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 DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, 2 columns
M3D116
BYW54 to BYW56 Controlled avalanche rectifiers
Product specification Supersedes data of 1996 Jun 11 1996 Oct 03
Philips Semiconductors
Product specification
Controlled avalanche rectifiers
FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Guaranteed avalanche energy absorption capability * Available in ammo-pack. DESCRIPTION Rugged glass package, using a high temperature alloyed construction.
BYW54 to BYW56
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
2/3 page k (Datasheet)
a
MAM047
Fig.1 Simplified outline (SOD57) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYW54 BYW55 BYW56 VRWM crest working reverse voltage BYW54 BYW55 BYW56 VR continuous reverse voltage BYW54 BYW55 BYW56 IF(AV) average forward current Ttp = 45 C; lead length = 10 mm; averaged over any 20 ms period; see Figs 2 and 4 Tamb = 80 C; PCB mounting (see Fig.9); averaged over any 20 ms period; see Figs 3 and 4 IFSM ERSM Tstg Tj non-repetitive peak forward current non-repetitive peak reverse avalanche energy storage temperature junction temperature see Fig.5 t = 10 ms half sinewave L = 120 mH; Tj = Tj max prior to surge; inductive load switched off - - - - 600 800 1000 2.0 V V V A - - - 600 800 1000 V V V PARAMETER repetitive peak reverse voltage - - - 600 800 1000 V V V CONDITIONS MIN. MAX. UNIT
-
0.8
A
- - -65 -65
50 20 +175 +175
A mJ C C
1996 Oct 03
2
Philips Semiconductors
Product specification
Controlled avalanche rectifiers
ELECTRICAL CHARACTERISTICS Tj = 25 C; unless otherwise specified. SYMBOL VF V(BR)R PARAMETER forward voltage reverse avalanche breakdown voltage BYW54 BYW55 BYW56 IR reverse current VR = VRRMmax; see Fig.7 VR = VRRMmax; Tj = 165 C; see Fig.7 trr reverse recovery time when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig.10 VR = 0 V; f = 1 MHz; see Fig.8 CONDITIONS IF = 1 A; Tj = Tj max; see Fig.6 IF = 1 A; see Fig.6 IR = 0.1 mA 650 900 1100 - - - MIN. - -
BYW54 to BYW56
TYP. - -
MAX. 0.8 1.0 V V
UNIT
- - - - - 3
- - - 1 150 -
V V V A A s
Cd
diode capacitance
-
50
-
pF
THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 m, see Fig.9. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS lead length = 10 mm VALUE 46 100 UNIT K/W K/W
1996 Oct 03
3
Philips Semiconductors
Product specification
Controlled avalanche rectifiers
GRAPHICAL DATA
BYW54 to BYW56
handbook, halfpage
3
MBG044
handbook, halfpage
1.6
MBG054
IF(AV) (A) 2
IF(AV) (A) 1.2
0.8
1
0.4
0 0 40 80 120 160 200 Ttp (C)
0 0 40 80 120 200 160 Tamb (C)
a = 1.57; VR = VRRMmax; = 0.5; lead length 10 mm.
a = 1.57; VR = VRRMmax; = 0.5; device mounted as shown in Fig.9.
Fig.2
Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage).
Fig.3
Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage).
MGC745
handbook, halfpage
4
200
MBH387
P (W) 3 2.5 2 1.57 1.42 Tj (C)
2 a=3
100 54 55 56
1
0 0 1 2 IF(AV) (A) 3
0 0 400 800 VR (V) 1200
a = IF(RMS)/IF(AV); VR = VRRMmax; = 0.5.
Fig.4
Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current.
Solid line = VR. Dotted line = VRRM; = 0.5.
Fig.5
Maximum permissible junction temperature as a function of reverse voltage.
1996 Oct 03
4
Philips Semiconductors
Product specification
Controlled avalanche rectifiers
BYW54 to BYW56
MGC735
MGC734
handbook, halfpage
15
10 3 handbook, halfpage IR (A) 10
2
IF (A) 10
max 10
5 1
0 0 1 VF (V) 2
10 -1
0
40
80
120
160 Tj (oC)
200
Solid line: Tj = 25 C. Dotted line: Tj = Tj max.
VR = VRRMmax.
Fig.6
Forward current as a function of forward voltage; maximum values.
Fig.7
Reverse current as a function of junction temperature; maximum values.
10 2 handbook, halfpage
MBG031
handbook, halfpage
50 25
Cd (pF) 7 10 50
2 3 1 10 VR (V) 10 2
MGA200
1
f = 1 MHz; Tj = 25 C. Dimensions in mm.
Fig.8
Diode capacitance as a function of reverse voltage; typical values.
Fig.9 Device mounted on a printed-circuit board.
1996 Oct 03
5
Philips Semiconductors
Product specification
Controlled avalanche rectifiers
BYW54 to BYW56
handbook, full pagewidth
DUT +
IF (A) 0.5 1 t rr
10
25 V 50 0 0.25 0.5 IR (A) 1.0
t
MAM057
Input impedance oscilloscope: 1 M, 22 pF; tr 7 ns. Source impedance: 50 ; tr 15 ns.
Fig.10 Test circuit and reverse recovery time waveform and definition.
1996 Oct 03
6
Philips Semiconductors
Product specification
Controlled avalanche rectifiers
PACKAGE OUTLINE
BYW54 to BYW56
handbook, full pagewidth
k
a
0.81 max
3.81 max
28 min
4.57 max
28 min
MBC880
Dimensions in mm. The marking band indicates the cathode.
Fig.11 SOD57.
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1996 Oct 03
7


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