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Si3440DV Vishay Siliconix N-Channel 150-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 150 RDS(on) () 0.375 at VGS = 10 V 0.400 at VGS = 6.0 V ID (A) 1.5 1.4 FEATURES * TrenchFET(R) Power MOSFET * PWM Optimized for Fast Switching In Small Footprint * 100 % Rg Tested RoHS COMPLIANT APPLICATIONS * Primary Side Switch for Low Power DC/DC Converters (1, 2, 5, 6) D TSOP-6 Top V iew 1 6 3 mm 2 5 (3) G 3 4 2.85 mm Ordering Information: Si3440DV-T1-E3 (Lead (Pb)-free) (4) S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 175 C)a Pulsed Drain Current Single Avalanche Current Single Avalanche Energy (Duty Cycle 1 %) Continuous Source Current (Diode Conduction) Maximum Power Dissipationa Operating Junction and Storage Temperature Range a Symbol VDS VGS TA = 25 C TA = 85 C ID IDM L = 0.1 mH IAS EAS IS TA = 25 C TA = 85 C PD TJ, Tstg 5s 150 Steady State 20 Unit V 1.5 1.1 6 4 0.8 1.7 2.0 1.0 - 55 to 150 1.2 0.8 A mJ 1.0 1.14 0.59 A W C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambienta Maximum Junction-to-Foot (Drain) Notes: a. Surface Mounted on 1" x 1" FR4 board. t5s Steady State Steady State Symbol RthJA RthJF Typical 45 90 25 Maximum 62.5 110 30 C/W Unit Document Number: 72380 S-82114-Rev. C, 08-Sep-08 www.vishay.com 1 Si3440DV Vishay Siliconix SPECIFICATIONS TJ = 25 C, unless otherwise noted Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltage Dynamicb Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = 1.7 A, dI/dt = 100 A/s VDD = 75 V, RL = 75 ID 1 A, VGEN = 10 V, RG = 6 f = 1 MHz 4 VDS = 75 V, VGS = 10 V, ID = 1.5 A 5.4 1.1 1.9 9 8 10 20 15 40 15 15 15 30 25 60 ns 8 nC a Symbol VGS(th) IGSS IDSS ID(on) RDS(on) gfs VSD Test Conditions VDS = VGS, ID = 250 A VDS = 0 V, VGS = 20 V VDS = 150 V, VGS = 0 V VDS = 150 V, VGS = 0 V, TJ = 85 C VDS 5 V, VGS = 10 V VGS = 10 V, ID = 1.5 A VGS = 6.0 V, ID = 1.4 A VDS = 15 V, ID = 1.5 A IS = 1.7 A, VGS = 0 V Min. 2 Typ. Max. 4 100 1 5 Unit V nA A A 4 0.310 0.330 4.1 0.8 1.2 0.375 0.400 S V Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 4.0 3.5 3.0 I D - Drain Current (A) 2.5 2.0 1.5 1.0 4V 0.5 3V 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.5 - 55 C 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VGS - Gate-to-Source Voltage (V) I D - Drain Current (A) VGS = 10 thru 5 V 3.5 3.0 2.5 2.0 1.5 1.0 TC = 125 C 25 C 4.0 VDS - Drain-to-Source Voltage (V) Output Characteristics Transfer Characteristics www.vishay.com 2 Document Number: 72380 S-82114-Rev. C, 08-Sep-08 Si3440DV Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 0.5 320 R DS(on) - On-Resistance () 0.4 C - Capacitance (pF) VGS = 6.0 V 0.3 VGS = 10 V 0.2 240 Ciss 160 80 0.1 Crss Coss 0.0 0 1 2 ID - Drain Current (A) 3 4 0 0 10 20 30 40 50 60 70 80 VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current 10 VDS = 75 V ID = 1.5 A 8 R DS(on) - On-Resistance 2.0 (Normalized) 2.5 VGS = 10 V ID = 1.5 A Capacitance VGS - Gate-to-Source Voltage (V) 6 1.5 4 1.0 2 0 0 1 2 3 4 5 6 Qg - Total Gate Charge (nC) 0.5 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (C) Gate Charge 10 1.0 On-Resistance vs. Junction Temperature R DS(on) - On-Resistance () 0.8 ID = 1.5 A 0.6 I S - Source Current (A) TJ = 150 C 0.4 TJ = 25 C 0.2 1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage Document Number: 72380 S-82114-Rev. C, 08-Sep-08 www.vishay.com 3 Si3440DV Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 0.8 30 25 ID = 250 A 20 0.0 Power (W) 0.4 VGS(th) Variance (V) 15 - 0.4 10 - 0.8 5 - 1.2 - 50 - 25 0 25 50 75 100 125 150 0 0.01 0.1 1 Time (s) 10 100 600 TJ - Temperature (C) Threshold Voltage 10 Limited by R DS(on)* 1 IDM Limited P(t) = 0.0001 Single Pulse Power I D - Drain Current (A) P(t) = 0.001 ID(on) Limited P(t) = 0.01 P(t) = 0.1 P(t) = 1 P(t) = 10 DC BVDSS Limited 0.001 0.1 1 10 100 1000 0.1 0.01 TA = 25 C Single Pulse VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Safe Operating Area 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 0.1 0.05 t1 PDM 0.02 Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 1 Square Wave Pulse Duration (s) t2 1. Duty Cycle, D = 2. Per Unit Base = R thJA = 90 C/W 3. T JM - TA = PDMZthJA(t) 4. Surface Mounted t1 t2 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Ambient www.vishay.com 4 Document Number: 72380 S-82114-Rev. C, 08-Sep-08 Si3440DV Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 Square Wave Pulse Duration (s) 1 10 Normalized Thermal Transient Impedance, Junction-to-Foot Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?72380. Document Number: 72380 S-82114-Rev. C, 08-Sep-08 www.vishay.com 5 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1 |
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