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RHR1K160
Data Sheet January 2000 File Number 4789
1A, 600V Hyperfast Diode
The RHR1K160 is a hyperfast diode with soft recovery characteristics (t rr < 25ns). It has half the recovery time of ultrafast diodes and is silicon nitride passivated ionimplanted epitaxial planar construction. This device is intended for use as freewheeling/clamping diodes and rectifiers in a variety of switching power supplies and other power switching applications. Its low stored charge and hyperfast soft recovery minimize ringing and electrical noise in many power switching circuits reducing power loss in the switching transistors. Formerly developmental type TA49185.
Features
* Hyperfast with Soft Recovery . . . . . . . . . . . . . . . . . . <25ns * Operating Temperature. . . . . . . . . . . . . . . . . . . . . . .150oC * Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .600V * Thermal Impedance SPICE Model * Thermal Impedance SABERTM Model * Avalanche Energy Rated * Planar Construction * Related Literature - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"
Ordering Information
PART NUMBER RHR1K160 PACKAGE MS-012AA BRAND RHR1K160
Applications
* Switching Power Supplies * Power Switching Circuits * General Purpose
NOTE: When ordering, use the entire part number. For ordering in tape and reel, add the suffix 96 to the part number, i.e. RHR1K16096.
Symbol
NC (1) ANODE (2) ANODE (3) NC (4) CATHODE (8) CATHODE (7) CATHODE (6) CATHODE (5)
Packaging
JEDEC MS-012AA
BRANDING DASH
5 1 2 3 4
Absolute Maximum Ratings
TA = 25oC, Unless Otherwise Specified RHR1K160 600 600 600 1 2 10 2.5 5 -55 to 150 300 260 UNITS V V V A A A W mJ oC
oC oC
Peak Repetitive Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VRRM Working Peak Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VRWM DC Blocking Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VR Average Rectified Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IF(AV) TA = 65oC Repetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IFRM Square Wave, 20kHz Nonrepetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IFSM Halfwave, 1 Phase, 60Hz Maximum Power Dissipation (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Avalanche Energy (See Figures 11 and 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAVL Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TSTG,TJ Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Tech brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
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1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 2000 SABERTM is a Copyright of Analogy, Inc.
RHR1K160
Electrical Specifications
SYMBOL VF IF = 1A IF = 1A, TA = 150oC IR VR = 600V VR = 600V, TA = 150oC trr ta tb QRR CJ RJA IF = 1A, dIF/dt = 200A/s IF = 1A, dIF/dt = 200A/s IF = 1A, dIF/dt = 200A/s IF = 1A, dIF/dt = 200A/s VR = 10V, IF = 0A Pad Area = 0.769 in2 (Note 1) Pad Area = 0.054 in2 (Note 2) (Figure 13) Pad Area = 0.0115 in2 (Note 2) (Figure 13) DEFINITIONS VF = Instantaneous forward voltage (pw = 300s, D = 2%). IR = Instantaneous reverse current. trr = Reverse recovery time (See Figure 10), summation of ta + tb . ta = Time to reach peak reverse current (See Figure 10). tb = Time from peak IRM to projected zero crossing of IRM based on a straight line from peak IRM through 25% of IRM (See Figure 10). Qrr = Reverse recovery charge. CJ = Junction Capacitance. RJA = Thermal resistance junction to ambient. pw = Pulse width. D = Duty cycle. NOTES: 1. Measured using FR-4 copper board at 3.2 seconds. 2. Measured using FR-4 copper board at 1000 seconds. TA = 25oC, Unless Otherwise Specified TEST CONDITION MIN TYP 10.5 5 20 10 MAX 2.1 1.7 100 500 25 50 177 217 UNITS V V A A ns ns ns nC pF
oC/W oC/W oC/W
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RHR1K160 Typical Performance Curves
10 IF, FORWARD CURRENT (A) IR, REVERSE CURRENT (A) 10 150oC 1 100oC 0.1
100oC 150oC 1 25oC
0.01
25oC
0.1
0.001 0 0.5 1 1.5 2 2.5 3 3.5 4 0 100 200 300 400 500 600 VF, FORWARD VOLTAGE (V) VR , REVERSE VOLTAGE (V)
FIGURE 1. FORWARD CURRENT vs FORWARD VOLTAGE
FIGURE 2. REVERSE CURRENT vs REVERSE VOLTAGE
20 TAA = 25C, dIF/dt = = 200A/ s T = 25o oC, dIF/dt 200A/s t, RECOVERY TIMES (ns) t, RECOVERY TIMES (ns) 16 tr 12 ta 8 tb 4
35 30
TA = 100oC, dIF/dt = 200A/s trr
25 20 15 10 5 ta tb
0 0.1
0.5 IF, FORWARD CURRENT (A)
1
0 0.1
0.5 IF, FORWARD CURRENT (A)
1
FIGURE 3. trr, ta AND tb CURVES vs FORWARD CURRENT
FIGURE 4. trr, ta AND tb CURVES vs FORWARD CURRENT
50
IF(AV), AVERAGE FORWARD CURRENT (A)
TA = 150oC, dIF/dt = 200A/s
1.0 DC 0.8 SQ. WAVE 0.6
RJA = 50oC/W
t, RECOVERY TIMES (ns)
40 trr 30 tb 20 ta
0.4
10
0.2
0 0.1
0.5 IF, FORWARD CURRENT (A)
1
0 25
50
75
100
125
150
TA, AMBIENT TEMPERATURE (oC)
FIGURE 5. trr, ta AND tb CURVES vs FORWARD CURRENT
FIGURE 6. CURRENT DERATING CURVE
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RHR1K160 Typical Performance Curves
50 CJ , JUNCTION CAPACITANCE (pF)
(Continued)
40
30
20
10
0
0
20
40
60
80
100
VR , REVERSE VOLTAGE (V)
FIGURE 7. JUNCTION CAPACITANCE vs REVERSE VOLTAGE
10 DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 PDM 0.1
RJA = 50oC/W
THERMAL IMPEDANCE
ZJA, NORMALIZED
1
t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJA x RJA + TA 10-3 10-2 10-1 100 101 102 103
SINGLE PULSE 0.01 10-5 10-4
t, RECTANGULAR PULSE DURATION (s)
FIGURE 8. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
Test Circuits and Waveforms
VGE AMPLITUDE AND RG CONTROL dIF/dt t1 AND t2 CONTROL IF L
DUT RG
CURRENT SENSE + VDD 0 IF
dIF dt ta
trr tb
IGBT VGE t1 t2
-
0.25 IRM IRM
FIGURE 9. trr TEST CIRCUIT
FIGURE 10. trr WAVEFORMS AND DEFINITIONS
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RHR1K160 Test Circuits and Waveforms
L = 20mH R < 0.1 EAVL = 1/2LI2 [VR(AVL) /(VR(AVL) - VDD)] Q1 = IGBT (BVCES > DUT VR(AVL))
(Continued)
L CURRENT SENSE Q1
R VAVL + VDD IL IL
DUT VDD -
IV
t0
t1
t2
t
FIGURE 11. AVALANCHE ENERGY TEST CIRCUIT
FIGURE 12. AVALANCHE CURRENT AND VOLTAGE WAVEFORMS
Thermal Resistance vs Mounting Pad Area
The maximum rated junction temperature, TJM, and the thermal resistance of the heat dissipating path determines the maximum allowable device power dissipation, PDM, in an application. Therefore the application's ambient temperature, TA (oC), and thermal resistance RJA (oC/W) must be reviewed to ensure that TJM is never exceeded. Equation 1 mathematically represents the relationship and serves as the basis for establishing the rating of the part.
( T JM - T A ) P DM = ---------------------------Z JA (EQ. 1)
junction temperature or power dissipation. Pulse applications can be evaluated using the Intersil device Spice thermal model or manually utilizing the normalized maximum transient thermal impedance curve.
350 RJA = 101.6 - 25.82 x ln(AREA) JUNCTION TO AMBIENT (oC/W) RJA, THERMAL IMPEDANCE 300 250 200 217oC/W - 0.0123in2 150 100 50 0.001 177oC/W - 0.054in2
In using surface mount devices such as the SO-8 package, the environment in which it is applied will have a significant influence on the part's current and maximum power dissipation ratings. Precise determination of the PDM is complex and influenced by many factors: 1. Mounting pad area onto which the device is attached and whether there is copper on one side or both sides of the board. 2. The number of copper layers and the thickness of the board. 3. The use of external heat sinks. 4. The use of thermal vias. 5. Air flow and board orientation. 6. For non steady state applications, the pulse width, the duty cycle and the transient thermal response of the part, the board and the environment they are in. Intersil provides thermal information to assist the designer's preliminary application evaluation. Figure 13 defines the RJA for the device as a function of the top copper (component side) area. This is for a horizontally positioned FR-4 board with 2 oz. copper after 1000 seconds of steady state power with no air flow. This graph provides the necessary information for calculation of the steady state 3-5
0.01
0.1
1.0
CATHODE MOUNTING AREA, TOP COPPER AREA (in2)
FIGURE 13. THERMAL RESISTANCE vs MOUNTING PAD AREA
Displayed on the curve are RJA values listed in the Electrical Specifications table. These points were chosen to depict the compromise between the copper board area, the thermal resistance and ultimately the power dissipation, PDM. Thermal resistances corresponding to other component side copper areas can be obtained from Figure 13 or by calculation using Equation 2. The area, in square inches is the top copper area including the cathode pad area.
R JA = 101.6 - 25.82 x
ln ( Area )
(EQ. 2)
RHR1K160
The transient thermal impedance (ZJA) is also effected by various top copper board areas. Figure 14 shows the effect of copper pad area on the single pulse transient thermal impedance. Each trace represents a copper pad area in square inches corresponding to the descending list in the graph. Spice and SABER thermal models are provided for each of the listed pad areas. Copper pad area has no perceivable effect on transient thermal impedance for pulse widths less than 100ms. For pulse widths less than 100ms the transient thermal impedance is determined by the die and package. Therefore, CTHERM1 through CTHERM5 and RTHERM1 through RTHERM4 remain constant for each of the thermal models. A listing of the model component values is available in Table 1.
150
IMPEDANCE (oC/W)
ZJA, THERMAL
COPPER BOARD AREA - DESCENDING ORDER 0.049 in2 0.296 in2 0.523 in2 100 0.769 in2 1.000 in2
50
0 10-1
100
101 t, RECTANGULAR PULSE DURATION (s)
102
103
FIGURE 14. TRANSIENT THERMAL IMPEDANCE vs MOUNTING PAD AREA
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RHR1K160 SPICE Thermal Model
REV August 1998 RHR1K160 Copper Area = 0.769 in2 CTHERM1 th 8 5e-6 CTHERM2 8 7 2.5e-5 CTHERM3 7 6 1.2e-4 CTHERM4 6 5 4.5e-4 CTHERM5 5 4 9e-3 CTHERM6 4 3 4.5e-2 CTHERM7 3 2 3.5e-1 CTHERM8 2 tl 2 RTHERM1 th 8 4e-2 RTHERM2 8 7 1.6e-1 RTHERM3 7 6 1 RTHERM4 6 5 3.2 RTHERM5 5 4 6 RTHERM6 4 3 19 RTHERM7 3 2 25 RTHERM8 2 tl 36
th JUNCTION
RTHERM1 8
CTHERM1
RTHERM2 7
CTHERM2
RTHERM3 6
CTHERM3
RTHERM4 5
CTHERM4
SABER Thermal Model
Copper Area = 0.769 in2 template thermal_model th tl thermal_c th, tl { ctherm.ctherm1 th 8 = 5e-6 ctherm.ctherm2 8 7 = 2.5e-5 ctherm.ctherm3 7 6 = 1.2e-4 ctherm.ctherm4 6 5 = 4.5e-4 ctherm.ctherm5 5 4 = 9e-3 ctherm.ctherm6 4 3 = 4.5e-2 ctherm.ctherm7 3 2 = 3.5e-1 ctherm.ctherm8 2 tl = 2 rtherm.rtherm1 th 8 = 4e-2 rtherm.rtherm2 8 7 = 1.6e-1 rtherm.rtherm3 7 6 = 1 rtherm.rtherm4 6 5 = 3.2 rtherm.rtherm5 5 4 = 6 rtherm.rtherm6 4 3 = 19 rtherm.rtherm7 3 2 = 25 rtherm.rtherm8 2 tl = 36 } TABLE 1. THERMAL MODELS COMPONENT CTHERM6 CTHERM7 CTHERM8 RTHERM5 RTHERM6 RTHERM7 RTHERM8 0.049 in2 5e-2 2.5e-1 1 5 22 60 55 0.296 in2 4.5e-2 3.5e-1 2 6 19 32 49 0.523 in2 4.5e-2 3.5e-1 2 6 19 25 42
RTHERM5 4
CTHERM5
RTHERM6 3
CTHERM6
RTHERM7 2
CTHERM7
RTHERM8
CTHERM8
tl
AMBIENT
0.769 in2 4.5e-2 3.5e-1 2 6 19 25 36
1.0 in2 4.5e-2 3.5e-1 2 7 19 23 28
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com 3-7
RHR1K160 MS-012AA
8 LEAD JEDEC MS-012AA SMALL OUTLINE PLASTIC PACKAGE
E E1 1 e 2 A A1
INCHES SYMBOL A A1 b c MIN 0.0532 0.004 0.013 0.0075 0.189 0.2284 0.1497 MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.244 0.1574
MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 5.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 6.20 4.00 NOTES 2 3 4
D 6
D
b
E E1 e H
5
h x 45o
0.050 BSC 0.0099 0.016 0.0196 0.050
1.27 BSC 0.25 0.40 0.50 1.27
c
L
L 0.060 1.52 0o-8o
0.004 IN 0.10 mm
0.050 1.27 0.024 0.6
0.155 4.0 0.275 7.0 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE-MOUNTED APPLICATIONS
NOTES: 1. All dimensions are within allowable dimensions of Rev. C of JEDEC MS-012AA outline dated 5-90. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.006 inches (0.15mm) per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.010 inches (0.25mm) per side. 4. "L" is the length of terminal for soldering. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. Controlling dimension: Millimeter. 7. Revision 8 dated 5-99.
1.5mm DIA. HOLE
4.0mm USER DIRECTION OF FEED 2.0mm 1.75mm C L
MS-012AA
12mm TAPE AND REEL
12mm
8.0mm
40mm MIN. ACCESS HOLE 18.4mm COVER TAPE 13mm 330mm 50mm
GENERAL INFORMATION 1. 2500 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
12.4mm
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