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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT AXIAL SERIES LED LAMPS
LVG9753
DATA SHEET
DOC. NO REV DATE
: :
QW0905-LVG9753 B
: 29 - May - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LVG9753 Page 1/6
Package Dimensions
14.6
1.25
1.2 3.50.5 0.55 12.7
2
1
1
2
Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0 -30 30
-60
60
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LVG9753 Page 2/6
Absolute Maximum Ratings at Ta=25
Absolute Maximum Ratings Parameter Symbol VG Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir Topr Tstg Tsol 30 120 100 10 -40 ~ +85 -40 ~ +100 Max 260 for 5 sec Max mA mA mW UNIT
A
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
MATERIAL
COLOR
Emitted Lens
Water Clear
Peak wave length
Spectral halfwidth
nm
Pnm
Forward voltage @20mA(V)
Luminous intensity
@20mA(mcd)
Viewing angle 2 1/2 (deg)
Typ. Max. Min. 565 30 4.2 5.2 38
Typ. 70 60
LVG9753
GaP
Green
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LVG9753 Page 3/6
Typical Electro-Optical Characteristics Curve
VG CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.5
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0
10 1.0
0.1 2.0 3.0 4.0 5.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0
0.9 0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LVG9753 Soldering Iron:
Basic spec is 5 sec when 260. If temperature is higher, time should be shorter(+10 -1sec). Power dissipation of iron should be smaller than 15W,and temperature should be controllable. Surface temperature of the device should be under 230 .
Page 4/6
Soldering heat
Soldering heat Max. 260 2455 within 5 sec Preheat
120 ~ 150
120 ~ 180 sec
Reflow Temp/Time
Temp. () 220
Rising +5/sec Cooling -5/sec
150 120
Preheat
60 ~ 120 sec
5sec
Time
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LVG9753 Precautions For Use: Storage time:
1.The operation of Temperatures and RH are : 5 ~35,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ~ 35,RH<60%, they should be treated at 605 fo r 15hrs.
Page 5/6
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value.
Circuit model A LED
Circuit model B LED
(A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. : LVG9753 Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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