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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL DIGIT LED DISPLAY (0.56 lnch) Pb Lead-Free Parts LDD511/2SBI-XX-PF DATA SHEET DOC. NO REV. DATE : : QW0905-LDD511/2SBI-XX-PF A : 23 - Feb. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD511/2SBI-XX-PF Page 1/8 Package Dimensions 25.0(0.984") 8.1(0.319") DIG.1 14.2 (0.56") DIG.2 19.0 (0.748") 15.24 (0.6") LDD511/2SBI-XX-PF LIGITEK 1.7(0.067") O 0.51 TYP 2.54X8=20.32 (0.8") 4.50.5 PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD511/2SBI-XX-PF Page 2/8 Internal Circuit Diagram LDD511SBI-XX-PF 14 DIG.1 A B C D E F G DP DIG.2 A B C D E F G DP 13 16 15 3 2 1 18 17 4 11 10 8 6 5 12 7 9 LDD512SBI-XX-PF 14 DIG.1 A B C D E F G DP DIG.2 A B C D E F G DP 13 16 15 3 2 1 18 17 4 11 10 8 6 5 12 7 9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD511/2SBI-XX-PF Page 3/8 Electrical Connection PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 LDD511SBI-XX-PF Anode Anode Anode Anode Anode Anode Anode Anode Anode Anode Anode Anode E Dig.1 D Dig.1 C Dig.1 DP Dig.1 E Dig.2 D Dig.2 G Dig.2 C Dig.2 DP Dig.2 B Dig.2 A Dig.2 F Dig.2 PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 LDD512SBI-XX-PF Cathode Cathode Cathode Cathode Cathode Cathode Cathode Cathode Cathode Cathode Cathode Cathode E Dig.1 D Dig.1 C Dig.1 DP Dig.1 E Dig.2 D Dig.2 G Dig.2 C Dig.2 DP Dig.2 B Dig.2 A Dig.2 F Dig.2 Common Cathode Dig.2 Common Cathode Dig.1 Anode Anode Anode Anode B Dig.1 A Dig.1 G Dig.1 F Dig.1 Common Anode Dig.2 Common Anode Dig.1 Cathode Cathode Cathode Cathode B Dig.1 A Dig.1 G Dig.1 F Dig.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD511/2SBI-XX-PF Page 4/8 Absolute Maximum Ratings at Ta=25 Ratings Parameter Symbol SBI Forward Current Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF 30 mA mA UNIT IFP 70 PD Ir ESD Topr Tstg 120 50 500 -20 ~ +80 -25 ~ +85 mW A V Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 Static Electricity or power surge will the Use of anti-electrosatic *glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded. Part Selection And Application Information(Ratings at 25) Electrical Vf(v) Typ. Max. Iv(mcd) Min. Typ. IV-M PART NO common P D cathode (nm) (nm) (nm) Material Emitted or anode CHIP Common Cathode InGaN/SiC Bule 430 Common Anode 465 65 LDD511SBI-XX-PF 3.8 4.7 4.0 6.1 2:1 LDD512SBI-XX-PF Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD511/2SBI-XX-PF Page 5/8 Test Condition For Each Parameter Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Peak Wavelength Dominant Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Symbol Vf Iv Unit volt mcd nm nm nm Test Condition If=20mA If=10mA If=20mA If=20mA If=20mA Vr=5V P D Ir IV-M A LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD511/2SBI-XX-PF Page 6/8 Typical Electro-Optical Characteristics Curve SBI CHIP Fig.1 Forward current vs. Forward Voltage Forward Current(mA DC) 30 25 20 15 10 5 0 1 2 3 4 5 Fig.2 Relative Intensity vs. Wavelength 1.0 Relative Intensity(%) 0.5 0 380 430 480 530 580 630 680 Forward Voltage(V) Wavelength (nm) Fig.3 Relative Intensity vs. Forward Current 125 Relative Intensity(%) Relative Intensity 0 5 10 15 20 25 30 35 40 45 Forward Current (mA DC) 100 75 50 25 0 Fig.4 Relative Intensity vs. Lead Temperature 10 1 0 0 25 50 75 100 Lead Temperature () Fig.5 Forward Current vs. Ambient Temperature Forward Current (mA DC) 40 30 20 10 0 0 25 50 75 100 Ambient Temperature () LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD511/2SBI-XX-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350XC Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260XC 2.Wave Soldering Profile Dip Soldering Preheat: 120XC Max Preheat time: 60seconds Max Ramp-up 2XC/sec(max) Ramp-Down:-5XC/sec(max) Solder Bath:260XC Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260XC Temp(XC) 260XC3sec Max 260 5X/sec max 120 2X/sec max Preheat 60 Seconds Max 25 0 0 50 100 150 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD511/2SBI-XX-PF Page 8/8 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 5 2.RH=90 %~95 % 3.t=240hrs 2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 5 2.Dwell time= 10 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 5 2.Dwell time=5 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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