doc. no : qw0905-la95b/dbk.x-pf rev. : a date : 20- mar. - 2008 pb data sheet lead-free parts la95b/dbk.x-pf led array ligitek electronics co.,ltd. property of ligitek only
25.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.0min 2.54typ 0.5 typ 2.9 3.1 3.3 4.3 1.5max ldbk2640/h la95b/dbk.x-pf part no. page 1/5 package dimensions ligitek electronics co.,ltd. property of ligitek only + - 9.0 x 3.2 0.3 + - 7.5 0.5 2.9x2 5.08 dbk 4.4 9.6 3.2 0.3
ligitek electronics co.,ltd. property of ligitek only page t opr -20 ~ +80 operating temperature note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) tstg storage temperature -30 ~ +100 30 ma i f forward current i fp pd ir esd reverse current @5v electrostatic discharge( * ) power dissipation peak forward current duty 1/10@10khz 150 50 v a 120 100 mw ma symbol absolute maximum ratings at ta=25 parameter ratings dbk unit 2/5 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * min. max. typ. typ. dominant wave length dnm luminous intensity @20ma(mcd) viewing angle 2 1/2 (deg) forward voltage @20ma(v) spectral halfwidth nm color lens emitted part no material ingan/gan blue blue diffused 470 30 3.5 4.0 22045038 la95b/dbk.x-pf part no. la95b/dbk.x-pf
100 r e l a t i v e i n t e n s i t y @ 2 0 m a 1.0 wavelength (nm) 500 0.0 400450 0.5 550 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 ambient temperature( ) fig.5 relative intensity vs. wavelength 2040 -40-200 0.8 6080100-40 0.0 4080 60 -20020 ambient temperature( ) fig.3 forward voltage vs. temperature 1.0 0.9 1.1 1.2 2.5 1.5 1.0 2.0 fig.4 relative intensity vs. temperature 3.0 fig.2 relative intensity vs. forward current 1000 ligitek electronics co.,ltd. property of ligitek only f o r w a r d c u r r e n t ( m a ) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 2.0 1.0 0 1 3.0 10 1 100 0.5 4.05.0 0.0 1 forward current(ma) 10100 1.5 1.0 2.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 1000 dbk chip 2.5 3.0 3/5 page part no. la95b/dbk.x-pf
260 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 0 50 preheat 0 25 120 2 /sec max 100 150 time(sec) 5 /sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) if holder-set operation pcb 0.5 mm above holder expor be explain that holder press-tep : 120 max. temp( c) 2.wave soldering profile 260 c3sec max ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. la95b/dbk.x-pf
the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description reliability test: 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test solder resistance test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs thermal shock test high temperature high humidity test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition test item operating life test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 5/5 part no. la95b/dbk.x-pf
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