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| NUF2230XV6 2 Line EMI Filter with ESD Protection This device is a 2 line EMI filter array for wireless applications. Greater than -30 dB attenuation is obtained at frequencies from 800 MHz to 900 MHz. It also offers ESD protection-clamping transients from static discharges. ESD protection is provided across all capacitors. Features http://onsemi.com Pin 6 D(2) Pin 5 GND Pin 4 O(2) * EMI Filtering and ESD Protection * Integration of 10 Discrete Components * Compliance with IEC61000-4-2 (Level 4) * SOT-563 Package * Moisture Sensitivity Level 1 * ESD Ratings: Machine Model = C * Human Body Model = 3B These are Pb-Free Devices > 8.0 kV (Contact) Pin 1 D(1) Pin 2 GND Pin 3 O(1) Benefits * Reduces EMI/RFI Emissions on a Data Line * Integrated Solution Offers Cost and Space Savings in a * * * * * * * SOT-563 Package Reduces Parasitic Inductances Which Offer a More "Ideal" Low Pass Filter Response Integrated Solution Improves System Reliability 6 1 MARKING DIAGRAM SOT-563 CASE 463A 1 23 M G G Applications EMI Filtering and ESD Protection for Data Lines Wireless Phones PDAs and Handheld Products Notebook Computers LCD Displays 23 = Specific Device Code M = Month Code G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device NUF2230XV6T1 Package SOT-563 Shipping 4000/Tape & Reel 4000/Tape & Reel NUF2230XV6T1G SOT-563 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2005 1 July, 2005 - Rev.3 Publication Order Number: NUF2230XV6/D NUF2230XV6 MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Parameter ESD Discharge IEC61000-4-2 Air Discharge Contact Discharge Steady-State Power per Resistor Steady-State Power per Package Operating Temperature Range Storage Temperature Range Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) PR PT TOP TSTG TL -40 to 85 -55 to 150 260 Symbol VPP 15 8.0 mW mW C C C Value Unit kV Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Resistance Capacitance (Notes 1 and 2) Cut-Off Frequency (Note 3) Symbol VRWM VBR IR RA Cd f3dB IR = 1.0 mA VRWM = 3.0 V IR = 20 mA VR = 2.5 V, f = 1.0 MHz Above this frequency, appreciable attenuation occurs 90 100 16 125 6.0 7.0 1.0 110 Test Conditions Min Typ Max 5.0 Unit V V mA W pF MHz 1. Measured at 25C, VR = 2.5 V, f = 1.0 MHz. 2. Total line capacitance is 2 times the Diode Capacitance (Cd). 3. 50 W source and 50 W load termination. http://onsemi.com 2 NUF2230XV6 0 -5 -10 S21 (dB) -15 -20 -25 -30 -35 1.E+06 NORMALIZED CAPACITANCE 1.E+07 1.E+08 FREQUENCY (Hz) 1.E+09 1.E+10 2 1.5 1 0.5 0 0 1 2 3 4 5 REVERSE VOLTAGE (V) Figure 1. Insertion Loss Characteristic (50 W Source and 50 W Lead Termination) Figure 2. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance, Cd @ 2.5 V) 110 108 106 RESISTANCE (W) 104 102 100 98 96 94 92 90 -40 -20 0 20 40 TEMPERATURE (C) 60 80 Figure 3. Typical Resistance over Temperature http://onsemi.com 3 NUF2230XV6 PACKAGE DIMENSIONS SOT-563, 6 LEAD CASE 463A-01 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN NOM MAX 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.5 BSC 0.10 0.20 0.30 1.50 1.60 1.70 INCHES NOM MAX 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 BSC 0.004 0.008 0.012 0.059 0.062 0.066 MIN 0.020 0.007 0.003 0.059 0.043 D -X- A L 4 6 5 1 2 3 E -Y- HE e b 6 PL 5 0.08 (0.003) C M XY DIM A b C D E e L HE SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.0 0.0394 1.35 0.0531 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 NUF2230XV6/D |
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