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| Datasheet File OCR Text: |
| ZMD-Standard September 1997 Package SOP18 (300 mil) MDS 749 Dimensions in millimetres Based on JEDEC JEP95 MS-013 1 Dimensions X A2 A View X k x 45 0,1 18 LP A1 Z 1 e D b 0,2 M Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2,65 0,35 0,49 1,27 10,00 10,65 0,61 0,78 HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* 2,35 0,10 0,30 2,25 2,45 0,23 0,32 11,46 11,71 7,40 7,60 0,25 0 8 * without mold-flash 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,5 g Low Stress Epoxy Emin* Emax* kmin qmin qmax FeNi-Alloy or Cu-Alloy solder plating Z-bends Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check: signed Marx Date: 15.09.1997 Quality: signed Lorenz Doc-No. QS-000749-HD-01 c G |
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