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PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier Rev. 01 -- 15 May 2009 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I I I I I Average forward current: IF(AV) 0.2 A Reverse voltage: VR 30 V Low forward voltage AEC-Q101 qualified Small and flat lead SMD plastic package 1.3 Applications I I I I I I Low voltage rectification High efficiency DC-to-DC conversion Switch Mode Power Supply (SMPS) Reverse polarity protection Ultra high-speed switching Low power consumption applications 1.4 Quick reference data Table 1. Quick reference data Tj = 25 C unless otherwise specified. Symbol IF(AV) Parameter average forward current Conditions square wave; = 0.5; f = 20 kHz Tamb 135 C Tsp 145 C VR VF IR [1] [1] Min Typ Max Unit - 420 10 0.2 0.2 30 480 40 A A V mV A reverse voltage forward voltage reverse current IF = 0.2 A VR = 30 V Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 2. Pinning information Table 2. Pin 1 2 Pinning Description cathode anode [1] Simplified outline 1 2 Graphic symbol 1 2 sym001 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Package Name PMEG3002EJ SC-90 Description plastic surface-mounted package; 2 leads Version SOD323F Type number 4. Marking Table 4. Marking codes Marking code 1M Type number PMEG3002EJ 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF(AV) Parameter reverse voltage average forward current Conditions Tj = 25 C square wave; = 0.5; f = 20 kHz Tamb 135 C Tsp 145 C IFRM IFSM Ptot repetitive peak forward current non-repetitive peak forward current total power dissipation tp 1 ms; 0.25 square wave; tp = 8 ms Tamb 25 C [2] [1] Min - Max 30 Unit V - 0.2 0.2 2.6 2.75 385 695 1045 A A A A mW mW mW [3][4] [3][5] [3][1] PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 2 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier Table 5. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Tj Tamb Tstg [1] [2] [3] [4] [5] Parameter junction temperature ambient temperature storage temperature Conditions Min -55 -65 Max 150 +150 +150 Unit C C C Device mounted on a ceramic PCB, Al2O3, standard footprint. Tj = 25 C prior to surge. Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 6. Thermal characteristics Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1][2] [3] [4] [5] Min - Typ - Max 325 180 120 25 Unit K/W K/W K/W K/W Rth(j-sp) [1] [2] [3] [4] [5] [6] thermal resistance from junction to solder point [6] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint. Soldering point of cathode tab. PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 3 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 103 duty cycle = Zth(j-a) (K/W) 102 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 10 0.02 006aab476 0.01 0 1 10-5 10-4 10-3 10-2 10-1 102 tp (s) 103 1 10 FR4 PCB, standard footprint Fig 1. 103 Zth(j-a) (K/W) 102 Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab477 duty cycle = 1 0.75 0.5 0.33 0.25 0.1 0.2 10 0.02 0 1 10-5 0.05 0.01 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103 FR4 PCB, mounting pad for cathode 1 cm2 Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 4 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 103 Zth(j-a) (K/W) 102 006aab478 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.05 0.02 0 0.01 10 0.1 1 10-5 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103 Ceramic PCB, Al2O3, standard footprint Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol VF Parameter forward voltage Conditions IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 100 mA IF = 200 mA IR Cd reverse current diode capacitance VR = 10 V VR = 30 V f = 1 MHz VR = 1 V VR = 10 V trr [1] Min [1] Typ 130 190 250 355 420 2.5 10 18 7 5 Max 190 250 300 400 480 10 40 - Unit mV mV mV mV mV A A pF pF ns reverse recovery time - When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA. PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 5 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 1 IF (A) 10-1 (1) (2) 006aab497 10-2 IR (A) 10-3 10-4 10-5 006aab498 (1) (2) (3) 10-2 (3) (4) (5) 10-6 10-7 10-8 (4) 10-3 10-4 0 0.2 0.4 VF (V) 0.6 10-9 0 10 20 VR (V) 30 (1) Tj = 150 C (2) Tj = 125 C (3) Tj = 85 C (4) Tj = 25 C (5) Tj = -40 C (1) Tj = 125 C (2) Tj = 85 C (3) Tj = 25 C (4) Tj = -40 C Fig 4. Forward current as a function of forward voltage; typical values 35 Cd (pF) 30 25 20 15 10 5 0 0 10 Fig 5. Reverse current as a function of reverse voltage; typical values 006aab499 20 VR (V) 30 f = 1 MHz; Tamb = 25 C Fig 6. Diode capacitance as a function of reverse voltage; typical values PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 6 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 0.14 PF(AV) (W) 0.12 0.10 0.08 0.06 0.04 (1) 006aab500 (4) (3) 0.20 PR(AV) (W) 0.16 006aab501 (2) 0.12 (1) (2) 0.08 (3) (4) 0.04 0.02 0.0 0.0 0.0 0.1 0.2 IF(AV) (A) 0.3 0 10 20 VR (V) 30 Tj = 150 C (1) = 0.1 (2) = 0.2 (3) = 0.5 (4) = 1 Tj = 125 C (1) = 1 (2) = 0.9 (3) = 0.8 (4) = 0.5 Fig 7. Average forward power dissipation as a function of average forward current; typical values 0.3 006aab502 Fig 8. Average reverse power dissipation as a function of reverse voltage; typical values 0.3 IF(AV) (A) 0.2 (1) 006aab503 IF(AV) (A) 0.2 (1) (2) (2) (3) (4) (3) (4) 0.1 0.1 0.0 0 25 50 75 100 125 150 175 Tamb (C) 0.0 0 25 50 75 100 125 150 175 Tamb (C) FR4 PCB, standard footprint Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz FR4 PCB, mounting pad for cathode 1 cm2 Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz Fig 9. Average forward current as a function of ambient temperature; typical values Fig 10. Average forward current as a function of ambient temperature; typical values (c) NXP B.V. 2009. All rights reserved. PMEG3002EJ_1 Product data sheet Rev. 01 -- 15 May 2009 7 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 0.3 IF(AV) (A) 0.2 (1) 006aab504 0.3 IF(AV) (A) 0.2 (1) 006aab505 (2) (2) (3) (4) (3) (4) 0.1 0.1 0.0 0 25 50 75 100 125 150 175 Tamb (C) 0.0 0 25 50 75 100 125 150 175 Tsp (C) Ceramic PCB, Al2O3, standard footprint Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz Fig 11. Average forward current as a function of ambient temperature; typical values Fig 12. Average forward current as a function of solder point temperature; typical values 8. Test information tr D.U.T. RS = 50 V = VR + IF x RS IF SAMPLING OSCILLOSCOPE Ri = 50 VR mga881 tp t 10 % + IF trr t 90 % input signal output signal (1) (1) IR = 1 mA Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle = 0.05 Oscilloscope: rise time tr = 0.35 ns Fig 13. Reverse recovery time test circuit and waveforms PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 8 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier P t2 t1 duty cycle = t1 t2 t 006aaa812 Fig 14. Duty cycle definition The current ratings for the typical waveforms as shown in Figure 9, 10, 11 and 12 are calculated according to the equations: I F ( AV ) = I M x with IM defined as peak current, I RMS = I F ( AV ) at DC, and I RMS = I M x with IRMS defined as RMS current. 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 1.35 1.15 1 0.5 0.3 0.80 0.65 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm 0.25 0.10 04-09-13 Fig 15. Package outline SOD323F (SC-90) PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 9 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 PMEG3002EJ SOD323F [1] 10000 -135 -115 For further information and the availability of packing methods, see Section 14. 11. Soldering 3.05 2.2 2.1 solder lands solder resist 1.65 0.95 0.5 (2x) 0.6 (2x) solder paste occupied area 0.5 (2x) 0.6 (2x) Dimensions in mm sod323f_fr Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering footprint SOD323F (SC-90) PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 10 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 12. Revision history Table 9. Revision history Release date 20090515 Data sheet status Product data sheet Change notice Supersedes Document ID PMEG3002EJ_1 PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 11 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PMEG3002EJ_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 May 2009 12 of 13 NXP Semiconductors PMEG3002EJ 200 mA low VF MEGA Schottky barrier rectifier 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information. . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 May 2009 Document identifier: PMEG3002EJ_1 |
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