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| DISCRETE SEMICONDUCTORS DATA SHEET PEMD13; PUMD13 NPN/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k Product specification Supersedes data of 2001 Feb 27 2003 Oct 08 Philips Semiconductors Product specification NPN/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k FEATURES * Built-in bias resistors * Simplified circuit design * Reduction of component count * Reduced pick and place costs. APPLICATIONS * Low current peripheral driver * Replacement of general purpose transistors in digital applications * Control of IC inputs. PEMD13; PUMD13 QUICK REFERENCE DATA SYMBOL VCEO IO TR1 TR2 R1 R2 PARAMETER collector-emitter voltage output current (DC) NPN PNP bias resistor bias resistor TYP. - - - - 4.7 47 MAX. 50 100 - - - - UNIT V mA - - k k DESCRIPTION NPN/PNP resistor-equipped transistors (see "Simplified outline, symbol and pinning" for package details). PRODUCT OVERVIEW TYPE NUMBER PEMD13 PUMD13 Note 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China. SIMPLIFIED OUTLINE, SYMBOL AND PINNING PINNING TYPE NUMBER PEMD13 PUMD13 6 5 4 R1 TR1 R2 1 Top view 2 3 1 2 3 MAM468 PACKAGE MARKING CODE PHILIPS SOT666 SOT363 SC-88 EIAJ Z1 3*1(1) PNP/PNP COMPLEMENT PEMB13 PUMB13 NPN/NPN COMPLEMENT PEMH13 PUMH13 SIMPLIFIED OUTLINE AND SYMBOL PIN 6 5 4 DESCRIPTION emitter TR1 base TR1 collector TR2 emitter TR2 base TR2 collector TR1 1 2 3 R2 TR2 R1 4 5 6 2003 Oct 08 2 Philips Semiconductors Product specification NPN/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PEMD13 PUMD13 - - DESCRIPTION plastic surface mounted package; 6 leads plastic surface mounted package; 6 leads PEMD13; PUMD13 VERSION SOT666 SOT363 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS - - - - - - - - - Tamb 25 C note 1 notes 1 and 2 - - -65 - -65 Tamb 25 C note 1 notes 1 and 2 - - 300 300 mW mW 200 200 +150 150 +150 mW mW C C C MIN. MAX. UNIT Per transistor; for the PNP transistor with negative polarity VCBO VCEO VEBO VI collector-base voltage collector-emitter voltage emitter-base voltage input voltage TR1 positive negative VI input voltage TR2 positive negative IO ICM Ptot output current (DC) peak collector current total power dissipation SOT363 SOT666 Tstg Tj Tamb Per device Ptot total power dissipation SOT363 SOT666 Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. storage temperature junction temperature operating ambient temperature +5 -30 100 100 V V mA mA +30 -5 V V open emitter open base open collector 50 50 10 V V V 2003 Oct 08 3 Philips Semiconductors Product specification NPN/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k THERMAL CHARACTERISTICS SYMBOL Per transistor Rth j-a thermal resistance from junction to ambient SOT363 SOT666 Per device Rth j-a thermal resistance from junction to ambient SOT363 SOT666 Notes Tamb 25 C note 1 notes 1 and 2 Tamb 25 C note 1 notes 1 and 2 PARAMETER CONDITIONS PEMD13; PUMD13 VALUE UNIT 625 625 K/W K/W 416 416 K/W K/W 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - - 100 - - 1.3 3.3 8 IE = ie = 0; VCB = 10 V; f = 1 MHz - - - - 2.5 3 pF pF TYP. - - - - - - 0.6 0.9 4.7 10 MAX. UNIT Per transistor; for the PNP transistor with negative polarity ICBO ICEO IEBO hFE VCEsat Vi(off) Vi(on) R1 R2 ------R1 Cc collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain collector-emitter saturation voltage input-off voltage input-on voltage input resistor resistor ratio collector capacitance TR1 (NPN) TR2 (PNP) VCB = 50 V; IE = 0 VCE = 30 V; IB = 0 VCE = 30 V; IB = 0; Tj = 150 C VEB = 5 V; IC = 0 VCE = 5 V; IC = 10 mA IC = 5 mA; IB = 0.25 mA IC = 100 A; VCE = 5 V IC = 5 mA; VCE = 0.3 V 100 1 50 170 - 100 0.5 - 6.1 12 mV V V k nA A A A 2003 Oct 08 4 Philips Semiconductors Product specification NPN/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k PACKAGE OUTLINES Plastic surface mounted package; 6 leads PEMD13; PUMD13 SOT666 D A E X S YS HE 6 5 4 pin 1 index A 1 e1 e 2 bp 3 wMA Lp detail X c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1 OUTLINE VERSION SOT666 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 01-01-04 01-08-27 2003 Oct 08 5 Philips Semiconductors Product specification NPN/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k PEMD13; PUMD13 Plastic surface mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC EIAJ SC-88 EUROPEAN PROJECTION ISSUE DATE 97-02-28 2003 Oct 08 6 Philips Semiconductors Product specification NPN/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development PEMD13; PUMD13 DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003 Oct 08 7 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R75/02/pp8 Date of release: 2003 Oct 08 Document order number: 9397 750 11863 |
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