PART |
Description |
Maker |
MCC162-18IO1 MCC162-14IO1 MCD162-18IO1 MCD162-12IO |
Thyristor and Rectifiers Modules PC Board Connector; No. of Contacts:8; Pitch Spacing:3.96mm; No. of Rows:1; Mounting Type:PCB Thru-hole; Body Material:PA Polyamide (Nylon); Contact Thyristor Modules Thyristor/Diode Modules 300 A, 1400 V, SCR Thyristor Modules Thyristor/Diode Modules 晶闸管模块可控硅/二极管模 Thyristor Modules Thyristor/Diode Modules 300 A, 800 V, SCR Thyristor Modules Thyristor/Diode Modules 300 A, 1800 V, SCR
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IXYS[IXYS Corporation] IXYS, Corp.
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R6200230 R6202250 R6201050 R6201850 R6201040 R6200 |
500 A, 400 V, SILICON, RECTIFIER DIODE General Purpose Rectifier (300-500 Amperes Average 2400 Volts) 通用整流器(300-500安培平均2400伏特 300 A, 2200 V, SILICON, RECTIFIER DIODE HERMETIC SEALED PACKAGE-2 300 A, 1200 V, SILICON, RECTIFIER DIODE 300 A, 200 V, SILICON, RECTIFIER DIODE
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Powerex Power Semicondu... POWEREX INC Powerex, Inc. POWEREX[Powerex Power Semiconductors] Powerex Power Semiconductor...
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MDM RMDM-9SS1M-A30 RMDM-10P10PH001A-A174 RMDM-10P1 |
37 CONTACT(S), FEMALE, D MICROMINIATURE CONNECTOR, SOLDER, RECEPTACLE Micro-D Metal Shell - .050 Contact Spacing
|
ITT CANNON http:// ITT[ITT Industries]
|
PME271YA4220MR30 |
Capacitor, film, 2200 pF, /-20% Tol, -40/ 115C, Safety: Y2, 300 VAC, Lead Spacing=10.2 mm
|
Kemet Corporation
|
C4AQUBW5100A3JJ |
C4AQ, Film, Metallized Polypropylene, Automotive DC Link, 10 uF, 5%, 1,300 V, 70C, Lead Spacing = 37.5mm
|
Kemet Corporation
|
39-30-1039 39301039 39-30-5038 39-30-5037 39-30-60 |
MINI-FIT JR. VERT. HDR. ASSY. W/PEGS, WITH & W/O DRAIN HOLES (SINGLE ROW) Header; No. of Contacts:3; Pitch Spacing:0.165"; No. of Rows:1; Series:Mini-Fit Jr.; Body Material:Nylon 6/6 RoHS Compliant: Yes 3 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
|
Molex Electronics Ltd. Molex, Inc.
|
R413R32200000M |
R41, Film, Metallized Polypropylene, Safety, 0.22 uF, 20%, 1000 VDC, 300 VAC (Y2), 110C, Lead Spacing = 27.5mm
|
Kemet Corporation
|
ADM-2F2721010 ADM-2F2721012 ADM-2F2721013 ADM-2F27 |
Filter Add/Drop Module 200 GHz Spacing
|
JDS Uniphase Corporation
|
ICS-3XX-SMB-T |
IC SOCKET ROW SPACING TIN PLATED
|
Adam Technologies, Inc.
|
50011-8000 50011-8100 |
Crimp Socket Contact; Wire Size (AWG):30-24; Contact Current:2A; Contact Plating:Tin; Series:50011; Strip Length:2.1mm; Operating Temp. Min:-20 C; Pitch Spacing:2mm; Reel Quantity:10000; Voltage Rating:125V RoHS Compliant: Yes Crimp Socket Contact; Wire Size (AWG):30-24; Contact Plating:Tin; Series:50011; Strip Length:2.1mm; Operating Temp. Min:-20 C; Pitch Spacing:2mm; Voltage Rating:125V RoHS Compliant: Yes
|
MOLEX INC
|
MIKQ0-85PL2-G |
Microminiature Circular - .050 Contact Spacing
|
ITT Corporation
|
MDM-100SBS MDM-100PCBR MDM-15PBS MDM-100PBS MDM-15 |
The Micro Line - .050 Contact Spacing
|
ITT Industries
|
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