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HD74UH4066
Analog Switch
REJ03D0204-0400Z (Previous ADE-205-022B (Z)) Rev.4.00 Feb.02.2004
Description
The HD74UH4066 is high-speed CMOS analog switch using silicon gate CMOS process. With CMOS low power dissipation, it provides high speed. The device has low ON resistance for good transfer characteristics and can take wide range of input voltage.
Features
* Encapsulated in very small 5pins package of 2.9 x 1.6 x 1.1 mm, the efficiency to mount on substrate is significantly improved. * The basic gate function is lined up as Renesas uni logic series. * Supplied on emboss taping for high-speed automatic mounting. * Electrical characteristics equivalent to the HD74HC4066 Supply voltage range: 2 to 6 V Operating temperature range: -40 to +85C * | IOH | = IOL = 2 mA (min) * Ordering Information
Part Name HD74UH4066EL Package Type MPAK-5 pin Package Code MPAK-5V Package Abbreviation - Taping Abbreviation (Quantity) EL (3,000 pcs/reel)
Rev.4.00, Feb.02.2004, page 1 of 8
HD74UH4066
Pin Arrangement
IN/OUT 1
5
VCC
OUT/IN 2
GND
3
4 Control
(Top view)
Article Indication
Marking Lot number
H
9
A
Absolute Maximum Ratings
Item Supply voltage Input voltage Output voltage Input diode current Output diode current Output current VCC/GND current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC, IGND PT Tstg Ratings -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 20 20 25 25 200 -65 to +150 Unit V V V mA mA mA mA mW C
Rev.4.00, Feb.02.2004, page 2 of 8
HD74UH4066
Recommended Operating Conditions
Item Supply voltage Input voltage Output voltage Operating temperature Input rise/fall time Symbol VCC VIN VOUT Topr tr, tf Ratings 2 to 6 0 to VCC 0 to VCC -40 to +85 0 to 1000 (VCC = 2.0 V) 0 to 500 (VCC = 4.5 V) 0 to 400 (VCC = 6.0 V) Unit V V V C ns
Electrical Characteristics
VCC Item Input voltage Symbol VIH (V) 2.0 4.5 6.0 VIL 2.0 4.5 6.0 On resistance RON 2.0 4.5 6.0 Leak current IS (off) IS (on) Input current Operating current IIN ICC 6.0 Ta = 25C Min 1.5 3.15 4.2 -- -- -- -- -- -- -- Typ -- -- -- -- -- -- Max -- -- -- 0.5 1.35 1.8 Ta = -40 to 85C Min 1.5 3.15 4.2 -- -- -- Max -- -- -- 0.5 1.35 1.8 6250 250 210 1.0 A VC = VIH VIN = 0 to VCC IIN/OUT = 1 mA VC = VIL VIN = VCC, VOUT = GND or VIN = GND, VOUT = VCC VC = VIH VIN = VCC or GND VIN = VCC or GND VIN = VCC or GND V Unit V Test Conditions
2000 5000 -- 100 60 -- 200 170 0.1 -- -- --
6.0 6.0 6.0
-- -- --
-- -- --
0.1 0.1 1.0
-- -- --
1.0 1.0 10.0
A A A
Rev.4.00, Feb.02.2004, page 3 of 8
HD74UH4066
Switching Characteristics
Ta = 25C Item Propagation delay time Symbol tPLH tPHL VCC 2.0 4.5 6.0 Output enable time tPZL tPZH 2.0 4.5 6.0 Output disable tLZ tHZ time 2.0 4.5 6.0 Maximum control frequency Control input capacitance Switch I/O capacitance Feed through capacitance Power dissipation capacitance tmax 2.0 4.5 6.0 CIN CIN/OUT CIN-OUT CPD -- -- -- -- Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- 4 -- -- 10 -- -- 14 -- 20 30 30 5 6 0.5 13 Max 50 10 9 115 23 20 115 23 20 -- -- -- 10 -- -- -- Ta = -40 to 85C Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 65 13 11 145 29 25 145 29 25 -- -- -- 10 -- -- -- pF pF pF pF MHz ns RL = 1 K ns RL = 1 K Unit ns Test Conditions RL = 10 K
Rev.4.00, Feb.02.2004, page 4 of 8
HD74UH4066
Test Circuit
RON
VCC VC =VIH VCC VIN =VCC (ON) GND VOUT RON =
VIN-OUT 10 -3
()
+
1.0 mA
--
V
VIN-OUT
IS (OFF), IS (ON)
VCC VC =VIL VCC A VIN =VCC or GND (OFF) GND VOUT =GND or VCC VIN =VCC or GND A VC =VIH VCC (ON) GND VOUT OPEN VCC
tPLH, tPHL
VCC VC =VIH VCC VIN (ON) GND RL= 10 k VOUT CL= 50 pF VOUT VIN tr 90% 50% t PLH 50% VOL tf VCC 10% t PHL GND VOH
Rev.4.00, Feb.02.2004, page 5 of 8
HD74UH4066 tZH, tZL / tHZ, tLZ
VCC
VC VCC GND
R L k =1 VC VOUT CL=50 pF RL =1 k S2
tr 90% 50% t ZH 50% VOUT
tf VCC 10% t HZ 90% VOH VOL GND
S1
VIN
t ZL 50%
t LZ 10%
VOH VOL
Item tZH tZL tHZ tLZ
S1 VCC GND VCC GND
S2 GND VCC GND VCC
Maximum control frequency
VCC VC VC VCC VIN =VCC GND VOUT RL= 1 k CL=15 pF VOUT VCC /2 VCC GND
Rev.4.00, Feb.02.2004, page 6 of 8
HD74UH4066 CIN/OUT, CIN-OUT
CIN-OUT
VC =GND
VCC
VCC (OFF) CIN/OUT GND CIN/OUT
Rev.4.00, Feb.02.2004, page 7 of 8
HD74UH4066
Package Dimensions
Unit: mm
1.9 0.2 0.95 0.95
0.16
+ 0.1 - 0.05
0.6
+ 0.2 0.6 1.6 - 0.1
5 - 0.4 - 0.05 2.9 0.2
0.3
+ 0.1
+ 0.2 1.1 - 0.1
2.8
+ 0.2 - 0.3
0 - 0.1
Package Code JEDEC JEITA Mass (reference value)
MPAK-5V -- -- 0.015 g
Rev.4.00, Feb.02.2004, page 8 of 8
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1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
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