. property of ligitek only part no. L9SEFG5162-PF
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