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SS8027G 3.3V 1A Low Dropout Regulator
FEATURES
Dropout voltage typically 0. 8V @ I O = 1A Output current in excess of 1A Output voltage accuracy 2% Quiescent current, typically 600A Internal short circuit current limit Internal over temperature protection
DESCRIPTION
The SS8027G positive 3.3V voltage regulator features the ability to source 1A of output current with a dropout voltage of typically 0.8V over the entire operating temperature range. A low quiescent current is provided over the entire output current range. The typical quiescent current is 0.6mA. Furthermore, quiescent current is reduced when the regulator is in the dropout mode (V IN < 3.3V). Familiar regulat or features such as over-temperature and over-current protection circuits are provided to prevent the device from being damaged by abnormal operating conditions.
APPLICATIONS
CD-R/W ADSL Cable Modem Set -Top-Box LAN switch/Hub Router DVD-R/W
Pb-free, RoHS compliant.
ORDERING INFORMATION
SS8027GTXXXX
Packing Type Pin Option Package Type PACKAGE TYPE
GT3 : TO 220 Pb-free GT4 : TO 252 Pb-free GT5 : TO 263 Pb-free GT6 : SOT 223 Pb-free
PIN OPTION
1 1 : V OUT 2 : V OUT 3 : GND 4 : GND 5 : V IN 6 : V IN 2 GND V IN VOUT V IN GND V OUT 3 V IN GND V IN V OUT V OUT GND
PACKING
TR : Tape & Reel TB : Tube
TYPICAL APPLICATION
PIN CONFIGURATION
IO VIN
SS8027G
C1 0.47F IQ
VOUT COUT 10F
Top View Top View Top View
1
2
3
1
2
3
1
2
3
TO-220
TO-252 and TO-263
SOT-223
5/26/2005 Rev.2.2
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SS8027G
Absolute Maximum Ratings
(Note 1) Input Voltage............................................................................................................................10V Power Dissipation Internally Limited . (Note 2) Maximum Junction Temperature................................................................................................150C Storage Temperature Range....................................................................................................-65C TJ +150C Lead Temperature, Time for Wave Soldering TO 220, TO 263 Pac kage........................................................................................................260C, 10s TO 252, SOT 223 Package.......................................................................................................260C, 4s Continuous Power Dissipation (TA = +25C) SOT 223(1) .............................................................................................................................0.8W TO 252(1) ...............................................................................................................................1.0W TO 263(1) ...............................................................................................................................1.6W TO 220(1) ...............................................................................................................................2.0W
Note (1): See Recommended Minimum Footprint
Operating Conditions
(Note 1) Input Voltage.........................................................................................................................4V~7V Temperature Range..................................................................................................................-40C TJ 125C
Electrical Characteristics
VIN =5V, IO = 1A, CIN = 1F, COUT =10F, All specifications apply for TA = TJ = 25C. [Note 3] PARAMETER
Output Voltage Line Regulation Load Regulation Output Impedance Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature
CONDITIONS
50mA < IO <1A 4V < V IN < 7V, IO = 10mA 50mA < IO < 1A 200mA DC and 100mA AC, fo = 120Hz V IN = 5V f i = 120Hz, 1V P-P , Io = 100mA IO = 1A IO = 100mA
MIN
3.234
TYP
3.3 20 30 100 0.6 42 0.8 200 1.9 125
MAX
3.366 30 50
UNITS
V mV mV m mA dB V mV A C
1.6
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / JA. If this dissipation is exceeded, the die temperature will rise above 150C and IC will go into thermal shutdown. For the SS8027G in the SOT-223 package, JA is 156C/W; in the TO-252 pac kage, JA is 125C/W; in the TO-263 package, JA is 75C/W, and in the TO-220 package, JA is 60C/W (no heat sink). [See Recommended Minimum Footprint] If the TO-220 package is used with a heat sink, JA is the sum of the package thermal resistance junction-to-case (JC) of 3C/W and the thermal resistance added by the heat sink and thermal interface.The thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the pac kage. The safe operation area of SOT-223, TO-252, TO-263 or TO-220 packages can be seen in "Typical Performance Characteristics" (Safe Operating Area). Note3: Low duty-cycle pulse techniques are used during test to maintain the junction temperature as close to ambient temperature as possible. Note4: The output capacitor should be a tantalum or aluminum type.
5/26/2005 Rev.2.2
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SS8027G
Definitions
Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques, so that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by u sing pulse techniques, so that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.
5/26/2005 Rev.2.2
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SS8027G
Typical Performance Characteristics
(V IN=5V, CIN=1F, COUT =10F, TA=25C, unless otherwise noted.)
Line Transient Load Transient
Ch1: Vout (offset=3.30V) Ch2: Vin (offset=5.0V) Iout=100mA
Ch1: Vout (offset=3.30V) Ch2: Iout (780mA/div)
Output Voltage vs. Load Current
3.380 1200
Dropout Voltage vs. Load Current
3.360
1000
Output Voltage (V)
3.340
Dropout Voltage (mV)
0 100 200 300 400 500 600 700 800 900 1000
800
3.320
600
3.300
400
3.280
200
3.260
0
0 100 200 300 400 500 600 700 800 900 1000
Load Current (mA)
Load Current (mA)
Ground Current vs. Load Current
2.2 2.0 1.8
Ground Current (mA)
1.6 1.4 1.2 1.0 0.8 0.6 0.4
0 100 200 300 400 500 600 700 800 900 1000
Load Current (mA)
5/26/2005 Rev.2.2
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SS8027G
Typical Performance Characteristics
(continued)
Safe Operating Area of SOT 223
1200 1100 1000 900 800 1.0
Maximum Power Dissipation of SOT 223
0.9 0.8 0.7
Maximum recommended output current TA =25C,Still Air 1oz Copper on SOT 223 Package Mounted on recommended mimimum footprint (R J A=156C/W) c
Power Dissipation (W)
Output Current (mA)
700 600 500 400 300 200 100 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2
TA=25 J TA=55 J TA=85 J
0.6 0.5 0.4 0.3 0.2 0.1 0.0
Still Air 1oz Copper on SOT 223 Package Mounted on recommend mimimum footprint (R J A=156C/W) c
1.4
1.6
1.8 2.0
2.2
2.4
2.6 2.8
3.0
3.2
25
35
45
55
65
75
85
95
105
115
125
Input-Output Voltage Differential VIN-VOUT (V) Note: VIN(max) <= 6.5V
Amibent Temperature T A (C)
Safe Operating Area of TO 252
1200 1100 1000 900 Output Current (mA)
TA=25 J
Maximum Power Dissipation of TO 252
1.2 1.1 1.0 0.9
Maximum recommended output current TA=25C,Still Air
700 600 500 400 300 200 100 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2
Power Dissipation (W)
800
TA=55 J TA=85 J
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
25 35 45 55 65 75 85 95 105 115 125
1oz Copper on TO 252 Package Mounted on recommended mimimum footprint (R J A=125C/W) c
Still Air 1oz Copper on TO 252 Package Mounted on recommend mimimum footprint (R J A=125C/W) c
Input-Output Voltaage Differential VIN-VOUT (V) Note: VIN(max) <= 6.5V
Amibent Temperature T A (C)
Safe Operating Area of TO 263
1200 1100 1000 900 1.4 1.8
Maximum Power Dissipation of TO 263
1.6
Maximum recommended output current TA=25C,Still Air
Output Current (mA)
700
TA=25 J
Power Dissipation (W)
800
1.2 1.0 0.8 0.6 0.4 0.2 0.0
600 500 400 300 200 100 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2
TA=55 J TA=85 J
1oz Copper on TO 263 Package Mounted on recommended mimimum footprint (R JA=75C/W) c
Still Air 1oz Copper on TO 263 Package Mounted on recommend mimimum footprint (R J A=75C/W) c
25
35
45
55
65
75
85
95
105
115
125
Input-Output Voltaage Differential VIN-VOUT (V) Note: VIN(max) <= 6.5V
Amibent Temperature T A ( ) J
5/26/2005 Rev.2.2
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SS8027G
Typical Performance Characteristics
(continued)
Safe Operating Area of TO 220
1200 1100 1000 900 2.4
Maximum Power Dissipation of TO 220
2.2 2.0 1.8 1.6
Maximum recommended output current
TA=25C,Still Air No Heat Sink
Output Current (mA)
800
Power Dissipation (W)
No Heat Sink
700 600 500 400 300 200 100 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2
TA=25 J TA=55 J TA=85 J
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0
25 35 45 55 65 75 85 95 105 115 125
Mounted on TO 220 recommended mimimum footprint, without heat sink (R cA=60C/W) J
Still Air 1oz Copper on TO 220 Package Mounted on recommend mimimum footprint (R c =60C/W) JA
Input-Output Voltaage Differential VIN-V OUT (V) Note: VIN(max) <= 6.5V
Amibent Temperature TA (C)
Recommended Minimum Footprint
5/26/2005 Rev.2.2
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SS8027G
Package Information
E A E1 E1 R F d D
D1
I
L
e b e1 b1
C A1
TO-220 (GT3) Package SYMBOLS
A A1 b b1 C D D1 d E E1 e e1 F I L
MILLIMETERS MIN
4.318 2.46 0.69 1.143 0.304 3.429 8.53 2.62 9.906 2.84 2.29 4.83 1.143 3.454 13.589
INCHES MAX
4.826 2.72 0.94 1.397 0.460 3.683 9.04 2.87 10.40 5.13 2.79 5.33 1.397 3.962 14.351
MIN
0.170 0.097 0.027 0.045 0.012 0.135 0.336 0.103 0.390 0.112 0.090 0.190 0.045 0.136 0.535
MAX
0.190 0.107 0.037 0.055 0.018 0.145 0.356 0.113 0.410 0.202 0.110 0.210 0.055 0.156 0.565
5/26/2005 Rev.2.2
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SS8027G
E A E1 L1 F
D
H
L2 b e1 e
A1 L3
C
TO-252 (GT4) Package
SYMBOL
A A1 b C D E E1 e e1 F L1 L2 L3 H
MILLIMETERS MIN.
2.19 0.89 0.64 0.46 5.97 6.35 5.21 2.26BSC 3.96 0.46 0.89 0.64 2.40 9.40 0 5.18 0.58 2.03 1.02 2.80 10.40 4 0.156 0.018 0.035 0.025 0.095 0.370 0
INCHES MAX.
2.38 1.27 0.89 0.58 6.22 6.73 5.46
MIN.
0.086 0.035 0.025 0.018 0.235 0.250 0.205 0.09BSC
MAX.
0.094 0.050 0.035 0.023 0.245 0.265 0.215 0.204 0.023 0.080 0.040 0.110 0.410 4
5/26/2005 Rev.2.2
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SS8027G
A D B1 C
1 3(4X )
H
E
L e e1 L2
13(4X)
A1 B
SOT-223 (GT6) Package SYMBOLS
A A1 B B1 C D E e e1 H L L2 a 0 6.70 0.90 MIN 0.06 BSC 10 0
MILLIMETERS MIN
1.55 0.02 0.60 2.90 0.24 6.30 3.30 2.30 BSC 4.60 BSC 7.30 0.264
INCHES MAX
1.80 0.12 0.80 3.10 0.32 6.70 3.70
MIN
0.061 0.0008 0.024 0.114 0.009 0.248 0.130 0.090 BSC 0.181 BSC
MAX
0.071 0.0047 0.031 0.122 0.013 0.264 0.146
0.287 0.036 MIN 0.0024 BSC 10
Package Orientation
Feed Direction TO-252 and TO-263 Package Orientation
Feed Direction SOT 223 Package Orientation
5/26/2005 Rev.2.2
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SS8027G
A E A1 L3
D
H C
L1
e L2 e1 b b1 A2
L
TO-263 (GT5) Package SYMBOLS
A A1 A2 b b1 C D E e e1 H L L1 L2 L3
MILLIMETERS MIN
4.30 1.22 2.45 0.69 1.22 0.36 8.64 9.70 2.29 4.83 14.60 4.70 1.20 2.24 1.40MAX
INCHES MAX
4.70 1.32 2.69 0.94 1.40 0.56 9.652 10.54 2.79 5.33 15.78 5.84 1.778 2.84
MIN
0.169 0.048 0.104 0.027 0.048 0.014 0.340 0.382 0.090 0.190 0.575 0.185 0.047 0.088 0.055MAX
MAX
0.185 0.055 0.106 0.037 0.055 0.022 0.380 0.415 0.110 0.210 0.625 0.230 0.070 0.111
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties.
5/26/2005 Rev.2.2
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