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HSB83 Silicon Epitaxial Planar Diode for High Voltage Switching REJ03G0187-0200Z (Previous: ADE-208-489A) Rev.2.00 Mar.22.2004 Features * High reverse voltage. (VR = 250 V) * CMPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSB83 Laser Mark F7 Package Code CMPAK Pin Arrangement 3 2 1 (Top View) 1. NC 2. Anode 3. Cathode Rev.2.00, Mar.22.2004, page 1 of 4 HSB83 Absolute Maximum Ratings (Ta = 25C) Item Peak reverse voltage Reverse voltage Peak forward current Non-Repetitive peak forward surge current Average rectified current Junction temperature Storage temperature Note: 1. Value at duration of 10 ms. Symbol VRM VR IFM IFSM *1 IO Tj Tstg Value 300 250 300 2 100 125 -55 to +125 Unit V V mA A mA C C Electrical Characteristics (Ta = 25C) Item Forward voltage Reverse current Capacitance Reverse recovery time Symbol VF IR1 IR2 C trr Min -- -- -- -- -- Typ -- -- -- -- -- Max 1.2 0.2 100 3.0 100 Unit V A pF ns Test Condition IF = 100 mA VR = 250 V VR = 300 V VR = 0 V, f = 1 MHz IF = IR = 30 mA, Irr = 3 mA, RL = 100 Rev.2.00, Mar.22.2004, page 2 of 4 HSB83 Main Characteristics 10-2 10-3 10-6 10-5 10-6 10-7 10-8 10-9 10-10 Reverse current IR (A) 0 0.2 0.4 0.6 0.8 1.0 Forward current IF (A) 10-4 10-7 10-8 10-9 10-10 0 50 100 150 200 250 Forward voltage VF (V) Fig.1 Forward current vs. Forward voltage Reverse voltage VR (V) Fig.2 Reverse current vs. Reverse voltage f = 1MHz 10 Capacitance C (pF) 1.0 0.1 1.0 10 Reverse voltage VR (V) 100 Fig.3 Capacitance vs. Reverse voltage Rev.2.00, Mar.22.2004, page 3 of 4 HSB83 Package Dimensions As of January, 2003 Unit: mm 2.0 0.2 0.1 0.3 + 0.05 - (0.425) 0.16 - 0.06 + 0.1 (0.425) 1.25 0.1 2.1 0.3 0 - 0.1 0.1 0.3 + 0.05 - 0.1 0.3 + 0.05 - 1.3 0.2 (0.2) 0.9 0.1 (0.65) (0.65) Package Code JEDEC JEITA Mass (reference value) CMPAK -- Conforms 0.006 g Rev.2.00, Mar.22.2004, page 4 of 4 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. 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