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E2U0016-28-81
Semiconductor MSM7566/7567
Semiconductor Single Rail CODEC
This version: Aug. 1998 MSM7566/7567 Previous version: Nov. 1996
GENERAL DESCRIPTION
The MSM7566 and MSM7567 are single-channel CODEC CMOS ICs for voice signals ranging from 300 to 3400 Hz. These devices contain filter for A/D and D/A conversion. Designed especially for a single-power supply and low-power applications, these devices are optimized for telephone terminals in digital wireless systems. The MSM7566 and MSM7567 use newly-designed operational amplifiers to maintain small current deviations caused by power voltage fluctuations. The devices use the same transmission clocks as those used in the MSM7508B and MSM7509B. The analog output signal, which is of a differential type, directly drives a handset receiver.
FEATURES
* Single power supply: +2.7 V to +3.8 V * Low power consumption Operating mode: 15 mW Typ. 24 mW Max. VDD = 3.0 V Power save mode: 6 mW Typ. 18 mW Max. VDD = 3.0 V Power down mode: 0.03 mW Typ. 0.2 mW Max. VDD = 3.0 V * ITU-T Companding law MSM7566: m-law MSM7567: A-law * Transmission characteristics comply with ITU-T G.714 * Built-in PLL eliminates a master clock * Serial data rate: 64/128/256/512/1024/2048 kHz 96/192/384/768/1536/1544/200 kHz * Adjustable transmit gain * Adjustable receive gain * Built-in reference voltage supply * Built-in analog loop back test mode * Differential type analog output. Directly drives a piezoelectric type receiver equivalent to 1.2 kW +55 nF * Analog output amplifiers can operate in the power save mode * Pin-for-pin compatible with the MSM7541 and the MSM7542 * Package options: 20-pin plastic skinny DIP (DIP20-P-300-2.54-S1) (Product name : MSM7566RS) (Product name : MSM7567RS) 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name : MSM7566GS-K) (Product name : MSM7567GS-K) 26-pin plastic TSOP (TSOPII26/20-P-300-1.27-K) (Product name : MSM7566TS-K) (Product name : MSM7567TS-K)
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Semiconductor
MSM7566/7567
BLOCK DIAGRAM
AIN+ AIN-
+ -
RC Active
BPF (8th)
AD Conv. Auto Zero
Transmit Controller
PCMOUT XSYNC BCLOCK
GSX TMC
PLL
RTIM VFRO - + SG SG PWI AOUT- - + - + SG SG AOUT+ SG Voltage Ref. Signal Ground SGC SG
LPF (5th) Power Down
DA Conv. PWD Logic
Receive Controller
RSYNC PCMIN PDN VDD AG DG
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Semiconductor
MSM7566/7567
PIN CONFIGURATION (TOP VIEW)
SG 1 AOUT+ 2 AOUT- 3 PWI 4 VFRO 5 VDD 6 DG 7 PDN 8 RSYNC 9 PCMIN 10
20 SGC 19 AIN+ 18 AIN- 17 GSX 16 TMC 15 NC 14 AG
SG 1 AOUT+ 2 AOUT- 3 NC 4 PWI 5 VFRO 6 NC 7 VDD 8 DG 9 PDN 10 RSYNC 11
24 SGC 23 AIN+ 22 AIN- 21 GSX 20 NC 19 TMC 18 NC 17 NC 16 AG 15 BCLOCK 14 XSYNC
SG 1 AOUT+ 2 AOUT- 3 PWI 4 VFRO 5
26 SGC 25 AIN+ 24 AIN- 23 GSX 22 TMC
VDD 9 DG 10 PDN 11
18 NC 17 AG 16 BCLOCK 15 XSYNC 14 PCMOUT
13 BCLOCK PCMIN 12 12 XSYNC 11 PCMOUT
RSYNC 12 13 PCMOUT PCMIN 13
NC : No connect pin 24-Pin Plastic SOP
NC : No connect pin 26-Pin Plastic TSOP
NC : No connect pin 20-Pin Plastic Skinny DIP
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Semiconductor
MSM7566/7567
PIN AND FUNCTIONAL DESCRIPTIONS
AIN+, AIN-, GSX Transmit analog input and transmit level adjustment. AIN+ is a non-inverting input to the op-amp; AIN- is an inverting input to the op-amp; GSX is connected to the output of the op-amp and is used to adjust the level, as shown below. When not using AIN- and AIN+, connect AIN- to GSX and AIN+ to SG. During power saving and power down modes, the GSX output is at AG voltage.
1) Inverting input type C1 Analog input R1 GSX AIN- AIN+ SG R1 : variable R2 > 20 kW C1 > 1/(2 3.14 30 R1) Gain = R2/R1 10
R2
- +
2) Non inverting input type C2 Analog input R5 R4 R3 C3 SG AG AIN+ AIN- GSX + - R3 > 20 kW R4 > 20 kW R5 > 50 kW C2 > 1/ (2 3.14 30 R5) C3 : 10 to 20 pF Gain = 1 + R4 / R3 10
Note:
In the non-inverting input type, connect a 10 pF to 20 pF capacitor between the GSX pin and the AG pin as illustrated in the figure above. This prevents the generation of distortion during high power supply voltage and high level signal (+3 to -3dBm0) input. In the inverting input type, eliminate the capacitor.
AG Analog signal ground for digital signal circuits. This ground is separate from the digital signal ground (DG) in this device. The AG pin must be connected to the DG pin on the printed circuit board and then connected to the analog ground.
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Semiconductor VFRO
MSM7566/7567
Receive filter output. The output signal has an amplitude of 2.4 VPP above and below the signal ground voltage (SG) when the digital signal of +3 dBmO is input to PCMIN and can drive a load of 20 kW or more. For driving a load of 20 kW or less, connect a resistor of 20 kW or more should be connected between the pins VFRO and PWI. When adding the frequency characteristics to the receive signal, refer to the application example. During power saving mode, the output of VFRO is at the voltage level of SG. During power down mode, the output is in a high impedance state. PWI, AOUT+, AOUT- PWI is connected to the inverting input of the receive driver. The receive driver output is connected to the AOUT- pin. Therefore, the receive level can be adjusted with the pins VFRO, PWI, and AOUT-. When the PWI pin is not used, the PWI pin to the AOUT- pin, and leave open the pins AOUT- and AOUT+. The output of AOUT+ is inverted with respect to the output of AOUT-. Since the signal from which provides differential drive of an impedance of 1.2 kW +55 nF, these outputs can directly be connected to a receiver of handset using a piezoelectric earphone. Refer to the application example.
VI
Receive Filter
VFRO PWI
R6 R7
R6 > 20 kW ZL 2.4 kW Gain = VO/VI = 2 R7/R6 2 VO ZL
SG
- +
AOUT-
SG
- +
AOUT+
The other external signals can be output from AOUT+ and AOUT- during power saving, since these driver amplifiers are in the operational state. During power down mode, the output of AOUT+ and AOUT- is at the voltage level of SG through high impedance. The electrical driving capability of the AOUT- pin and AOUT+ pin is 1.3 V maximum. The output load resistor has a minimum value of 1.2 kW. If an output amplitude less than 1.3 V is allowed, these outputs can drive a load resistance less than that described above. For more details, refer to SINGLE POWER SUPPLY PCM CODEC APPLICATION NOTE. VDD Power supply for +2.7 V to +3.8 V. (Typically 3.0 V) PCMIN PCM signal input. A serial PCM signal input to this pin is converted to an analog signal in synchronization with the RSYNC signal and BCLOCK signal. The data rate of the PCM signal is equal to the frequency of the BCLOCK signal. The PCM signal is shifted at a falling edge of the BCLOCK signal and latched into the internal register when shifted by eight bits. The start of the PCM data (MSD) is identified at the rising edge of RSYNC. 5/19
Semiconductor BCLOCK
MSM7566/7567
Shift clock signal input for the PCMIN and PCMOUT signal. When the frequency of the SYNC pulse is at 8 kHz, the BCLOCK frequency, equal to the data rate, is 64, 96, 128, 192, 256, 384, 512, 768, 1024, 1536, 1544, 2048 or 200 kHz. Setting this signal to logic "1" or "0" drives both transmit and receive circuits to the power saving state. RSYNC Receive synchronizing signal input. Eight required bits are selected from serial PCM signals on the PCMIN pin by the receive synchronizing signal. Signals in the receive section are synchronized by this synchronizing signal. This signal must be synchronized in phase with the BCLOCK. The frequency should be 8 kHz 50 ppm to guarantee the AC characteristics which are mainly the frequency characteristics of the receive section. However, if the frequency characteristic of an applied system is not specified exactly, this device can operate in the range of 8 kHz 2 kHz, but the electrical characteristics in this specification are not guaranteed. Even if the RSYNC signal is not present, the device is not in power saving state. XSYNC Transmit synchronizing signal input. The PCM output signal from the PCMOUT pin is output in synchronization with this transmit synchronizing signal. This synchronizing signal triggers the PLL and synchronizes all timing signals of the transmit section. This synchronizing signal must be synchronized in phase with BCLOCK. The frequency should be 8 kHz 50 ppm to guarantee the AC characteristics which are mainly the frequency characteristics of the transmit section. However, if the frequency characteristic of an applied system is not specified exactly, this device can operate in the range of 8 kHz 2 kHz, but the electrical characteristics in this specification are not guaranteed. Setting this signal to logic "1" or "0" drives both transmit and receive circuits to the power saving state. TMC Control signal input for mode selection. This pin select the normal operating mode or the analog loop-back mode. In the analog loop-back mode, the receive filter output is connected to the transmit filter input and the digital signal input to the PCMIN pin is converted from a digital to an analog signal (D/ A conversion). Next, the analog signal is converted to a digital signal (A/D conversion) through the receive filter and transmit filter. The result is output to the PCMOUT pin. When in the analog loop-back mode, the VFRO pin outputs the SG level. (signal ground)
TMC Input < 0.16 VDD > 0.45 VDD
Mode Normal operation Analog loop-back
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Semiconductor DG
MSM7566/7567
Ground for the digital signal circuits. This ground is separate from the analog signal ground. The DG pin must be connected to the AG pin on the printed circuit board to make a common analog ground. PDN Power down control signal. A logic "0" level drives both transmit and receive circuits to a power down state. PCMOUT PCM signal output. The PCM output signal is output from MSD in a sequential order, synchronizing with the rising edge of the BCLOCK signal. MSD may be output at the rising edge of the XSYNC signal, based on the timing between BCLOCK and XSYNC. This pin is in a high impedance state except during 8-bit PCM output. It is also in a high impedance state during power saving or power down modes. A pull-up resistor must be connected to this pin because its output is configured as an open drain. This device is compatible with the ITU-T recommendation on coding law and output coding format. The MSM7567(A-law) outputs the character signal, inverting the even bits.
PCMIN/PCM OUT MSM7566 (m-law) MSD +Full scale +0 -0 -Full scale 1000 1111 0111 0000 0000 1111 1111 0000 MSD 1010 1101 0101 0010 1010 0101 0101 1010 MSM7567 (A-law)
Input/Output Level
SG Signal ground voltage output. The output voltage is 1/2 of the power supply voltage. The output drive current capability is 200 mA. This pin provides the SG level for CODEC peripherals. This output voltage level is undefined during power saving or power down modes. SGC Used to generate the signal ground voltage level by connecting a bypass capacitor. Connect a 0.1 mF capacitor with excellent high frequency characteristics between the AG pin and the SGC pin. During power saving and power down modes, the output of this pin is at the voltage level of SG with an output resistance of about 500 kW.
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Semiconductor
MSM7566/7567
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Analog Input Voltage Digital Input Voltage Storage Temperature Symbol VDD VAIN VDIN TSTG Condition
-- -- -- --
Rating 0 to 7 -0.3 to VDD + 0.3 -0.3 to VDD + 0.3 -55 to +150
Unit V V V C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature Analog Input Voltage Input High Voltage Input Low Voltage Symbol VDD Ta VAIN VIH VIL Condition Voltage must be fixed
--
Min. 2.7 -30 -- 0.45 VDD 0
Typ. 3.0 +25 -- -- --
Max. 3.8 +85 1.4 VDD 0.16 VDD
Unit V C VPP V V
Connect AIN- and GSX XSYNC, RSYNC, BCLOCK, PCMIN, PDN, TMC
64, 128, 256, 512, 1024, Clock Frequency Sync Pulse Frequency Clock Duty Ratio Digital Input Rise Time Digital Input Fall Time Transmit Sync Pulse Setting Time Receive Sync Pulse Setting Time Sync Pulse Width PCMIN Set-up Time PCMIN Hold Time Digital Output Load Analog Input Allowable DC Offset Allowable Jitter Width FC FS DC tIr tIf tXS tSX tRS tSR tWS tDS tDH RDL CDL Voff -- BCLOCK XSYNC, RSYNC BCLOCK XSYNC, RSYNC, BCLOCK, PCMIN, PDN, TMC
BCLOCKAEXSYNC, See Timing Diagram XSYNCAEBCLOCK, See Timing Diagram BCLOCKAERSYNC, See Timing Diagram RSYNCAEBCLOCK, See Timing Diagram
2048, 96, 192, 384, 768, 1536, 1544, 200 6.0 40 -- -- 100 100 100 100 1 BCLK 100 100 0.5 -- -100 -10 -- 8.0 50 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 10.0 60 50 50 -- -- -- -- 100 -- -- -- 100 +100 +10 1.0
kHz kHz % ns ns ns ns ns ns ms ns ns kW pF mV mV ms
XSYNC, RSYNC -- -- Pull-up resistor -- Transmit gain stage, Gain = 1 Transmit gain stage, Gain = 10 XSYNC, RSYNC, BCLOCK
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Semiconductor
MSM7566/7567
ELECTRICAL CHARACTERISTICS
DC and Digital Interface Characteristics
(VDD = 2.7 V to 3.8 V, Ta = -30C to +85C) Parameter Symbol IDD1 IDD4 Power Supply Current IDD2 IDD3 Input High Voltage Input Low Voltage High Level Input Leakage Current Low Level Input Leakage Current Digital Output Low Voltage Digital Output Leakage Current Input Capacitance VIH VIL IIH IIL VOL IO CIN Condition Operating mode VDD = 3.8 V VDD = 3.0 V Min. -- -- -- -- 0.45 VDD 0.0 -- -- 0.0 -- -- Typ. 13.0 5.0 2.0 0.01 -- -- -- -- 0.2 -- 5 Max. 17.0 8.0 6.0 0.05 VDD 0.16 VDD 2.0 0.5 0.4 10 -- Unit mA mA mA mA V V mA mA V mA pF
Power-save mode, PDN = 1, XSYNC or BCLOCK AE OFF Power-down mode, PDN = 0 -- -- -- -- Pull-up resistance > 500 W -- --
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Semiconductor Transmit Analog Interface Characteristics
MSM7566/7567
(VDD = 2.7 V to 3.8 V, Ta = -30C to +85C) Parameter Input Resistance Output Load Resistance Output Load Capacitance Output Amplitude Offset Voltage Symbol RINX RLGX CLGX VOGX VOSGX Gain = 1 Condition AIN+, AIN- GSX with respect to SG Min. 10 20 -- -0.7 -20 Typ. -- -- -- -- -- Max. -- -- 50 +0.7 +20 Unit MW kW pF V mV
Receive Analog Interface Characteristics
(VDD = 2.7 V to 3.8 V, Ta = -30C to +85C) Parameter Input Resistance Output Load Resistance Symbol RINPW PWI RLVF RLAO CLVF CLAO VOVF Output Amplitude VOAO VFRO with respect to SG AOUT+, AOUT- (each) with respect to SG VFRO AOUT+, AOUT- VFRO, RL = 20 kW with respect to SG AOUT+, AOUT-, RL = 1.2 kW with respect to SG AOUT+, AOUT-, Gain = 1 with respect to SG Condition Min. 10 20 1.2 -- -- -1.0 -1.3 -100 -100 Typ. -- -- -- -- -- -- -- -- -- Max. -- -- -- 100 50 +1.0 +1.3 +100 +100 Unit MW kW kW pF pF V V mV mV
Output Load Capacitance
VOSVF VFRO with respect to SG Offset Voltage VOSAO
10/19
Semiconductor AC Characteristics
MSM7566/7567
(VDD = 2.7 V to 3.8 V, Ta = -30C to +85C, SYNC = 8 kHz) Parameter Symbol Loss T1 Loss T2 Transmit Frequency Response Loss T3 Loss T4 Loss T5 Loss T6 Loss R1 Loss R2 Receive Frequency Response Loss R3 Loss R4 Loss R5 SD T1 SD T2 SD T3 Transmit Signal to Distortion Ratio SD T4 SD T5 SD R1 SD R2 SD R3 Receive Signal to Distortion Ratio SD R4 SD R5 GT T1 GT T2 Transmit Gain Tracking GT T3 GT T4 GT T5 GT R1 GT R2 Receive Gain Tracking GT R3 GT R4 GT R5 1020 1020 1020 1020 Freq. (Hz) 60 300 1020 2020 3000 3400 300 1020 2020 3000 3400 3 0 -30 -40 -45 3 0 -30 -40 -45 3 -10 -40 -50 -55 3 -10 -40 -50 -55 -0.3 -0.6 -1.2 -0.3 -0.6 -1.2 -0.3 *2 *1 *2 *2 *1 *2 0 -0.15 -0.15 0.0 35 35 35 29 24 36 36 36 30 25 -0.3 0 Level Condition (dBm0) Min. 20 -0.15 -0.15 -0.15 0 -0.15 Typ. 26 +0.1 Reference 0 +0.08 0.3 -0.07 Reference +0.03 +0.06 0.4 43 42 39 31.5 31.0 27.5 26 43 41 41 34.5 33.5 30.5 27.5 -0.03 Reference +0.10 +0.15 +0.20 0 Reference -0.15 -0.25 -0.35 +0.3 +0.6 +1.2 dB +0.3 +0.6 +1.2 +0.3 dB +0.20 +0.20 0.80 -- -- -- -- -- -- -- -- -- -- +0.3 dB dB +0.20 +0.20 0.80 +0.20 Max. -- +0.20 Unit dB dB dB dB dB dB dB dB dB dB dB
*1 Psophometric filter is used *2 Upper specified for the MSM7566, lower for the MSM7567
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Semiconductor AC Characteristics (Continued)
MSM7566/7567
(VDD = 2.7 V to 3.8 V, Ta = -30C to +85C, SYNC = 8 kHz) Parameter Symbol Nidle T Nidle R AV T Absolute Level (Initial Difference) AV R AV Tt AV Rt 1020 0 Freq. (Hz) -- -- Level Condition (dBm0) AIN = SG -- *1 -- *1 *3 VDD = 3.0 V Ta = 25C *4 VDD = 2.7 V to 3.8 V Ta = -30 to 85C *4 A to A Absolute Delay Td tgd T1 tgd T2 Transmit Group Delay tgd T3 tgd T4 tgd T5 tgd R1 tgd R2 Receive Group Delay tgd R3 tgd R4 tgd R5 Crosstalk Attenuation CR T CR R 1020 500 600 1000 2600 2800 500 600 1000 2600 2800 1020 0
TRANS AE RECV RECV AE TRANS
Min. -- -- 0.338 0.483 -0.2 -0.2
Typ. -73 -78 0.35 0.50 -- --
Max. -70 -75 0.362
Unit
Idle Channel Noise
dBmOp
Vrms 0.518 +0.2 +0.2 dB dB
Absolute Level (Deviation of Temperature and Power)
0
BCLOCK = 64 kHz *5
-- -- -- -- -- --
-- 0.19 0.11 0.02 0.05 0.07 0.00 0.00 0.00 0.09 0.12 79 82
0.60 0.75 0.35 0.125 0.125 0.75 0.75 0.35 0.125 0.125 0.75 -- --
ms
0
ms
*5 0
-- -- -- -- -- 75 75
ms
dB
*1 *2 *3 *4 *5
Psophometric filter is used Upper is specified for the MSM7566, lower for the MSM7567 Input "0" code to PCMIN AVR is defined at VFRO output Minimum value of the group delay distortion
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Semiconductor AC Characteristics (Continued)
MSM7566/7567
(VDD = 2.7 V to 3.8 V, Ta = -30C to +85C, SYNC = 8 kHz) Parameter Discrimination Out-of-band Spurious Intermodulation Distortion Symbol Freq. Level Condition (Hz) (dBm0) 4.6 kHz to 0 to DIS 0 72 kHz 4000 Hz S IMD 300 to 3400 fa = 470 fb = 320 1020 0 to 50 kHz 0 -4 4.6 kHz to 100 kHz 2fa - fb TMC = 1 D-to-D Mode Gain -- PSR T PSR R tSD Digital Output Delay Time tXD1 tXD2 tXD3 CL = 100 pF + 1 LSTTL 0 PCMIN to PCMOUT Power Supply Noise Rejection Ratio 50 mVPP *6 -- 50 50 50 50 30 -- -- -- -- -- 200 200 200 200 ns dB -1.0 -- +1.0 dB Min. 30 -- -- Typ. 32 -37.5 -52 Max. -- -35 -35 Unit dB dBmO dBmO
*6 The measurement under idle channel noise
13/19
Semiconductor
TIMING DIAGRAM
PCM Data Input/Output Timing
Transmit Timing BCLOCK
tXS XSYNC
PCMOUT
Receive Timing BCLOCK
tRS RSYNC
PCMIN
, ,
1 2 3 tSX tWS tXD1 tSD MSD D2 1 2 3 tSR tWS tDS MSD D2
MSM7566/7567
4
5
6
7
8
9
10
11
tXD2 D3
D4
D5
D6
D7
tXD3 D8
When tXS 1/2 * Fc, the Delay of the MSD bit is defined as tXD1. When tSX 1/2 * Fc, the Delay of the MSD bit is defined as tSD.
4
5
6
7
8
9
10
11
tDH D3 D4 D5 D6 D7 D8
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Semiconductor
MSM7566/7567
APPLICATION CIRCUIT
Analog interface Digital interface +3.0 V 0.1 mF Analog input 100 kW 20 kW AIN- GSX SG To AG 10 pF Analog output AOUT- PWI 20 kW or more VFRO 51 kW SGC 0.1 mF 0V +3.0 V 10 mF 0 to 10 W
+
MSM7566/7567 AIN+ PCMOUT XSYNC RSYNC BCLOCK PCMIN PDN TMC BCLOCK input PCM data input Power Down control input Analog loop-back control input PCM signal output 8 kHz SYNC signal input
AG 1 mF VDD
DG
FREQUENCY CHARACTERISTICS ADJUSTMENT CIRCUIT
Microphone amp M C1 C2 R2 GSX AIN+ SG AOUT+ R4 AOUT- PWI VFRO R3 R5 C3 Additional input signal C5 Receive frequency characteristic Adjustment determined with C3, C4, R3, R4. R1 AIN- Transmit frequency characteristic Adjustment determined with C1, C2, R1, R2.
C4
Note:
The additional input signal can be output from AOUT- and AOUT+, since the output of VFRO is unknown during power saving mode and the output of the AOUT- and AOUT+ is in the operational state. 15/19
Semiconductor
MSM7566/7567
RECOMMENDATIONS FOR ACTUAL DESIGN
* To assure proper electrical characteristics, use bypass capacitors with excellent high frequency characteristics for the power supply and keep them as close as possible to the device pins. * Connect the AG pin and the DG pin each other as close as possible. Connect to the system ground with low impedance. * Mount the device directly on the board when mounted on PCBs. Do not use IC sockets. If an IC socket is unavoidable, use the short lead type socket. * When mounted on a frame, use electro-magnetic shielding, if any electro-magnetic wave source such as power supply transformers surround the device. * Keep the voltage on the VDD pin not lower than -0.3 V even instantaneously to avoid latchup phenomenon when turning the power on. * Use a low noise (particularly, low level type of high frequency spike noise or pulse noise) power supply to avoid erroneous operation and the degradation of the characteristics of these devices.
16/19
Semiconductor
MSM7566/7567
PACKAGE DIMENSIONS
(Unit : mm)
DIP20-P-300-2.54-S1
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.49 TYP.
17/19
Semiconductor
MSM7566/7567
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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Semiconductor
MSM7566/7567
(Unit : mm)
TSOPII26/20-P-300-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.38 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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